Electrical arrangements for sensor assemblies in electromagnetic navigation systems

1. A system comprising:

a sensor assembly including:

a multilayer circuit including a proximal section, a distal section, and a longitudinal axis, the proximal section including a plurality of electrical pads,

a first magnetic field sensor coupled to the multilayer circuit at the distal section and having a primary sensing direction aligned with the longitudinal axis,

a second magnetic field sensor coupled to the multilayer circuit at the distal section and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis,

a housing surrounding the multilayer circuit, the first magnetic sensor, and the second magnetic sensor, the housing having a diameter of between 0.45 mm and 0.55 mm and a length of between 4 mm and 5 mm; and

wherein the multilayer circuit includes a flexible substrate layer, wherein a first subset of the plurality of electrical pads is positioned on a first major surface of the flexible substrate layer, and wherein a second subset of the plurality of electrical pads is positioned on a second major surface of the flexible substrate layer opposite the first major surface,

wherein the flexible substrate layer is disposed between the first subset of the plurality of electrical pads on the first major surface and the second subset of the plurality of electrical pads on the second major surface on an axis perpendicular to the flexible substrate.

2. The system of claim 1 , wherein the proximal section of the multilayer circuit is c-shaped.

3. The system of claim 1 , wherein the flexible substrate layer is only partially covered by a mask layer such that a portion of the flexible substrate layer is exposed.

4. The system of claim 1 , wherein the multilayer circuit includes six to nine electrical pads at the proximal section.

5. The system of claim 4 , further comprising:

a plurality of electrical leads, each electrically coupled to one of the plurality of electrical pads.

6. The system of claim 1 , further comprising:

a housing surrounding the multilayer circuit, the first magnetic sensor, and the second magnetic sensor.

7. The system of claim 6 , wherein the housing includes four quadrants of equal size, wherein at least one electrical lead is positioned within each of the four quadrants.

8. The system of claim 6 , wherein the housing is cylinder, polygon, or rectangular shaped.

9. The system of claim 6 , wherein the housing has a cross-section area of 0.096-0.79 mm 2 .

10. The system of claim 6 , wherein the housing comprises epoxy.

11. The system of claim 6 , wherein the housing comprises an outer shell and is at least partially filled with epoxy.

12. The system of claim 1 , further comprising:

a third magnetic field sensor coupled to the multilayer circuit at the distal section and oriented with respect to the first magnetic field sensor such that the third magnetic field sensor has a primary sensing direction orthogonal to the longitudinal axis.

13. The system of claim 1 , wherein the proximal section includes a first leg portion, a second leg portion, and a bend portion positioned between the first leg portion and the second leg portion.

14. The system of claim 13 , wherein a first subset of the plurality of electrical pads is positioned on the first leg portion, and wherein a second subset of the plurality of electrical pads is positioned on the second leg portion.

15. The system of claim 1 , wherein the first magnetic field sensor or the second magnetic field sensor is a multi-axis sensor and includes a second primary sensing direction.

16. The system of claim 1 , further comprising:

a medical device, wherein the sensor assembly is positioned within the medical device.