IP Library › Granted Patent US 12,001,702
Granted Patent B2
US 12,001,702 · App. 17/879,880 · Granted Jun 4, 2024

Memory system and method to configure logical blocks

Inventors: Toshiya Matsuda (Yokohama Kanagawa, JP); Hiroki Yoshimoto (Kawasaki Kanagawa, JP)
Assignee: KIOXIA CORPORATION
G06F3/064G06F3/0616G06F3/0659G06F3/0679
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Quick Facts
Patent No.
US 12,001,702
App. No.
17/879,880
Granted
Jun 4, 2024
Kind
B2
Abstract

A memory system includes a non-volatile memory and a controller. The non-volatile memory includes a plurality of memory chips including one or more first memory chips, each first memory chip including a plurality of physical blocks and one or more second memory chips, each second memory chip including a plurality of physical blocks, each memory chip configured to operate independently. The controller can communicate with a host and controls the non-volatile memory. The controller configures a first logical block by parallelizing physical blocks of each of one or more first memory chips and physical blocks of each of one or more second memory chips in an interleaved configuration so that the physical blocks of each of one or more first memory chips and the physical blocks of each of one or more second memory chips can be used simultaneously.

Claims (30)

1. A memory system comprising:

a non-volatile memory including a plurality of memory chips including one or more first memory chips, each first memory chip including a plurality of physical blocks and one or more second memory chips, each second memory chip including a plurality of physical blocks, each memory chip configured to operate independently; and

a controller configured to communicate with a host and control the non-volatile memory,

wherein the controller is configured to:

configure a first logical block by parallelizing the physical blocks of each of the one or more first memory chips and the physical blocks of each of the one or more second memory chips in an interleaved configuration so that the physical blocks of each of the one or more first memory chips and the physical blocks of each of the one or more second memory chips can be used simultaneously;

generate a second logical block from the physical blocks of the first memory chip;

generate a third logical block from the physical blocks of the second memory chip;

divide the physical blocks of each of the one or more first memory chips into a group for the first logical block and a group for the second logical block; and

divide the physical blocks of each of the one or more second memory chips into a group for the first logical block and a group for the third logical block.

2. The memory system according to claim 1 , wherein the first memory chip and the second memory chip have different endurance including reliability, lifetime, and performance.

3. The memory system according to claim 1 , wherein each of the first memory chip and the second memory chip includes a memory cell array in which a plurality of memory cells are arranged in a matrix configuration, and the first memory chip and the second memory chip have different types of cells of the plurality of memory cells, each memory cell containing an amount of information which can be stored.

4. The memory system according to claim 1 , wherein the controller is configured to allocate the first logical block, the second logical block, or the third logical block to each partition having a predetermined size of the non-volatile memory in which logical addresses indicating logical positions on the non-volatile memory are consecutive and which is used by the host to designate a position on the non-volatile memory.

5. The memory system according to claim 1 , wherein the controller is configured to select a data writing destination among the first logical block, the second logical block, and the third logical block.

6. The memory system according to claim 5 , wherein the controller is configured to select the data writing destination on the basis of at least one of an instruction from the host, a data transfer rate applied in an interface with the host, or a size of data transmitted from the host.

7. The memory system according to claim 1 , wherein the controller is configured to count the number of times of data writing to the non-volatile memory for each group and update assignment of the physical blocks to the plurality of groups on the basis of the number of times of data writing for each group.

8. The memory system according to claim 1 , wherein the plurality of memory chips include NAND chips.

9. A method of controlling a non-volatile memory by a controller, the non-volatile memory including a plurality of memory chips including one or more first memory chips, each first memory chip including a plurality of physical blocks and one or more second memory chips, each second memory chip including a plurality of physical blocks, each memory chip configured to operate independently, the method comprising:

configuring a first logical block by parallelizing the physical blocks of each of the one or more first memory chips and the physical blocks of each of the one or more second memory chips in an interleaved configuration so that the physical blocks of each of the one or more first memory chips and the physical blocks of each of the one or more second memory chips can be used simultaneously;

generating a second logical block from the physical blocks of the first memory chip;

generating a third logical block from the physical blocks of the second memory chip;

dividing the physical blocks of each of the one or more first memory chips into a group for the first logical block and a group for the second logical block; and

dividing the physical blocks of each of the one or more second memory chips into a group for the first logical block and a group for the third logical block.

10. The method according to claim 9 , wherein the first memory chip and the second memory chip have different endurance including reliability, lifetime, and performance.

11. The method according to claim 9 , wherein each of the first memory chip and the second memory chip includes a memory cell array in which a plurality of memory cells are arranged in a matrix configuration, and the first memory chip and the second memory chip have different types of cells of the plurality of memory cells, each memory cell containing an amount of information which can be stored.

12. The method according to claim 9 , further comprising:

allocating the first logical block, the second logical block, or the third logical block to each partition having a predetermined size of the non-volatile memory in which logical addresses indicating logical positions on the non-volatile memory are consecutive and which is used by the host to designate a position on the non-volatile memory.

13. The method according to claim 9 , further comprising selecting a data writing destination among the first logical block, the second logical block, and the third logical block.

14. The method according to claim 13 , further comprising selecting the data writing destination on the basis of at least one of an instruction from the host, a data transfer rate applied in an interface with the host, or a size of data transmitted from the host.

15. The method according to claim 9 , further comprising counting the number of times of data writing to the non-volatile memory for each group and updating assignment of the physical blocks to the plurality of groups on the basis of the number of times of data writing for each group.

16. The method according to claim 9 , wherein the plurality of memory chips include NAND chips.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2022
From: MATSUDA, TOSHIYA; YOSHIMOTO, HIROKI
To: KIOXIA CORPORATION
Reel/Frame 060704/0698 →
Priority Claims (1)
JP 2022-035432 · Mar 8, 2022 · national
Continuity (1)
Related Publication 20230289080A1 · Sep 14, 2023
Cited By (1)
US 12,321,278