Gate-all-around integrated circuit structures having embedded GeSnB source or drain structures
Gate-all-around integrated circuit structures having embedded GeSnB source or drain structures, and methods of fabricating gate-all-around integrated circuit structures having embedded GeSnB source or drain structures, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires above a fin, the fin including a defect modification layer on a first semiconductor layer, and a second semiconductor layer on the defect modification layer. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires, and a second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires.
1. An integrated circuit structure, comprising:
a semiconductor fin;
a nanowire above the semiconductor fin;
a gate stack over the semiconductor fin and around the nanowire, the gate stack having a first side and a second side, the second side opposite the first side;
a first boron-doped germanium tin epitaxial source or drain structure on the semiconductor fin and at a first end of the nanowire, and adjacent to the first side of the gate stack; and
a second boron-doped germanium tin epitaxial source or drain structure on the semiconductor fin and at a first end of the nanowire and adjacent to the second side of the gate stack.
2. The integrated circuit structure of claim 1 , wherein the semiconductor fin is continuous with an underlying silicon substrate.
3. The integrated circuit structure of claim 1 , wherein the first and second boron-doped germanium tin epitaxial source or drain structures are on corresponding recessed portions of the semiconductor fin.
4. The integrated circuit structure of claim 1 , wherein the nanowire comprises germanium.
5. The integrated circuit structure of claim 1 , wherein the first and second boron-doped germanium tin epitaxial source or drain structures are compressive-stressing source or drain structures.
6. The integrated circuit structure of claim 1 , wherein the semiconductor fin comprises a defect-rich silicon layer on a silicon layer.
7. The integrated circuit structure of claim 1 , wherein the gate stack comprises a high-k gate dielectric layer and a metal gate electrode.
8. An integrated circuit structure, comprising:
a semiconductor fin;
a nanowire above the semiconductor fin;
a gate stack over the semiconductor fin and around the nanowire, the gate stack having a first side and a second side, the second side opposite the first side;
a first epitaxial source or drain structure on the semiconductor fin and at a first end of the nanowire, and adjacent to the first side of the gate stack, the first epitaxial source or drain structure comprising germanium, tin and boron; and
a second epitaxial source or drain structure on the semiconductor fin and at a second end of the nanowire, and adjacent to the second side of the gate stack, the second epitaxial source or drain structure comprising germanium, tin and boron.
9. The integrated circuit structure of claim 8 , wherein the semiconductor fin is continuous with an underlying silicon substrate.
10. The integrated circuit structure of claim 8 , wherein the first and second epitaxial source or drain structures are on corresponding recessed portions of the semiconductor fin.
11. The integrated circuit structure of claim 8 , wherein the nanowire comprises germanium.
12. The integrated circuit structure of claim 8 , wherein the first and second epitaxial source or drain structures are compressive-stressing source or drain structures.
13. The integrated circuit structure of claim 8 , wherein the semiconductor fin comprises a defect-rich silicon layer on a silicon layer.
14. The integrated circuit structure of claim 8 , wherein the gate stack comprises a high-k gate dielectric layer and a metal gate electrode.
15. A computing device, comprising:
a board; and
a component coupled to the board, the component including an integrated circuit structure, comprising:
a semiconductor fin;
a nanowire above the semiconductor fin;
a gate stack over the semiconductor fin and around the nanowire, the gate stack having a first side and a second side, the second side opposite the first side;
a first boron-doped germanium tin epitaxial source or drain structure on the semiconductor fin and at a first end of the nanowire, and adjacent to the first side of the gate stack; and
a second boron-doped germanium tin epitaxial source or drain structure on the semiconductor fin and at a first end of the nanowire, and adjacent to the second side of the gate stack.
16. The computing device of claim 15 , further comprising:
a memory coupled to the board.
17. The computing device of claim 15 , further comprising:
a communication chip coupled to the board.
18. The computing device of claim 15 , wherein the component is a packaged integrated circuit die.
19. The computing device of claim 15 , wherein the component is selected from the group consisting of a processor, a communications chip, and a digital signal processor.
20. The computing device of claim 15 , wherein the computing device is selected from the group consisting of a mobile phone, a laptop, a desk top computer, a server, and a set-top box.