Field effect transistor having a gate dielectric with a dipole layer and having a gate stressor layer
Field effect transistors having field effect transistors having gate dielectrics with dipole layers and having gate stressor layers, and methods of fabricating field effect transistors having gate dielectrics with dipole layers and having gate stressor layers, are described. In an example, an integrated circuit structure includes a semiconductor channel structure including a monocrystalline material. A gate dielectric is over the semiconductor channel structure, the gate dielectric including a high-k dielectric layer on a dipole material layer, and the dipole material layer distinct from the high-k dielectric layer. A gate electrode has a workfunction layer on the high-k dielectric layer, the workfunction layer including a metal. A first source or drain structure is at a first side of the gate electrode. A second source or drain structure is at a second side of the gate electrode opposite the first side.
1. An integrated circuit structure, comprising:
a semiconductor channel structure comprising a monocrystalline material;
a gate dielectric over the semiconductor channel structure, the gate dielectric comprising a high-k dielectric layer on a dipole material layer, the dipole material layer distinct from the high-k dielectric layer, the dipole material layer comprising a material selected from the group consisting of La 2 O 3 , Y 2 O 3 , MgO, SrO, Lu 2 O 3 , Al 2 O 3 and TiO 2 , and the high-k dielectric layer comprising hafnium and oxygen, wherein the dipole material layer is a U-shaped dipole material layer, wherein the gate dielectric further comprises an amorphous oxide layer between the dipole material layer and the semiconductor channel structure, and wherein the dipole material layer is in direct contact with the amorphous oxide layer;
a gate electrode having a workfunction layer on the high-k dielectric layer, the workfunction layer comprising a metal, and the gate electrode comprising a conductive fill material on the workfunction layer, the conductive fill material having an uppermost surface co-planar with an uppermost surface of the U-shaped dipole material layer, wherein the conductive fill material comprises a gate layer on the workfunction layer, and wherein (i) the gate electrode is an N-type gate electrode and the gate layer comprises Cr chromium (Cr), or wherein (ii) the gate electrode is a P-type gate electrode and the gate layer comprises tin (Sn);
a first source or drain structure at a first side of the gate electrode; and
a second source or drain structure at a second side of the gate electrode opposite the first side.
2. The integrated circuit structure of claim 1 , wherein the high-k dielectric layer is an HfO 2 layer.
3. The integrated circuit structure of claim 1 , wherein the dipole layer has a thickness in the range of 1-3 Angstroms.
4. The integrated circuit structure of claim 1 , wherein the gate electrode is the N-type gate electrode.
5. The integrated circuit structure of claim 1 , wherein the gate electrode is the P-type gate electrode.
6. The integrated circuit structure of claim 1 , wherein the amorphous oxide layer is an SiO 2 layer.
7. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a semiconductor channel structure comprising a monocrystalline material;
a gate dielectric over the semiconductor channel structure, the gate dielectric comprising a high-k dielectric layer on a dipole material layer, the dipole material layer distinct from the high-k dielectric layer, the dipole material layer comprising a material selected from the group consisting of La 2 O 3 , Y 2 O 3 , MgO, SrO, Lu 2 O 3 , Al 2 O 3 and TiO 2 , and the high-k dielectric layer comprising hafnium and oxygen, wherein the dipole material layer is a U-shaped dipole material layer, wherein the gate dielectric further comprises an amorphous oxide layer between the dipole material layer and the semiconductor channel structure, and wherein the dipole material layer is in direct contact with the amorphous oxide layer;
a gate electrode having a workfunction layer on the high-k dielectric layer, the workfunction layer comprising a metal, and the gate electrode comprising a conductive fill material on the workfunction layer, the conductive fill material having an uppermost surface co-planar with an uppermost surface of the U-shaped dipole material layer, wherein the conductive fill material comprises a gate layer on the workfunction layer, and wherein (i) the gate electrode is an N-type gate electrode and the gate layer comprises chromium (Cr), or wherein (ii) the gate electrode is a P-type gate electrode and the gate layer comprises tin (Sn);
a first source or drain structure at a first side of the gate electrode; and
a second source or drain structure at a second side of the gate electrode opposite the first side.
8. The computing device of claim 7 , further comprising:
a memory coupled to the board.
9. The computing device of claim 7 , further comprising:
a communication chip coupled to the board.
10. The computing device of claim 7 , further comprising:
a camera coupled to the board.
11. The computing device of claim 7 , further comprising:
a battery coupled to the board.
12. The computing device of claim 7 , further comprising:
an antenna coupled to the board.
13. The computing device of claim 7 , wherein the component is a packaged integrated circuit die.