Intelligent integrated assembly and transfer apparatus for semiconductor light emitting device
The embodiment relates to an intelligent integrated assembly and transfer apparatus. The intelligent integrated assembly and transfer apparatus according to the embodiment can include a fluid chamber 300 , a roller unit 200 and assembly inspection unit 500 . The fluid chamber 300 can accommodate semiconductor light emitting devices 150 . Semiconductor light emitting devices 150 can be assembled on an assembly substrate 210 . The assembly substrate 210 can be mounted on the roller unit 200 . The roller unit 200 can rotate the assembly substrate 210 . The assembly inspection unit 500 can inspect the semiconductor light emitting devices 150 assembled on the assembly substrate 210 . The roller unit 200 can include a roller rotated part 220 where the assembly substrate 210 is mounted and rotated, a roller driving part 230 for rotating the roller rotated part 220 , and a magnet head unit 400 for applying magnetic force to the semiconductor light emitting devices 150 to be assembled on the assembly substrate 210.
1. An intelligent integrated assembly and transfer apparatus for transferring semiconductor light emitting devices to a panel substrate, the apparatus comprising:
a fluid chamber for accommodating the semiconductor light emitting devices;
a roller unit where an assembly substrate is mounted, wherein the semiconductor light emitting devices are assembled on the assembly substrate and transferred in-line to the panel substrate, wherein the roller unit is configured to rotate the assembly substrate, and wherein the assembly substrate being rotated is configured to pick up the semiconductor light emitting devices from the fluid chamber; and
an assembly inspection unit for inspecting the semiconductor light emitting devices assembled on the assembly substrate;
wherein the roller unit comprises:
a roller rotated part where the assembly substrate is mounted and rotated,
a roller driving part for rotating the roller rotated part, and
a magnet head unit for applying magnetic force to the semiconductor light emitting devices to be assembled on the assembly substrate,
wherein the roller unit includes a triangular shape or a round shape, and
wherein an area of a first-first roller part of the roller unit where the semiconductor light emitting devices are assembled on the assembly substrate is greater than an area of a first-second roller part of the roller unit where the semiconductor light emitting devices are transferred to the panel substrate.
2. The intelligent integrated assembly and transfer apparatus according to claim 1 , wherein the assembly inspection unit is configured to inspect the semiconductor light emitting devices assembled on the assembly substrate by inspecting an assembly status of each line in a width direction of the assembly substrate.
3. The intelligent integrated assembly and transfer apparatus according to claim 2 , wherein the assembly state of each line is inspected in the width direction of the assembly substrate and when there is an error position of unassembled or defective assembly, a panel chuck separates the panel substrate from the assembly substrate such that a semiconductor light emitting device in the error position is not transferred to the panel substrate, from among the semiconductor light emitting devices.
4. The intelligent integrated assembly and transfer apparatus according to claim 3 , wherein the panel chuck is arranged on at least one of side, top, or bottom of the panel substrate for separating the panel substrate from the assembly substrate.
5. The intelligent integrated assembly and transfer apparatus according to claim 1 , wherein the magnet head unit applies the magnetic force evenly to the semiconductor light emitting devices by rotating or moving horizontally.
6. The intelligent integrated assembly and transfer apparatus according to claim 3 , wherein the panel chuck has a function of rotating the panel substrate while the panel substrate is in an inclined state.
7. The intelligent integrated assembly and transfer apparatus according to claim 3 , further comprising a panel driver to move the panel substrate,
wherein the panel driver includes a second-first panel driver and a second-second panel driver, and
wherein the second-first panel driver is disposed at a different height from the second-second panel driver.
8. The intelligent integrated assembly and transfer apparatus according to claim 1 , further comprising a second magnet head unit disposed under the fluid chamber.
9. The intelligent integrated assembly and transfer apparatus according to claim 1 , wherein the roller unit has at least the a triangular shape, the round shape, or a combination of a partially triangular shape and a partially round shape.
10. The intelligent integrated assembly and transfer apparatus according to claim 1 , further comprising a hydrophilic treatment unit configured to perform a hydrophilic treatment for wetting a surface of the assembly substrate before the assembly substrate is inserted into a fluid in the fluid chamber.
11. The intelligent integrated assembly and transfer apparatus according to claim 1 , wherein the semiconductor light emitting devices are assembled on an exterior surface of the assembly substrate, and
wherein the first-first roller part, the first-second roller part and the magnet head unit are located to face an interior surface of the assembly substrate.