Semiconductor device and method for manufacturing semiconductor device
View Patent ↗A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes an oxide; a first conductor and a second conductor provided apart from each other over the oxide; a third conductor including a region that is over the oxide and overlaps with a region between the first conductor and the second conductor; a first insulator over the third conductor; a fourth conductor that is electrically connected to the first conductor through a first opening provided in the first insulator; a second insulator that is provided over the first insulator and that is provided over the fourth conductor in the first opening; a fifth conductor overlapping with the fourth conductor with the second insulator positioned therebetween in the first opening; and a sixth conductor electrically connected to the second conductor in a second opening provided in the first insulator and the second insulator. The fifth conductor and the sixth conductor are in contact with a top surface of the second insulator over the first insulator.
1. A semiconductor device comprising:
an oxide;
a first conductor and a second conductor apart from each other over the oxide;
a third conductor over the oxide, the third conductor overlapping with a region between the first conductor and the second conductor;
a first insulator over the third conductor;
a fourth conductor electrically connected to the first conductor through a first opening in the first insulator;
a second insulator over the first insulator and over the fourth conductor in the first opening;
a fifth conductor overlapping with the fourth conductor with the second insulator between the fifth conductor and the fourth conductor in the first opening; and
a sixth conductor electrically connected to the second conductor in a second opening in the first insulator and the second insulator, and
wherein the fifth conductor and the sixth conductor are in contact with a top surface of the second insulator over the first insulator.
2. The semiconductor device according to claim 1 ,
wherein the fourth conductor, the second insulator, and the fifth conductor form a capacitor.
3. The semiconductor device according to claim 1 ,
wherein the semiconductor device comprises a third insulator, and
wherein the third insulator is between the third conductor and the oxide, between the third conductor and the first conductor, and between the third conductor and the second conductor.
4. The semiconductor device according to claim 3 ,
wherein the third insulator is in contact with the first insulator.
5. The semiconductor device according to claim 1 ,
wherein the fifth conductor and the sixth conductor comprise the same material.
6. The semiconductor device according to claim 1 ,
wherein the fifth conductor and the sixth conductor are formed in the same step.
7. The semiconductor device according to claim 1 ,
wherein the oxide comprises indium, an element M, and zinc, and
wherein the element M is aluminum, gallium, yttrium, or tin.
8. A semiconductor device comprising:
a transistor comprising a semiconductor layer comprising a channel region, a first conductor and a second conductor apart from each other over the semiconductor layer, and a third conductor over the semiconductor layer and overlapping with a region between the first conductor and the second conductor;
a first insulator over the third conductor; and
a capacitor comprising a fourth conductor, a second insulator, and a fifth conductor,
wherein the fourth conductor is electrically connected to the first conductor through a first opening in the first insulator,
wherein the second insulator is over the first insulator and over the fourth conductor in the first opening,
wherein the fifth conductor overlaps with the fourth conductor with the second insulator between the fifth conductor and the fourth conductor in the first opening, and
wherein in a plan view, an angle between a channel length direction of the transistor and a direction in which the fifth conductor extends is greater than 0 and smaller than 90°.
9. The semiconductor device according to claim 8 ,
wherein the semiconductor device comprises a third insulator, and
wherein the third insulator is between the third conductor and the semiconductor layer, between the third conductor and the first conductor, and between the third conductor and the second conductor.
10. The semiconductor device according to claim 9 ,
wherein the third insulator is in contact with the first insulator.
11. The semiconductor device according to claim 8 , further comprising:
a sixth conductor electrically connected to the second conductor in a second opening in the first insulator and the second insulator,
wherein the fifth conductor and the sixth conductor are in contact with a top surface of the second insulator over the first insulator.
12. The semiconductor device according to claim 11 ,
wherein the fifth conductor and the sixth conductor comprise the same material.
13. The semiconductor device according to claim 11 ,
wherein the fifth conductor and the sixth conductor are formed in the same step.
14. The semiconductor device according to claim 8 ,
wherein the semiconductor layer comprises an oxide which comprises indium, an element M, and zinc, and
wherein the element M is aluminum, gallium, yttrium, or tin.