IP Library Granted Patent US 11,990,472
Granted Patent B2
US 11,990,472 · App. 17/030,212 · Granted May 21, 2024

Fabrication of gate-all-around integrated circuit structures having pre-spacer deposition cut gates

Inventors: Leonard P. Guler (Hillsboro, OR); Michael K. Harper (Hillsboro, OR); William Hsu (Hillsboro, OR); Biswajeet Guha (Hillsboro, OR); Tahir Ghani (Portland, OR); Niels Zussblatt (Hillsboro, OR); Jeffrey Miles Tan (Hillsboro, OR); Benjamin Kriegel (Portland, OR); Mohit K. Haran (Hillsboro, OR); Reken Patel (Portland, OR); Oleg Golonzka (Beaverton, OR); Mohammad Hasan (Aloha, OR)
Assignee: Intel Corporation
H01L27/0886G11C5/06H01L27/0688H01L29/0669H01L29/41791H01L29/66795H01L29/785H01L2029/7858
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Quick Facts
Patent No.
US 11,990,472
App. No.
17/030,212
Granted
May 21, 2024
Kind
B2
Abstract

Gate-all-around integrated circuit structures having pre-spacer-deposition cut gates are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, and a second gate stack is over the second vertical arrangement of horizontal nanowires. An end of the second gate stack is spaced apart from an end of the first gate stack by a gap. The integrated circuit structure also includes a dielectric structure having a first portion forming a gate spacer along sidewalls of the first gate stack, a second portion forming a gate spacer along sidewalls of the second gate stack, and a third portion completely filling the gap, the third portion continuous with the first and second portions.

Claims (29)

1. An integrated circuit structure, comprising:

a first vertical arrangement of horizontal nanowires;

a second vertical arrangement of horizontal nanowires;

a first gate stack over the first vertical arrangement of horizontal nanowires;

a second gate stack over the second vertical arrangement of horizontal nanowires, an end of the second gate stack spaced apart from an end of the first gate stack by a gap; and

a dielectric structure comprising a first portion forming a gate spacer along sidewalls of the first gate stack, a second portion forming a gate spacer along sidewalls of the second gate stack, and a third portion completely filling the gap, the third portion continuous with the first and second portions.

2. The integrated circuit structure of claim 1 , further comprising:

a first pair of epitaxial source or drain structures at first and second ends of the first vertical arrangement of horizontal nanowires; and

a second pair of epitaxial source or drain structures at first and second ends of the second vertical arrangement of horizontal nanowires.

3. The integrated circuit structure of claim 2 , further comprising:

a first pair of conductive contacts on the first pair of epitaxial source or drain structures; and

a second pair of conductive contacts on the second pair of epitaxial source or drain structures.

4. The integrated circuit structure of claim 2 , wherein the first and second pairs of epitaxial source or drain structures are first and second pairs of non-discrete epitaxial source or drain structures.

5. The integrated circuit structure of claim 2 , wherein the first and second pairs of epitaxial source or drain structures are first and second pairs of discrete epitaxial source or drain structures.

6. An integrated circuit structure, comprising:

a first vertical arrangement of horizontal nanowires;

a second vertical arrangement of horizontal nanowires;

a gate stack over the first vertical arrangement of horizontal nanowires;

a gate plug over the second vertical arrangement of horizontal nanowires, an end of the gate plug spaced apart from an end of the gate stack by a gap; and

a dielectric structure comprising a first portion forming a gate spacer along sidewalls of the gate stack, a second portion forming a spacer along sidewalls of the gate plug, and a third portion completely filling the gap, the third portion continuous with the first and second portions.

7. The integrated circuit structure of claim 6 , further comprising a seam between the third portion of the dielectric structure and the gate plug.

8. The integrated circuit structure of claim 6 , further comprising:

a first pair of epitaxial source or drain structures at first and second ends of the first vertical arrangement of horizontal nanowires; and

a second pair of epitaxial source or drain structures at first and second ends of the second vertical arrangement of horizontal nanowires.

9. The integrated circuit structure of claim 8 , further comprising:

a first pair of conductive contacts on the first pair of epitaxial source or drain structures; and

a second pair of conductive contacts on the second pair of epitaxial source or drain structures.

10. The integrated circuit structure of claim 8 , wherein the first and second pairs of epitaxial source or drain structures are first and second pairs of non-discrete epitaxial source or drain structures.

11. The integrated circuit structure of claim 8 , wherein the first and second pairs of epitaxial source or drain structures are first and second pairs of discrete epitaxial source or drain structures.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2021
From: GULER, LEONARD P.; HARPER, MICHAEL K.; HSU, WILLIAM; GUHA, BISWAJEET; GHANI, TAHIR; ZUSSBLATT, NIELS; TAN, JEFFREY MILES; GOLONZKA, OLEG; KRIEGEL, BENJAMIN; HARAN, MOHIT K.; PATEL, REKEN; HASAN, MOHAMMAD
To: INTEL CORPORATION
Reel/Frame 055967/0781 →
Continuity (1)
Related Publication 20220093592A1 · Mar 24, 2022