IP Library Granted Patent US 11,989,413
Granted Patent B2
US 11,989,413 · App. 17/408,365 · Granted May 21, 2024

Method for using BMC as proxy NVMeoF discovery controller to provide NVM subsystems to host

Inventors: Sompong Paul Olarig (Pleasanton, CA); Son T. Pham (San Ramon, CA)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
G06F3/0607G06F3/061G06F3/0632G06F3/0655G06F3/0658G06F3/0679G06F3/0689G06F11/30G06F13/1668G06F13/4022G06F15/177H04L67/56G06F2206/1014
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Quick Facts
Patent No.
US 11,989,413
App. No.
17/408,365
Granted
May 21, 2024
Kind
B2
Abstract

A device that may communicate with at least one device is disclosed. The device may include a communication component to communicate with the devices over a channels about data associated with the devices. The device may also include reception component that may receive a request for information from a host. The device may also include a transmission component to send the data about the devices to the host.

Claims (29)

1. A device associated with a chassis, comprising:

a communication component configured to communicate with at least one other device over one or more channels about data regarding the at least one other device, the communication component configured to read the data regarding the at least one other device;

a reception component configured to receive a request for information from a host about the at least one other device; and

a transmission component configured to send a response including data about the at least one other device to the host,

wherein the host is configured to communicate directly with the at least one other device.

2. The device according to claim 1 , wherein the at least one other device is drawn from a set including a storage device and a Network Interface Card (NIC).

3. The device according to claim 2 , wherein the storage device includes a Non-Volatile Memory Express (NVMe) Solid State Drive (SSD).

4. The device according to claim 1 , wherein the device includes a switch.

5. The device according to claim 4 , wherein the switch includes a Peripheral Component Interconnect Express (PCIe) switch.

6. The device according to claim 1 , wherein the chassis includes an Ethernet port.

7. The device according to claim 6 , wherein the chassis is configured to use an Ethernet protocol to communicate across a link.

8. The device according to claim 1 , wherein the chassis includes an NVMe over Fabrics (NVMeoF) chassis.

9. The device according to claim 1 , wherein the chassis includes a High Availability (HA) chassis.

10. The device according to claim 9 , wherein the chassis includes a dual path for communicating with a pairing partner of the HA chassis.

11. A method, comprising:

reading, by a device associated with a chassis, at least one data for at least one other device;

compiling the at least one data into a record;

receiving, at the device, a request for information from a host about the at least one other device; and

sending the record from the device to the host,

wherein the host is configured to communicate directly with the other device.

12. The method according to claim 11 , wherein the device may receive the at least one data from the at least one other device and compile the at least one data into the record before receiving a query from the host.

13. The method according to claim 11 , wherein the at least one other device includes a Non-Volatile Memory Express (NVMe) Solid State Drive (SSD).

14. The method according to claim 11 , wherein the device includes a switch.

15. The method according to claim 14 , wherein the switch includes a Peripheral Component Interconnect Express (PCIe) switch.

16. The method according to claim 11 , wherein the chassis includes an Ethernet port.

17. The method according to claim 16 , wherein the chassis is configured to use an Ethernet protocol to communicate across a link.

18. The method according to claim 11 , wherein the chassis includes an NVMe over Fabrics (NVMeoF) chassis.

19. The method according to claim 11 , wherein the chassis includes a High Availability (HA) chassis.

20. The method according to claim 19 , wherein the chassis includes a dual path for communicating with a pairing partner of the HA chassis.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2023
From: OLARIG, SOMPONG PAUL; PHAM, SON T.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 064190/0033 →
Continuity (4)
Continuation 16424474 · May 28, 2019
Continuation 15345507 · Nov 7, 2016
Provisional Application 62394726 · Sep 14, 2016
Related Publication 20210382627A1 · Dec 9, 2021
Cited By (12)
US 12,267,178 US 12,301,372 US 12,335,054 US 12,418,429 US 12,422,981 US 12,430,271 US 12,476,832 US 12,541,477 US 12,541,480 US 12,556,417 US 12,561,266 US 12,561,270