IP Library › Granted Patent US 11,989,445
Granted Patent B2
US 11,989,445 · App. 17/320,111 · Granted May 21, 2024

Automatic operating mode management for memory using workload profile data

Inventor: Gil Golov (Backnang, DE)
Assignee: Micron Technology, Inc.
G06F3/0656G06F3/0619G06F3/0631G06F3/0679G06F11/3058G06F11/3075
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Quick Facts
Patent No.
US 11,989,445
App. No.
17/320,111
Granted
May 21, 2024
Kind
B2
Abstract

The disclosed embodiments relate to logging activities of memory devices and adjusting the operation of a controller based on the activities. In one embodiment, a method comprises monitoring, by a memory device, die temperatures and data sizes of commands issued to the memory device; determining, by the memory device, a target size for a buffer based on the die temperatures and data sizes; and adjusting, by the memory device, a current size of the buffer to meet the target size.

Claims (43)

1. A method comprising:

monitoring, by a memory device, die temperatures and data sizes of commands issued to the memory device during a first period of time, the die temperatures and the data sizes correlated via timestamps;

storing, by the memory device, the die temperatures and the data sizes in a log file;

determining, by the memory device, a target size for a buffer based on a current temperature by:

identifying similar historical temperatures present in the log file,

extracting a plurality of data sizes from the log file that are correlated with the similar historical temperatures, the plurality of data sizes corresponding to a plurality of read or write commands issued during the similar historical temperatures, and

aggregating the plurality of data sizes to determine the target size; and

adjusting, by the memory device, a current size of the buffer to meet the target size.

2. The method of claim 1 , wherein monitoring the die temperatures comprises reading the die temperatures from a temperature sensor, generating the timestamps for the die temperatures, and writing the die temperatures and the timestamps to the log file.

3. The method of claim 1 , wherein monitoring the data sizes of commands issued to the memory device comprises calculating a data size of data required to execute the commands.

4. The method of claim 3 , the commands comprising read and write commands.

5. The method of claim 1 , further comprising determining that the current temperature is below a target operating temperature prior to determining the target size for the buffer.

6. The method of claim 1 , further comprising uploading the die temperatures and the data sizes to a remote computing device.

7. The method of claim 6 , wherein determining the target size comprises receiving the target size from the remote computing device.

8. The method of claim 1 , wherein determining the target size comprises identifying historical data sizes recorded at historical temperatures, the historical temperatures within a preset deviation from the current temperature.

9. A non-transitory computer-readable storage medium for tangibly storing computer program instructions capable of being executed by a computer processor, the computer program instructions defining steps of:

monitoring die temperatures and data sizes of commands issued to a memory device, the die temperatures and the data sizes correlated via timestamps;

storing the die temperatures and the data sizes in a log file;

determining a target size for a buffer based on a current temperature by:

identifying similar historical temperatures present in the log file,

extracting a plurality of data sizes from the log file that are correlated with the similar historical temperatures, the plurality of data sizes corresponding to a plurality of read or write commands issued during the similar historical temperatures, and

aggregating the plurality of data sizes to determine the target size; and

adjusting a current size of the buffer to meet the target size.

10. The non-transitory computer-readable storage medium of claim 9 , wherein monitoring the die temperatures comprises reading the die temperatures from a temperature sensor, generating the timestamps for the die temperatures, and writing the die temperatures and the timestamps to the log file.

11. The non-transitory computer-readable storage medium of claim 9 , wherein monitoring the data sizes of commands issued to the memory device comprises calculating a data size of data required to execute the commands.

12. The non-transitory computer-readable storage medium of claim 11 , the commands comprising read and write commands.

13. The non-transitory computer-readable storage medium of claim 9 , the computer program instructions further defining a step of determining that the current temperature is below a target operating temperature prior to determining the target size for the buffer.

14. The non-transitory computer-readable storage medium of claim 9 , the computer program instructions further defining a step of uploading the die temperatures and the data sizes to a remote computing device.

15. The non-transitory computer-readable storage medium of claim 14 , wherein determining the target size comprises receiving the target size from the remote computing device.

16. A memory device comprising:

a storage array; and

a controller configured to:

monitor die temperatures and data sizes of commands issued to the memory device, the commands accessing the storage array, the die temperatures and the data sizes correlated via timestamps;

store the die temperatures and the data sizes in a log file;

determine a target size for a buffer based on a current temperature by:

identifying similar historical temperatures present in the log file,

extracting a plurality of data sizes from the log file that are correlated with the similar historical temperatures, the plurality of data sizes corresponding to a plurality of read or write commands issued during the similar historical temperatures, and

aggregating the plurality of data sizes to determine the target size; and

adjust a current size of the buffer to meet the target size.

17. The memory device of claim 16 , wherein monitoring the die temperatures comprises reading the die temperatures from a temperature sensor, generating the timestamps for the die temperatures, and writing the die temperatures and the timestamps to the log file.

18. The memory device of claim 16 , the controller further configured to determine that the current temperature is below a target operating temperature prior to determining the target size for the buffer.

19. The memory device of claim 16 , the controller further configured to:

upload the die temperatures and the data sizes to a remote computing device, and wherein determining the target size comprises receiving the target size from the remote computing device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2021
From: GOLOV, GIL
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056236/0485 →
Continuity (1)
Related Publication 20220365710A1 · Nov 17, 2022
Cited By (1)
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