Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.
1. A method of manufacture of a stress-isolated microelectromechanical systems (MEMS) device, comprising:
providing a substrate having a first side and a second side opposite the first side;
etching a trench in the first side of the substrate;
forming a platform adjacent to and substantially surrounded by the trench; and
subsequent to etching the trench, forming a MEMS device on a surface of the platform opposite the first side of the substrate.
2. The method of claim 1 , wherein etching the trench comprises defining a plurality of tethers at locations configured to connect the platform to a periphery of the substrate.
3. The method of claim 1 , further comprising forming the MEMS device on the surface of the platform to include a movable sensing mass having a thickness of approximately 8 microns or greater.
4. The method of claim 1 , wherein forming the platform further comprises etching a cavity in the first side of the substrate prior to etching the trench, wherein the cavity laterally extends at least to the trench.
5. The method of claim 4 , further comprising:
etching the cavity to a first depth; and
etching the trench to a second depth greater than the first depth.
6. The method of claim 4 , wherein the substrate comprises a first substrate, and wherein the method further comprises, after etching the trench and after etching the cavity, bonding a second substrate to the first substrate, over the cavity and the trench, to form a sealed cavity.
7. The method of claim 6 , further comprising thinning the second substrate such that the stress-isolated MEMS device has a thickness of less than approximately 500 microns.
8. A method of forming a stress-isolated microelectromechanical systems (MEMS) device, comprising:
defining a suspended platform at least in part by backside etching a wafer, the backside etching defining a plurality of tethers positioned to connect the suspended platform to a peripheral region; and
subsequent to the backside etching, forming the MEMS device on a front side of the suspended platform.
9. The method of claim 8 , wherein backside etching the wafer comprises forming a trench in the wafer, and wherein the method further comprises forming a jumper spanning the trench and not aligned with any of the plurality of tethers.
10. The method of claim 9 , wherein forming the MEMS device comprises forming a movable sensing mass, and wherein forming the jumper comprises forming the jumper from a common layer with the movable sensing mass.
11. The method of claim 8 , wherein the wafer is a first wafer, and wherein the method comprises bonding the first wafer and a second wafer prior to backside etching the first wafer, removing the second wafer from the first wafer subsequent to backside etching the first wafer, and bonding the first wafer to a third wafer prior to forming the MEMS device on the front side of the suspended platform.
12. The method of claim 8 , wherein forming the stress-isolated MEMS device comprises defining a thickness of the MEMS device and of the wafer to be less than 500 microns total.
13. The method of claim 8 , wherein the wafer is a first wafer, and wherein the method further comprises bonding a cap wafer to the first wafer.
14. The method of claim 8 , wherein backside etching of the wafer comprising a first etch defining a cavity and a second etch defining a trench through a portion of the cavity.