4CPP SRAM cell and array
A static random access memory (SRAM) cell includes a four-contact polysilicon pitch (4Cpp) fin field effect transistor (FinFET) architecture including a first bit-cell and a second bit cell. The SRAM cell includes a first bit line and a first complementary bit line, wherein the first bit line and the first complementary bit line are shared by the first and second bit-cells of the SRAM cell. The SRAM cell includes a first word line connected to the first bit cell, and a second word line connected to the second bit cell.
1. A memory array, comprising:
a plurality of memory cells arranged in a plurality of rows and columns, each of the plurality of memory cells comprising a first four contact polysilicon pitch (4Cpp) field effect transistor (FinFET) architecture including a first bit-cell and a second 4Cpp FinFET architecture including a second bit-cell;
a first bit line pair, wherein each of the first and second bit-cells of each of the plurality of memory cells in a first row of the memory array share the first bit line pair; and
a plurality of word lines, wherein each of the first bit-cells in a first column of the memory array share a first word line and each of the second bit-cells in the first column of the memory array share a second word line.
2. The memory array of claim 1 , wherein each of the first and second bit-cells of each of the plurality of memory cells in a second row of the memory array share a second bit line pair.
3. The memory array of claim 1 , wherein each of the first bit-cells of each of the plurality of memory cells in a second column of the memory array share a third word line and each of the second bit-cells of each of the plurality of memory cells in the second column of the memory array share a fourth word line.
4. The memory array of claim 1 , wherein each of the first bit-cells of each of the plurality of memory cells in the first row of the memory array share the first word line with the second bit-cells of each of the plurality of memory cells in an adjacent second row and each of the second bit-cells of each of the plurality of memory cells in the first row of the memory array share a second word line with the first bit-cells of each of the plurality of memory cells in the adjacent second row.
5. The SRAM cell of claim 1 , wherein the first bit line pair includes a first bit line and a first complementary bit line, and wherein:
the first bit-cell comprises:
first, second, third and fourth polysilicon structures, wherein the first word line is connected to the first and second polysilicon structures;
a first pass gate transistor having a gate including the first polysilicon structure, and a source/drain (S/D) contact connected to the first bit line; and
a second pass gate transistor having a gate including the second polysilicon structure, and a S/D contact connected to the first complementary bit line; and
wherein the second bit-cell comprises:
first, second, third and fourth polysilicon structures, wherein the second word line is connected to the first and second polysilicon structure;
a first pass gate transistor having a gate formed by the first polysilicon structure, and a source contact connected to the first bit line; and
a second pass gate transistor having a gate contact formed by the second polysilicon structure and a source contact connected to the first complementary bit line.
6. The SRAM cell of claim 5 , wherein:
the first bit-cell further comprises:
a first inverter comprising first and second transistors each having a gate including the third polysilicon structure and a S/D contact connected to a S/D contact of the first pass gate transistor; and
a second inverter comprising third and fourth transistors each having a gate including the fourth polysilicon structure and a S/D contact connected to a S/D contact of the second pass gate transistor; and
wherein the second bit-cell further comprises:
a first inverter comprising first and second transistors each having a gate including the third polysilicon structure and a S/D contact connected to a S/D contact of the first pass gate transistor; and
a second inverter comprising third and fourth transistors each having a gate including the fourth polysilicon structure and a S/D contact connected to a S/D contact of the second pass gate transistor.
7. The SRAM cell of claim 6 , wherein the first bit line comprises a first metal line in a second metal layer, and wherein the first complementary bit line comprises a second metal line in the first metal layer.
8. The SRAM cell of claim 7 , wherein the first word line comprises a first metal line in a second metal layer, and wherein the second word line comprises a second metal line in the second metal layer.
9. The SRAM cell of claim 8 , wherein the first bit-cell further comprises a first contact in the first metal layer, the first and second polysilicon structures of the first bit-cell being connected to the first contact and the first contact being connected to the first metal line in the second metal layer, and wherein the second bit-cell further comprises a second contact in the first metal layer, the first and second polysilicon structures of the second bit-cell being connected to the second contact and the second contact being connected to the second metal line in the second metal layer.
10. A method, comprising:
arranging a plurality of memory cells in a plurality of rows and columns, each of the plurality of memory cells comprising a first four contact polysilicon pitch (4Cpp) field effect transistor (FinFET) architecture including a first bit-cell and a second 4Cpp FinFET architecture including a second bit-cell;
providing a plurality of bit line pairs including a first bit line pair and a second bit line pair;
connecting the first bit line pair to each of the first and second bit-cells of each of the plurality of memory cells in a first row of the memory array; and
connecting the second bit line pair to each of the first and second bit-cells of each of the plurality of memory cells in a second row of the memory array.
11. The method of claim 10 , further comprising:
providing a plurality of word lines including a first word line and a second word line;
connecting each of the first bit-cells of each of the plurality of memory cells in a first column of the memory array to the first word line;
connecting each of the second bit-cells of each of the plurality of memory cells in the first column of the memory array to the second word line.
12. The method of claim 11 , wherein the plurality of word lines include a third word line and a fourth word line, the method further comprising:
connecting each of the first bit-cells of each of the plurality of memory cells in a second column of the memory array to the third word line;
connecting each of the second bit-cells of each of the plurality of memory cells in the second column of the memory array to the fourth word line.
13. The method of claim 10 , further comprising:
providing a plurality of word lines including a first word line and a second word line;
connecting each of the first bit-cells of each of the plurality of memory cells in the first row of the memory array to the first word line;
connecting each of the second bit-cells of each of the plurality of memory cells in an adjacent second row to the first bit line;
connecting each of the second bit-cells of each of the plurality of memory cells in the first row of the memory array to the second word line; and
connecting each of the first bit-cells of each of the plurality of memory cells in the adjacent second row to the second word line.
14. The method of claim 11 , wherein providing the plurality of bit line pairs includes providing the bit line pairs in a first metal layer, and wherein providing the plurality of word line pair includes providing the word lines in a second metal layer.
15. A static random access memory (SRAM) cell, comprising:
a first bit-cell comprising:
first, second, third and fourth polysilicon structures;
a first pass gate transistor having a gate including the first polysilicon structure connected to a first word line, and a first source/drain (S/D) contact connected to a first bit line;
a second pass gate transistor having a gate including the second polysilicon structure connected to the first word line, and a first S/D contact connected to a second bit line;
a second bit-cell comprising:
first, second, third and fourth polysilicon structures;
a first pass gate transistor having a gate including the first polysilicon structure connected to a second word line, and a first S/D contact connected to the first bit line; and
a second pass gate transistor having a gate contact including the second polysilicon structure connected to the second word line, and a first S/D contact connected to the second bit line.
16. The SRAM cell of claim 15 ,
wherein the first bit-cell further comprises:
a first inverter comprising first and second transistors each having a gate including the third polysilicon structure and a first S/D contact connected to a second S/D contact of the first pass gate transistor; and
a second inverter comprising third and fourth transistors each having a gate including the fourth polysilicon structure and a first S/D contact connected to a second S/D contact of the second pass gate transistor; and
wherein the second bit-cell further comprises:
a first inverter comprising first and second transistors each having a gate including the third polysilicon structure and a first S/D contact connected to a second S/D contact of the first pass gate transistor; and
a second inverter comprising third and fourth transistors each having a gate including the fourth polysilicon structure and a S/D contact connected to a S/D contact of the second pass gate transistor.
17. The SRAM cell of claim 16 , wherein the first bit line comprises a first metal line in a first metal layer, and wherein the second bit line comprises a second metal line in the first metal layer.
18. The SRAM cell of claim 17 , wherein the first word line comprises a first metal line in a second metal layer, and wherein the second word line comprises a second metal line in the second metal layer.
19. The SRAM cell of claim 18 , wherein the first bit-cell further comprises a first contact in the first metal layer, the first and second polysilicon structures of the first bit-cell being connected to the first contact and the first contact being connected to the first metal line in the second metal layer, and wherein the second bit-cell further comprises a second contact in the first metal layer, the first and second polysilicon structures of the second bit-cell being connected to the second contact and the second contact being connected to the second metal line in the second metal layer.
20. The SRAM cell of claim 16 , wherein each of the first and second polysilicon structures of each of the first and second bit-cells include a continuous poly on diffusion edge (CPODE) pattern.