IP Library Granted Patent US 12,430,271
Granted Patent B2
US 12,430,271 · App. 18/106,477 · Granted Sep 30, 2025

System and method for supporting multi-path and/or multi-mode NMVe over fabrics devices

Inventors: Sompong Paul Olarig (Pleasanton, CA); Fred Worley (San Jose, CA); Son Pham (San Ramon, CA)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
G06F13/4022G06F13/1668G06F13/4068G06F13/4282G06F2213/0026G06F2213/0028G06F2213/0036
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,430,271
App. No.
18/106,477
Granted
Sep 30, 2025
Kind
B2
Abstract

A system includes a fabric switch including a motherboard, a baseboard management controller (BMC), a network switch configured to transport network signals, and a PCIe switch configured to transport PCIe signals; a midplane; and a plurality of device ports. Each of the plurality of device ports is configured to connect a storage device to the motherboard of the fabric switch over the midplane and carry the network signals and the PCIe signals over the midplane. The storage device is configurable in multiple modes based a protocol established over a fabric connection between the system and the storage device.

Claims (40)

1. A device comprising:

a multi-protocol connector configured to connect to an apparatus, wherein the multi-protocol connector comprises a pin to transport a first type of physical signal;

wherein the device is removably connected to the apparatus;

wherein the device transports a second type of physical signal to the apparatus using a first signal path;

wherein the device transports a third type of physical signal to the apparatus using a second signal path;

wherein the third type of physical signal comprises an Ethernet signal;

wherein the pin of the multi-protocol connector is connected to an Ethernet interface to transport the Ethernet signal; and

wherein the device is configured to use a first protocol with the second type of physical signal and a second protocol with the Ethernet signal.

2. The device of claim 1 , wherein the device provides device information to the apparatus using the first signal path.

3. The device of claim 1 , wherein the first protocol comprises a first non-volatile memory protocol and the second protocol comprises a second non-volatile memory protocol.

4. The device of claim 1 , wherein the device is operable in a first port mode or a second port mode.

5. The device of claim 1 , wherein the pin comprises a Serial Attached Small Computer System Interface (SCSI) (SAS) pin of the multi-protocol connector.

6. The device of claim 1 , further comprising:

an interconnect interface configured to transmit the second type of physical signal.

7. The device of claim 1 , wherein the third type of physical signal provides a service associated with code for the device.

8. The device of claim 1 , further comprising a switch configured to switch the third type of physical signal to the first signal path.

9. A system comprising:

a first board; and

a second board;

wherein the second board is configured to connect a storage device to the first board using a multi-protocol connector having a pin to transport a first type of physical signal;

wherein the second board is configured to transmit a second type of physical signal between the storage device and the first board using a first protocol and transmit a third type of physical signal between the storage device and the first board using a second protocol;

wherein the third type of signal comprises an Ethernet signal; and

wherein the pin of the multi-protocol connector is connected to an Ethernet interface to transport the Ethernet signal.

10. The system of claim 9 , further comprising a switch configured to transmit the Ethernet signal between the first board and the storage device.

11. The system of claim 9 , wherein the first protocol comprises a first non-volatile memory protocol and the second protocol comprises a second non-volatile memory protocol.

12. The system of claim 9 , wherein the second board is configured to communicate with the storage device in a first port mode or a second port mode.

13. The system of claim 9 , wherein the storage device is operable in a first port mode or a second port mode.

14. The system of claim 9 , wherein:

the first board comprises the Ethernet interface; and

the second board is configured to transmit the Ethernet signal between the Ethernet interface and the storage device.

15. The system of claim 9 , wherein the Ethernet signal provides a service associated with code for the storage device.

16. The system of claim 9 , further comprising a switch configured to switch the third type of physical signal and the second type of physical signal.

17. A device comprising:

a multi-protocol connector configured to removably connect the device to an apparatus, wherein the multi-protocol connector comprises a pin to transport a first type of physical signal;

wherein the device transports, using a first protocol, a second type of physical signal to the apparatus using a first signal path;

wherein the device transports, using a second protocol, a third type of physical signal to the apparatus using a second signal path;

wherein the third type of physical signal comprises an Ethernet signal; and

wherein the pin of the multi-protocol connector is connected to an Ethernet interface to transport the Ethernet signal.

18. The device of claim 17 , further comprising a network interface configured to connect the device to the first signal path.

19. The device of claim 17 , wherein the device is operable in a first port mode or a second port mode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2023
From: OLARIG, SOMPONG PAUL; WORLEY, FRED; PHAM, SON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 063137/0370 →
Continuity (7)
Continuation 17063507 · Oct 5, 2020
Continuation 16692997 · Nov 22, 2019
Division 16211923 · Dec 6, 2018
Continuation 15403088 · Jan 10, 2017
Provisional Application 62420355 · Nov 10, 2016
Provisional Application 62366622 · Jul 26, 2016
Related Publication 20230185750A1 · Jun 15, 2023
References Cited (400)
US 6167470A · Ishii · 2000 [cited by applicant]
US 6295567B1 · Bassman et al. · 2001 [cited by applicant]
US 6345303B1 · Knauerhase et al. · 2002 [cited by applicant]
US 6427198B1 · Berglund et al. · 2002 [cited by applicant]
US 6463499B1 · Wakeley · 2002 [cited by applicant]
US 6611863B1 · Banginwar · 2003 [cited by applicant]
US 6662119B1 · Mitchell · 2003 [cited by applicant]
US 6717576B1 · Duluk, Jr. et al. · 2004 [cited by applicant]
US 7031838B1 · Young et al. · 2006 [cited by applicant]
US 7107253B1 · Sumner et al. · 2006 [cited by applicant]
US 7120759B2 · Chiu et al. · 2006 [cited by applicant]
US 7143153B1 · Black et al. · 2006 [cited by applicant]
US 7237036B2 · Boucher et al. · 2007 [cited by applicant]
US 7249173B2 · Nicolson · 2007 [cited by applicant]
US 7409567B2 · Hammes et al. · 2008 [cited by applicant]
US 7512585B2 · Agarwal et al. · 2009 [cited by applicant]
US 7536486B2 · Sadovsky et al. · 2009 [cited by applicant]
US 7620854B2 · Kuttan et al. · 2009 [cited by applicant]
US 7788428B2 · Melin · 2010 [cited by applicant]
US 7873700B2 · Pawlowski et al. · 2011 [cited by applicant]
US 7882393B2 · Grimes et al. · 2011 [cited by applicant]
US 7944812B2 · Carlson et al. · 2011 [cited by applicant]
US 8065347B1 · DeMeyer et al. · 2011 [cited by applicant]
US 8180862B2 · Baker et al. · 2012 [cited by applicant]
US 8327187B1 · Metcalf · 2012 [cited by applicant]
US 8396981B1 · Lee et al. · 2013 [cited by applicant]
US 8599863B2 · Davis · 2013 [cited by applicant]
US 8667224B1 · Yu et al. · 2014 [cited by applicant]
US 8754681B2 · Zhu et al. · 2014 [cited by applicant]
US 8832327B1 · Lin · 2014 [cited by applicant]
US 8887144B1 · Marr et al. · 2014 [cited by applicant]
US 8943234B1 · Voorhees et al. · 2015 [cited by applicant]
US 8949517B2 · Cohen et al. · 2015 [cited by applicant]
US 8953644B2 · Chandra et al. · 2015 [cited by applicant]
US 8998636B2 · Gomez et al. · 2015 [cited by applicant]
US 9037786B2 · Asnaashari et al. · 2015 [cited by applicant]
US 9047222B2 · Chandra et al. · 2015 [cited by applicant]
US 9092321B2 · Salessi · 2015 [cited by applicant]
US 9244865B2 · Hutchison et al. · 2016 [cited by applicant]
US 9244877B2 · Yang et al. · 2016 [cited by applicant]
US 9253275B2 · Bhogal et al. · 2016 [cited by applicant]
US 9280357B2 · Shaver et al. · 2016 [cited by applicant]
US 9280504B2 · Ben-Michael et al. · 2016 [cited by applicant]
US 9389805B2 · Cohen et al. · 2016 [cited by applicant]
US 9400749B1 · Kuzmin et al. · 2016 [cited by applicant]
US 9430412B2 · Huang · 2016 [cited by applicant]
US 9432298B1 · Smith · 2016 [cited by applicant]
US 9460042B2 · Iskandar et al. · 2016 [cited by applicant]
US 9465756B2 · Bennett · 2016 [cited by applicant]
US 9648148B2 · Rimmer et al. · 2017 [cited by applicant]
US 9653124B2 · Heyd et al. · 2017 [cited by applicant]
US 9734093B2 · Khemani et al. · 2017 [cited by applicant]
US 9734106B2 · Kotzur · 2017 [cited by examiner]
US 9785346B2 · Yost · 2017 [cited by applicant]
US 9785355B2 · Huang · 2017 [cited by applicant]
US 9785356B2 · Huang · 2017 [cited by applicant]
US 9811481B2 · Bhatia et al. · 2017 [cited by applicant]
US 9830082B1 · Srinivasan et al. · 2017 [cited by applicant]
US 9842084B2 · Friedman et al. · 2017 [cited by applicant]
US 9904330B2 · Schuette et al. · 2018 [cited by applicant]
US 9906596B2 · Sikdar · 2018 [cited by applicant]
US 9934173B1 · Sakalley et al. · 2018 [cited by applicant]
US 9934183B2 · Brassac et al. · 2018 [cited by applicant]
US 9952634B2 · Samper et al. · 2018 [cited by applicant]
US 9959240B2 · Mundt · 2018 [cited by applicant]
US 9965367B2 · Shih · 2018 [cited by applicant]
US 9990313B2 · Monji et al. · 2018 [cited by applicant]
US 10019388B2 · Long et al. · 2018 [cited by applicant]
US 10061852B1 · Plenderleith · 2018 [cited by applicant]
US 10063638B2 · Huang · 2018 [cited by applicant]
US 10101764B2 · Chou et al. · 2018 [cited by applicant]
US 10108450B2 · Pinto et al. · 2018 [cited by applicant]
US 10114778B2 · Worley et al. · 2018 [cited by applicant]
US 10140063B2 · Worley et al. · 2018 [cited by applicant]
US 10162784B2 · Bassett et al. · 2018 [cited by applicant]
US 10162793B1 · Bshara et al. · 2018 [cited by applicant]
US 10206297B2 · Breakstone et al. · 2019 [cited by applicant]
US 10223313B2 · Shih · 2019 [cited by applicant]
US 10223316B2 · Mataya et al. · 2019 [cited by applicant]
US 10235313B2 · Lee et al. · 2019 [cited by applicant]
US 10255215B2 · Breakstone et al. · 2019 [cited by applicant]
US 10257080B1 · Kusam et al. · 2019 [cited by applicant]
US 10275356B2 · Chou et al. · 2019 [cited by applicant]
US 10289517B2 · Beerens · 2019 [cited by applicant]
US 10289588B2 · Chu et al. · 2019 [cited by applicant]
US 10311003B2 · Pamley et al. · 2019 [cited by applicant]
US 10318443B2 · Su · 2019 [cited by applicant]
US 10346041B2 · Olarig et al. · 2019 [cited by applicant]
US 10372648B2 · Qiu · 2019 [cited by applicant]
US 10372659B2 · Olarig et al. · 2019 [cited by applicant]
US 10394723B2 · Yang et al. · 2019 [cited by applicant]
US 10409524B1 · Branover et al. · 2019 [cited by applicant]
US 10452576B2 · Stuhlsatz · 2019 [cited by applicant]
US 10467163B1 · Malwankar et al. · 2019 [cited by applicant]
US 10467170B2 · McKnight · 2019 [cited by applicant]
US 10474589B1 · Raskin · 2019 [cited by applicant]
US 10560550B1 · Xue et al. · 2020 [cited by applicant]
US 10592144B2 · Roberts et al. · 2020 [cited by applicant]
US 10733137B2 · Kachare et al. · 2020 [cited by applicant]
US 10795843B2 · Olarig · 2020 [cited by examiner]
US 10866911B2 · Qiu et al. · 2020 [cited by applicant]
US 10901927B2 · Fischer et al. · 2021 [cited by applicant]
US 10909818B2 · Zhao et al. · 2021 [cited by applicant]
US 10929327B1 · Schrempp et al. · 2021 [cited by applicant]
US 10942666B2 · Pydipaty et al. · 2021 [cited by applicant]
US 10990553B2 · Rust et al. · 2021 [cited by applicant]
US 11113046B1 · Bowen et al. · 2021 [cited by applicant]
US 11126352B2 · Olarig et al. · 2021 [cited by applicant]
US 11347740B2 · Moshe et al. · 2022 [cited by applicant]
US 11669481B2 · Jen et al. · 2023 [cited by applicant]
US 11983405B2 · Olarig et al. · 2024 [cited by applicant]
US 11983406B2 · Olarig et al. · 2024 [cited by applicant]
US 11989413B2 · Olarig et al. · 2024 [cited by applicant]
US 20020087887A1 · Busam et al. · 2002 [cited by applicant]
US 20020095491A1 · Edmonds et al. · 2002 [cited by applicant]
US 20020123365A1 · Thorson et al. · 2002 [cited by applicant]
US 20030058818A1 · Wilkes et al. · 2003 [cited by applicant]
US 20040073912A1 · Meza · 2004 [cited by applicant]
US 20040111590A1 · Klein · 2004 [cited by applicant]
US 20040147281A1 · Holcombe et al. · 2004 [cited by applicant]
US 20040153844A1 · Ghose et al. · 2004 [cited by applicant]
US 20040153851A1 · Venugopal et al. · 2004 [cited by applicant]
US 20040255014A1 · Motoyama et al. · 2004 [cited by applicant]
US 20050025125A1 · Kwan · 2005 [cited by applicant]
US 20050060442A1 · Beverly et al. · 2005 [cited by applicant]
US 20050120157A1 · Chen et al. · 2005 [cited by applicant]
US 20050251609A1 · Chou et al. · 2005 [cited by applicant]
US 20060059287A1 · Rivard et al. · 2006 [cited by applicant]
US 20060095625A1 · Wootten et al. · 2006 [cited by applicant]
US 20060098681A1 · Cafiero et al. · 2006 [cited by applicant]
US 20060136621A1 · Tung et al. · 2006 [cited by applicant]
US 20060202950A1 · Lee et al. · 2006 [cited by applicant]
US 20070077553A1 · Bentwich · 2007 [cited by applicant]
US 20080003845A1 · Hong et al. · 2008 [cited by applicant]
US 20080288708A1 · Hsueh · 2008 [cited by applicant]
US 20090003361A1 · Bakthavathsalam · 2009 [cited by examiner]
US 20090073896A1 · Gillingham et al. · 2009 [cited by applicant]
US 20090077478A1 · Gillingham et al. · 2009 [cited by applicant]
US 20090217188A1 · Alexander et al. · 2009 [cited by applicant]
US 20090222733A1 · Basham et al. · 2009 [cited by applicant]
US 20090259364A1 · Vollmer et al. · 2009 [cited by applicant]
US 20100077067A1 · Strole · 2010 [cited by applicant]
US 20100100858A1 · Schipper · 2010 [cited by applicant]
US 20100106836A1 · Schreyer et al. · 2010 [cited by applicant]
US 20100169512A1 · Matton et al. · 2010 [cited by applicant]
US 20110131380A1 · Rallens et al. · 2011 [cited by applicant]
US 20110151858A1 · Lai · 2011 [cited by applicant]
US 20110187829A1 · Nakajima · 2011 [cited by applicant]
US 20120056728A1 · Erdmann et al. · 2012 [cited by applicant]
US 20120102580A1 · Bealkowski · 2012 [cited by applicant]
US 20120154375A1 · Zhang et al. · 2012 [cited by applicant]
US 20120182866A1 · Vinayagam et al. · 2012 [cited by applicant]
US 20120207156A1 · Srinivasan et al. · 2012 [cited by applicant]
US 20120311654A1 · Dougherty, III et al. · 2012 [cited by applicant]
US 20120319750A1 · Zhu et al. · 2012 [cited by applicant]
US 20130054901A1 · Biswas et al. · 2013 [cited by applicant]
US 20130073895A1 · Cohen · 2013 [cited by applicant]
US 20130117503A1 · Nellans et al. · 2013 [cited by applicant]
US 20130117766A1 · Bax et al. · 2013 [cited by applicant]
US 20130179624A1 · Lambert et al. · 2013 [cited by applicant]
US 20130198311A1 · Tamir et al. · 2013 [cited by applicant]
US 20130198312A1 · Tamir et al. · 2013 [cited by applicant]
US 20130242991A1 · Basso et al. · 2013 [cited by applicant]
US 20130282953A1 · Orme et al. · 2013 [cited by applicant]
US 20130304979A1 · Zimmer et al. · 2013 [cited by applicant]
US 20130311795A1 · Cong et al. · 2013 [cited by applicant]
US 20130318371A1 · Hormuth · 2013 [cited by applicant]
US 20130325998A1 · Hormuth et al. · 2013 [cited by applicant]
US 20140032641A1 · Du · 2014 [cited by applicant]
US 20140040639A1 · Raam · 2014 [cited by applicant]
US 20140052928A1 · Shimoi · 2014 [cited by applicant]
US 20140122746A1 · Shaver et al. · 2014 [cited by applicant]
US 20140195634A1 · Kishore et al. · 2014 [cited by applicant]
US 20140195711A1 · Bhatia et al. · 2014 [cited by applicant]
US 20140201394A1 · Wagstaff · 2014 [cited by applicant]
US 20140208004A1 · Cohen et al. · 2014 [cited by applicant]
US 20140244888A1 · Kallickal · 2014 [cited by applicant]
US 20140258679A1 · McGee · 2014 [cited by applicant]
US 20140281171A1 · Canepa · 2014 [cited by applicant]
US 20140281458A1 · Ravimohan et al. · 2014 [cited by applicant]
US 20140317206A1 · Lomelino et al. · 2014 [cited by applicant]
US 20140330995A1 · Levy et al. · 2014 [cited by applicant]
US 20140344431A1 · Hsu et al. · 2014 [cited by applicant]
US 20140344488A1 · Flynn et al. · 2014 [cited by applicant]
US 20140344492A1 · Patwa et al. · 2014 [cited by applicant]
US 20150006758A1 · Holtman et al. · 2015 [cited by applicant]
US 20150039815A1 · Klein · 2015 [cited by applicant]
US 20150067188A1 · Chakhaiyar · 2015 [cited by applicant]
US 20150086017A1 · Taylor et al. · 2015 [cited by applicant]
US 20150091927A1 · Cote et al. · 2015 [cited by applicant]
US 20150106660A1 · Chumbalkar et al. · 2015 [cited by applicant]
US 20150120874A1 · Kim et al. · 2015 [cited by applicant]
US 20150120971A1 · Bae et al. · 2015 [cited by applicant]
US 20150138900A1 · Choi · 2015 [cited by applicant]
US 20150143018A1 · Kim et al. · 2015 [cited by applicant]
US 20150169231A1 · Kanigicherla et al. · 2015 [cited by applicant]
US 20150178095A1 · Balakrishnan et al. · 2015 [cited by applicant]
US 20150181760A1 · Stephens · 2015 [cited by applicant]
US 20150205541A1 · Nishtala et al. · 2015 [cited by applicant]
US 20150234815A1 · Slik · 2015 [cited by applicant]
US 20150254088A1 · Chou et al. · 2015 [cited by applicant]
US 20150255130A1 · Lee et al. · 2015 [cited by applicant]
US 20150261434A1 · Kagan et al. · 2015 [cited by applicant]
US 20150281126A1 · Regula et al. · 2015 [cited by applicant]
US 20150286599A1 · Hershberger · 2015 [cited by applicant]
US 20150301757A1 · Iwata et al. · 2015 [cited by applicant]
US 20150301964A1 · Brinicombe et al. · 2015 [cited by applicant]
US 20150304423A1 · Satoyama et al. · 2015 [cited by applicant]
US 20150317176A1 · Hussain et al. · 2015 [cited by applicant]
US 20150324312A1 · Jacobson et al. · 2015 [cited by applicant]
US 20150331473A1 · Jreji et al. · 2015 [cited by applicant]
US 20150350096A1 · Dinc et al. · 2015 [cited by applicant]
US 20150370661A1 · Swanson et al. · 2015 [cited by applicant]
US 20150370665A1 · Cannata et al. · 2015 [cited by applicant]
US 20150376840A1 · Shih · 2015 [cited by applicant]
US 20150381734A1 · Ebihara et al. · 2015 [cited by applicant]
US 20160004879A1 · Fisher et al. · 2016 [cited by applicant]
US 20160062936A1 · Brassac et al. · 2016 [cited by applicant]
US 20160077841A1 · Lambert et al. · 2016 [cited by applicant]
US 20160085718A1 · Huang · 2016 [cited by applicant]
US 20160092390A1 · Grothen et al. · 2016 [cited by applicant]
US 20160094619A1 · Khan et al. · 2016 [cited by applicant]
US 20160118121A1 · Kelly et al. · 2016 [cited by applicant]
US 20160127468A1 · Malwankar et al. · 2016 [cited by applicant]
US 20160127492A1 · Malwankar et al. · 2016 [cited by applicant]
US 20160146754A1 · Prasad et al. · 2016 [cited by applicant]
US 20160147446A1 · Ghosh · 2016 [cited by applicant]
US 20160188313A1 · Dubal et al. · 2016 [cited by applicant]
US 20160246754A1 · Rao et al. · 2016 [cited by applicant]
US 20160259597A1 · Worley · 2016 [cited by examiner]
US 20160261375A1 · Roethig et al. · 2016 [cited by applicant]
US 20160283428A1 · Guddeti · 2016 [cited by applicant]
US 20160306723A1 · Lu et al. · 2016 [cited by applicant]
US 20160306768A1 · Mataya · 2016 [cited by applicant]
US 20160328344A1 · Jose et al. · 2016 [cited by applicant]
US 20160328347A1 · Worley et al. · 2016 [cited by applicant]
US 20160337272A1 · Berman · 2016 [cited by applicant]
US 20160366071A1 · Chandran et al. · 2016 [cited by applicant]
US 20160378401A1 · Savic et al. · 2016 [cited by applicant]
US 20170018149A1 · Shih · 2017 [cited by applicant]
US 20170038804A1 · Shows et al. · 2017 [cited by applicant]
US 20170046097A1 · Jayaraman et al. · 2017 [cited by applicant]
US 20170063965A1 · Grenader · 2017 [cited by applicant]
US 20170068268A1 · Giriyappa et al. · 2017 [cited by applicant]
US 20170068628A1 · Calciu et al. · 2017 [cited by applicant]
US 20170068630A1 · Iskandar et al. · 2017 [cited by applicant]
US 20170102510A1 · Faw et al. · 2017 [cited by applicant]
US 20170105313A1 · Shedd et al. · 2017 [cited by applicant]
US 20170168943A1 · Chou et al. · 2017 [cited by applicant]
US 20170168970A1 · Sajeepa et al. · 2017 [cited by applicant]
US 20170185554A1 · Fricker · 2017 [cited by applicant]
US 20170187629A1 · Shalev et al. · 2017 [cited by applicant]
US 20170206034A1 · Fetik · 2017 [cited by applicant]
US 20170262029A1 · Nelson et al. · 2017 [cited by applicant]
US 20170269871A1 · Khan et al. · 2017 [cited by applicant]
US 20170270001A1 · Suryanarayana et al. · 2017 [cited by applicant]
US 20170270060A1 · Gupta et al. · 2017 [cited by applicant]
US 20170286305A1 · Kalwitz · 2017 [cited by applicant]
US 20170315752A1 · Colgrove et al. · 2017 [cited by applicant]
US 20170317901A1 · Agrawal et al. · 2017 [cited by applicant]
US 20170344259A1 · Freyensee et al. · 2017 [cited by applicant]
US 20170344294A1 · Mishra et al. · 2017 [cited by applicant]
US 20170357299A1 · Shabbir et al. · 2017 [cited by applicant]
US 20170357515A1 · Bower, III et al. · 2017 [cited by applicant]
US 20180004685A1 · Bhatt et al. · 2018 [cited by applicant]
US 20180004695A1 · Chu et al. · 2018 [cited by applicant]
US 20180019896A1 · Paquet et al. · 2018 [cited by applicant]
US 20180032462A1 · Olarig et al. · 2018 [cited by applicant]
US 20180032463A1 · Olarig et al. · 2018 [cited by applicant]
US 20180032469A1 · Olarig et al. · 2018 [cited by applicant]
US 20180032471A1 · Olarig · 2018 [cited by applicant]
US 20180052745A1 · Marripudi et al. · 2018 [cited by applicant]
US 20180074717A1 · Olarig et al. · 2018 [cited by applicant]
US 20180074984A1 · Olarig et al. · 2018 [cited by applicant]
US 20180095904A1 · Bunker et al. · 2018 [cited by applicant]
US 20180101492A1 · Cho et al. · 2018 [cited by applicant]
US 20180131633A1 · Li · 2018 [cited by applicant]
US 20180173652A1 · Olarig et al. · 2018 [cited by applicant]
US 20180189084A1 · Alanis et al. · 2018 [cited by applicant]
US 20180210517A1 · Yun · 2018 [cited by applicant]
US 20180213669A1 · Kochukunju · 2018 [cited by applicant]
US 20180227369A1 · DuCray et al. · 2018 [cited by applicant]
US 20180267925A1 · Rees · 2018 [cited by applicant]
US 20180275919A1 · Chirumamilla et al. · 2018 [cited by applicant]
US 20180307650A1 · Kachare et al. · 2018 [cited by applicant]
US 20180335958A1 · Wu et al. · 2018 [cited by applicant]
US 20180349231A1 · Panda et al. · 2018 [cited by applicant]
US 20180361237A1 · Perlman et al. · 2018 [cited by applicant]
US 20180365185A1 · Risinger et al. · 2018 [cited by applicant]
US 20180373609A1 · Beerens · 2018 [cited by applicant]
US 20190042424A1 · Nair · 2019 [cited by applicant]
US 20190087268A1 · Koltsidas et al. · 2019 [cited by applicant]
US 20190104632A1 · Nelson et al. · 2019 [cited by applicant]
US 20190140838A1 · Bernat et al. · 2019 [cited by applicant]
US 20190196745A1 · Persson et al. · 2019 [cited by applicant]
US 20190205153A1 · Niestemski et al. · 2019 [cited by applicant]
US 20190286584A1 · Olarig et al. · 2019 [cited by applicant]
US 20190339888A1 · Sasidharan et al. · 2019 [cited by applicant]
US 20200021492A1 · Ganguli et al. · 2020 [cited by applicant]
US 20200042217A1 · Roberts et al. · 2020 [cited by applicant]
US 20200117663A1 · Moshe et al. · 2020 [cited by applicant]
US 20200293916A1 · Li · 2020 [cited by applicant]
US 20200364303A1 · Liu et al. · 2020 [cited by applicant]
US 20210255979A1 · Colenbrander · 2021 [cited by applicant]
US 20210342281A1 · Olarig et al. · 2021 [cited by applicant]
US 20220151022A1 · Chikkur Dattatraya et al. · 2022 [cited by applicant]
US 20220188002A1 · Olarig · 2022 [cited by examiner]
US 20220206693A1 · Jung et al. · 2022 [cited by applicant]
US 20220303056A1 · Miyazaki et al. · 2022 [cited by applicant]
US 20230143642A1 · Takahashi · 2023 [cited by applicant]
CN 1641568A · 2005 [cited by applicant]
CN 101847429B · 2012 [cited by applicant]
CN 103946824A · 2014 [cited by applicant]
CN 104025063A · 2014 [cited by applicant]
CN 104202197A · 2014 [cited by applicant]
CN 104572516A · 2015 [cited by applicant]
CN 104615577A · 2015 [cited by applicant]
CN 105260275A · 2016 [cited by applicant]
CN 105677595A · 2016 [cited by applicant]
CN 105912275A · 2016 [cited by applicant]
CN 103412769B · 2017 [cited by applicant]
CN 107659518B · 2021 [cited by applicant]
EP 2290497A1 · 2011 [cited by applicant]
EP 2843557A1 · 2015 [cited by applicant]
GB 2308904A · 1997 [cited by examiner]
JP 2001290752A · 2001 [cited by applicant]
JP 4257050B2 · 2009 [cited by applicant]
JP 2010146525A · 2010 [cited by applicant]
JP 2011048534A · 2011 [cited by applicant]
JP 2012506184A · 2012 [cited by applicant]
JP 2013041390A · 2013 [cited by applicant]
JP 2014241545A · 2014 [cited by applicant]
JP 2015049742A · 2015 [cited by applicant]
JP 2015191649A · 2015 [cited by applicant]
JP 2015194005A · 2015 [cited by applicant]
JP 2015532985A · 2015 [cited by applicant]
JP 2016037501A · 2016 [cited by applicant]
JP 2016045968A · 2016 [cited by applicant]
JP WO2015194005A1 · 2017 [cited by applicant]
KR 20050001307A · 2005 [cited by applicant]
KR 20090106469A · 2009 [cited by applicant]
KR 20120135205A · 2012 [cited by applicant]
KR 20150047785A · 2015 [cited by applicant]
KR 20150071898A · 2015 [cited by applicant]
KR 20160074659A · 2016 [cited by applicant]
KR 20180012191A · 2018 [cited by applicant]
KR 20180012201A · 2018 [cited by applicant]
TW 201445325A · 2014 [cited by applicant]
WO WO2011144075A3 · 2012 [cited by examiner]
WO 2013077867A1 · 2013 [cited by applicant]
WO 2014209764A1 · 2014 [cited by applicant]
WO 2015049742A1 · 2015 [cited by applicant]
WO 2015191649A1 · 2015 [cited by applicant]
WO 2016037501A1 · 2016 [cited by applicant]
WO 2016085016A1 · 2016 [cited by applicant]
US 11,923,992 B2, 03/2024, Olarig et al. (withdrawn) [cited by applicant]
SSD Form Factor Work Group, Enterprise SSD Form Factor, 2012, SSDFormFactor.org, pp. 1-55. (Year: 2012). [cited by examiner]
Notice of Allowance for U.S. Appl. No. 15/345,507, mailed Feb. 19, 2019. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/345,509, mailed Feb. 8, 2022. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/345,509, mailed May 13, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/403,088, mailed Oct. 22, 2018. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/411,962, mailed Mar. 18, 2019. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/202,079, mailed Jan. 27, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/202,079, mailed Jun. 1, 2020. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/202,079, mailed Mar. 17, 2022. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/202,079, mailed May 14, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/211,923, mailed Sep. 13, 2019. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/421,458, mailed Apr. 15, 2020. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/424,474, mailed Apr. 30, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/424,474, mailed Jul. 15, 2020. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/692,997, mailed Jun. 1, 2020. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/844,995, mailed Aug. 26, 2022. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/844,995, mailed Sep. 29, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/857,172, mailed May 3, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/921,923, mailed Feb. 18, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/950,624, mailed May 10, 2021. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/022,075, mailed Aug. 23, 2022. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/022,075, mailed Nov. 29, 2023. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/063,501, mailed Jun. 2, 2022. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/063,507, mailed Oct. 7, 2022. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/099,776, mailed Aug. 8, 2023. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/099,776, mailed Feb. 15, 2022. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/376,145, mailed Jun. 20, 2023. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/408,365, mailed Sep. 19, 2023. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/868,734, mailed Jul. 6, 2023. [cited by applicant]
NVM Express over Fabrics specification Revision 1.0; NVM Express Inc.; Jun. 5, 2016. (Year: 2016). [cited by applicant]
OC3D, “What is the New U.2 SSDD Connection?” OC3D News, Jul. 2016, (https://www.overclock3d.net/news/storage/what_is_the_new_u_2_ssd_connection/1), retrieved May 2018, 4 pages. [cited by applicant]
OC3D, “What is the New U.2 SSD Connection?,” (https://www.overclock3d.net/news/storage/what_is_the_new_u_2_ssd_connection/1), Jul. 2016, retrieved Apr. 12, 2021, 5 pages. [cited by applicant]
Office Action for U.S. Appl. No. 15/256,495, mailed Jun. 14, 2019. [cited by applicant]
Office Action for U.S. Appl. No. 15/256,495, mailed Mar. 29, 2018. [cited by applicant]
Office Action for U.S. Appl. No. 15/345,507, mailed Dec. 3, 2018. [cited by applicant]
Office Action for U.S. Appl. No. 15/345,509, mailed Apr. 29, 2020. [cited by applicant]
Office Action for U.S. Appl. No. 15/345,509, mailed Nov. 29, 2019. [cited by applicant]
Office Action for U.S. Appl. No. 15/345,509, mailed Sep. 10, 2018. [cited by applicant]
Office Action for U.S. Appl. No. 15/345,509, mailed Sep. 28, 2020. [cited by applicant]
Office Action for U.S. Appl. No. 15/403,088, mailed Jun. 7, 2018. [cited by applicant]
Office Action for U.S. Appl. No. 15/411,962, mailed Aug. 10, 2018. [cited by applicant]
Office Action for U.S. Appl. No. 16/202,079, mailed Aug. 22, 2019. [cited by applicant]
Office Action for U.S. Appl. No. 16/202,079, mailed Dec. 9, 2021. [cited by applicant]
Office Action for U.S. Appl. No. 16/202,079, mailed Feb. 2, 2023. [cited by applicant]