Method for transferring micro light-emitting diodes and transferring device
The present application provides a method for transferring micro light emitting diodes and a transferring device. The device includes: a first substrate, having at least one surface arranged with a plurality of first adhesive region for a plurality of micro light emitting diodes to adhere thereon; and a transferring substrate, having at least one surface arranged with a plurality of second adhesive regions for at least a portion of the micro light emitting diodes to adhere on and being configured to transfer the at least a portion of the micro light emitting diodes to a driving back plate.
1. A device for transferring a micro light emitting diode, comprising:
a first substrate;
a plurality of first adhesive regions, disposed on at least one surface of the first substrate and defined to adhere a plurality of micro light emitting diodes;
a transferring substrate, wherein at least one surface of the transferring substrate includes a plurality of protrusions, the transferring substrate configured to transfer at least a portion of the plurality of micro light emitting diodes to a driving back plate;
a first pressing plate, wherein at least one surface of the first pressing plate defines a plurality of recesses corresponding to the plurality of protrusions on the transferring substrate; and
a plurality of second adhesive regions, disposed on at least one surface of the transferring substrate and defined to adhere at least a portion of the plurality of micro light emitting diodes.
2. The device according to claim 1 , wherein adhesiveness of the plurality of first adhesive regions is less than that of the plurality of second adhesive regions.
3. The device according to claim 2 , wherein the at least one surface of the first substrate is arranged with a first adhesive layer; and a surface of the first adhesive layer away from the first substrate has a property of viscosity to define the first adhesive regions.
4. The device according to claim 2 , wherein the at least one surface of the transferring substrate is arranged with a plurality of adhesive bumps; and a surface of each of the plurality of adhesive bumps away from the transferring substrate has a property of viscosity to define said second adhesive regions.
5. The device according to claim 4 , wherein the plurality of adhesive bumps comprises an adhesive material.
6. The device according to claim 4 , wherein the at least one surface of the transferring substrate is arranged with a second adhesive layer, the plurality of protrusions protrude from the at least one surface of the transferring substrate and are covered by the second adhesive layer to serve as the adhesive bumps, and a surface of the second adhesive layer away from the transferring substrate is configured as the second adhesive regions.
7. The device according to claim 6 , wherein
the plurality of protrusions are received into the plurality of recesses to press the second adhesive layer onto surfaces of the plurality of protrusions.
8. The device according to claim 2 , wherein at least one surface of the transferring substrate is arranged with a third adhesive layer and a surface of the third adhesive layer away from the transferring substrate has a property of viscosity to define the second adhesive regions.
9. The device according to claim 1 , wherein the plurality of second adhesive regions are arranged on the transferring substrate in a first array and the plurality of micro light emitting diodes are arranged on the first substrate in a second array;
in a row direction, a distance between two adjacent second adhesive regions on the transferring substrate is multiple integer times of a distance between two adjacent micro light emitting diodes on the first substrate; and
in a column direction, a distance between two adjacent second adhesive regions on the transferring substrate is multiple integer times of a distance between two adjacent micro light emitting diodes on the first substrate.
10. The device according to claim 1 , further comprising
a transmission mechanism, wherein the transmission mechanism is arranged on a side of the transferring substrate away from the plurality of second adhesive regions and configured to move the transferring substrate.
11. The device according to claim 1 , further comprising
a peeling apparatus configured to peel at least part of the plurality of micro light emitting diodes off from the transferring substrate.
12. A device for transferring micro light emitting diodes, comprising:
a first substrate, defining a first adhesive region, wherein a plurality of micro light emitting diodes are capable of being adhered to the first adhesive region;
a transferring substrate, arranged with a plurality of adhesive bumps protruding from a surface of the transferring substrate, wherein a surface of each adhesive bump away from the transferring substrate has the property of viscosity and is capable of being adhered to at least part of the plurality of micro light emitting diodes, and adhesiveness of the surface of each adhesive bump is greater than adhesiveness of the first adhesive region;
a first pressing plate, wherein at least one surface of the first pressing plate defines a plurality of recesses corresponding to the plurality of adhesive bumps on the transferring substrate.
13. The device according to claim 12 , wherein the plurality of adhesive bumps are arranged in a first array and the plurality of micro light emitting diodes are arranged on the first substrate in a second array;
in a row direction, a distance between two adjacent adhesive bumps is multiple integer times of a distance between two adjacent micro light emitting diodes; and
in a column direction, a distance between two adjacent adhesive bumps is multiple integer times of a distance between two adjacent micro light emitting diodes.