Camera module

1. A camera module comprising:

a substrate comprising a window;

an image sensor coupled with a lower surface of the substrate;

a filter coupled with an upper surface of the image sensor and disposed on the window;

a second molding portion disposed on an upper surface of the substrate;

a lens barrel disposed on the second molding portion; and

a lens coupled with the lens barrel,

wherein the lens barrel is coupled with an upper surface of the second molding portion through an adhesive,

wherein the lens barrel comprises a guide member,

wherein the guide member extends downward and inward from a lower surface or an inner lateral surface of the lens barrel and is disposed on the second molding portion,

wherein the guide member is overlapped with the adhesive in a direction perpendicular to an optical axis direction, and

wherein the guide member is disposed further inward than the adhesive.

2. The camera module of claim 1 , wherein the filter is overlapped with the substrate in the direction perpendicular to the optical axis direction.

3. The camera module of claim 1 , wherein the image sensor is flip-chip bonded to the lower surface of the substrate.

4. The camera module of claim 1 , wherein the filter is overlapped with an image area of the image sensor in the optical axis direction.

5. The camera module of claim 1 , comprising a flexible substrate coupled to the lower surface of the substrate.

6. The camera module of claim 5 , wherein the flexible substrate is disposed at one side of the image sensor, and

wherein only a portion of the flexible substrate is overlapped with the substrate in the optical axis direction.

7. The camera module of claim 6 , wherein an upper surface of the flexible substrate and a lateral surface of the substrate are bonded by an adhesive.

8. The camera module of claim 1 , comprising a first molding portion surrounding the lower surface of the substrate and lateral and lower surfaces of the image sensor.

9. The camera module of claim 1 , wherein the substrate comprises an element disposed on an upper surface of the substrate, and

wherein the second molding portion surrounds the upper surface of the substrate and the element.

10. A camera module comprising:

a substrate comprising a hole;

a lens disposed at one side of the substrate;

an image sensor disposed at an other side of the substrate and facing the lens through the hole;

a filter disposed between the lens and the image sensor;

a second molding portion disposed on an upper surface of the substrate; and

a lens barrel disposed on the second molding portion,

wherein the lens is coupled with the lens barrel,

wherein an upper surface of the image sensor comprises an image area for converting light incident through the lens into an electrical signal, and a peripheral area disposed outside the image area,

wherein an adhesive material adhered to the filter is disposed in the image area of the image sensor,

wherein the peripheral area of the image sensor and the substrate are connected to each other by a conductive material,

wherein the lens barrel is coupled with an upper surface of the second molding portion through an adhesive,

wherein the lens barrel comprises a guide member,

wherein the guide member extends downward and inward from a lower surface or an inner lateral surface of the lens barrel and is disposed on the second molding portion,

wherein the guide member is overlapped with the adhesive in a direction perpendicular to an optical axis direction, and

wherein the guide member is disposed further inward than the adhesive.

11. The camera module of claim 1 , wherein the image sensor is not overlapped with the substrate in the direction perpendicular to the optical axis direction.

12. The camera module of claim 1 , wherein the filter is directly coupled to the upper surface of the image sensor by an adhesive member.

13. The camera module of claim 1 , wherein the image sensor is overlapped with the substrate in the optical axis direction.

14. The camera module of claim 9 , wherein the substrate comprises a protrusion protruding from an upper surface of the substrate,

wherein the protrusion comprises two protrusions spaced apart from each other, and

wherein the second molding portion is disposed between the two protrusions in the direction perpendicular to the optical axis direction.

15. The camera module of claim 1 , wherein the guide member surrounds at least a portion of an inner lateral surface of the second molding portion.

16. A smart phone comprising the camera module of claim 1 .

17. A camera module comprising:

a substrate comprising a hole;

a lens disposed above the substrate;

an image sensor disposed below the substrate and facing the lens through the hole of the substrate;

a filter disposed between the lens and the image sensor;

a second molding portion disposed on an upper surface of the substrate; and

a lens barrel disposed on the second molding portion,

wherein the lens is coupled with the lens barrel,

wherein a portion of the image sensor is overlapped with the substrate in an optical axis direction,

wherein the filter is disposed in the hole of the substrate so that the filter is overlapped with the substrate in a direction perpendicular to the optical axis direction,

wherein the lens barrel is coupled with an upper surface of the second molding portion through an adhesive,

wherein the lens barrel comprises a guide member,

wherein the guide member extends downward and inward from a lower surface or an inner lateral surface of the lens barrel and is disposed on the second molding portion,

wherein the guide member is overlapped with the adhesive in the direction perpendicular to the optical axis direction, and

wherein the guide member is disposed further inward than the adhesive.

18. The camera module of claim 17 , comprising a first molding portion surrounding a lower surface of the substrate and lateral and lower surfaces of the image sensor.

19. The camera module of claim 17 , comprising:

an element disposed on an upper surface of the substrate,

wherein the second molding portion surrounds the upper surface of the substrate and the element.

20. The camera module of claim 17 , wherein the filter is directly coupled to an upper surface of the image sensor by an adhesive member.