Thermal-control system of a media-streaming device and associated media-streaming devices
This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.
1. A thermal-control system, the thermal-control system comprising:
an antenna;
a first graphite sheet, the first graphite sheet fixed to a first interior surface of a first housing component
a first heat spreader, the first heat spreader separated from the first graphite sheet by an air gap; and
a first thermal interface material, the first thermal interface material located between the first heat spreader and a first integrated circuit device mounted to a first surface of a printed circuit board;
a second graphite sheet, the second graphite sheet fixed to a second interior surface of a second housing component, wherein:
the second housing component joins with the first housing component to form a housing;
a second heat spreader, the second heat spreader separated from the second graphite sheet by a second air gap; and
a second thermal interface material, the second thermal interface material located between the second heat spreader and a second integrated circuit device that is mounted to a second surface of the printed circuit board, the second surface of the printed circuit board opposite the first surface.
2. The thermal-control system of claim 1 , wherein the first heat spreader includes a recess forming a cavity and wherein the cavity has an opening facing the first graphite sheet.
3. The thermal-control system of claim 1 , wherein the first graphite sheet includes a layer of one or more films that include a graphite material, a pressure-sensitive adhesive material, or a polyethylene terephthalate material.
4. The thermal-control system of claim 1 , wherein the first graphite sheet is formed around an antenna area wherein the antenna area of the first housing component allows for the antenna to transmit and receive wireless communications without interference from the first graphite sheet.
5. The thermal-control system of claim 1 , wherein the first heat spreader is integrated as part of an electromagnetic interference shield structure surrounding the first integrated circuit device and wherein the first integrated circuit device is a system-on-chip integrated circuit device.
6. The thermal-control system of claim 5 , wherein a thermally conductive foam is formed between the first heat spreader and the electromagnetic interference shield structure.
7. The thermal-control system of claim 1 , wherein the first interior surface of the first housing component is a concave interior surface.
8. The thermal-control system of claim 7 , wherein the second interior surface of the second housing component is a second concave interior surface.
9. The thermal-control system of claim 1 , wherein the second graphite sheet has a footprint that excludes a structural area of a device and enables assembling the second housing component to the first housing component without interference from hardware.
10. The thermal-control system of claim 1 , wherein the second graphite sheet includes a layer of one or more films, the one or more films including a graphite material, a pressure-sensitive adhesive material, or a polyethylene terephthalate material.
11. The thermal-control system of claim 1 , wherein the air gap and the second air gap are asymmetrical.
12. The thermal-control system of claim 1 , wherein the second heat spreader is integrated as part of a second electromagnetic interference shield structure.
13. The thermal-control system of claim 1 , wherein the second heat spreader includes an aluminum material that is approximately 0.20 millimeters thick.
14. The thermal-control system of claim 1 , wherein the second thermal interface material is located between the second heat spreader and the second integrated circuit device that is mounted to a second surface of the printed circuit board, the second surface of the printed circuit board opposite the first surface.
15. The thermal-control system of claim 1 , wherein a third thermal interface material is formed between the first heat spreader and the first graphite sheet.
16. The thermal-control system of claim 1 , wherein a third thermal interface material is formed between the second heat spreader and the second graphite sheet.
17. The thermal-control system of claim 1 , further comprising a high definition media interface (HDMI) connector and cable structure connected with the printed circuit board, wherein the thermal-control system is configured to hang from the HDMI connector and the cable structure.