IP Library › Granted Patent US 12,002,695
Granted Patent B2
US 12,002,695 · App. 17/343,765 · Granted Jun 4, 2024

Transport system and determination method

Inventors: Haruhiko Tan (Kobe, JP); Avish Ashok Bharwani (Santa Clara, CA); Simon Jeyapalan (Newark, CA)
Assignees: KAWASAKI JUKOGYO KABUSHIKI KAISHA; KAWASAKI ROBOTICS (USA), INC
H01L21/67265H01L21/67769H01L21/67778H01L21/681H01L21/6838H01L21/68707
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Quick Facts
Patent No.
US 12,002,695
App. No.
17/343,765
Granted
Jun 4, 2024
Kind
B2
Abstract

A transport system includes a robot, sensors (an aligner sensor, a protrusion detecting sensor) and a controller. The robot having a hand which supports a wafer and transports the wafer to an aligner apparatus. The sensor detects the position of the wafer before the robot delivers the wafer to the aligner apparatus while supporting the wafer on the hand. The controller determines the positional deviation of the wafer based on a detection value of the sensor.

Claims (59)

1. A transport system for transporting a wafer comprising:

a robot having a hand which supports the wafer and transports the wafer to an aligner apparatus comprising a sensor which detects a position of the wafer as the robot delivers the wafer to the aligner apparatus while supporting the wafer by the hand; and

a determination unit which determines whether a positional deviation of the wafer is an allowable value or lower based on a detection value of the sensor, wherein

in response to the determination unit determining that the positional deviation is the allowable value or lower, a target position of the wafer on the aligner apparatus is corrected; and

in response to the determination unit determining that the positional deviation exceeds the allowable value, a holding position of the wafer by the hand is corrected.

2. The transport system according to claim 1 , wherein

in response to the determination unit determining that the positional deviation of the wafer is the allowable value or lower, the robot continues to transfer the wafer to the aligner apparatus.

3. The transport system according to claim 2 , wherein

in response to the determination unit determining that the positional deviation of the wafer is the allowable value or lower, the robot places the wafer on a corrected target position which is a position on the aligner apparatus calculated by correcting the target position for transporting the wafer based on the positional deviation of the wafer.

4. The transport system according to claim 2 , wherein

in response to the determination unit determining that the positional deviation of the wafer exceeds the allowable value, the robot interrupts a transfer of the wafer to the aligner apparatus.

5. The transport system according to claim 1 , wherein

the sensor is a CCD sensor which detects the position of the edge of the wafer.

6. The transport system according to claim 1 , wherein

the hand is a passive grip hand in which the wafer is placed on the hand and transported without holding the edge of the wafer or an adsorption hand in which the surface of the wafer is sucked with a negative pressure and transported.

7. The transport system according to claim 1 , wherein:

the hand picks up the wafer housed in a housing, and transports the wafer to the aligner apparatus;

the sensor is a light detecting sensor comprising:

a light emitting unit irradiates an inspection light; and

a light receiving unit which receives a light which is the inspection light reflected by the wafer or a light which is the inspection light partly blocked by the wafer and outputs a value corresponding to the light quantity;

the sensor detects the wafer when the aligner apparatus performs alignment of the wafer; and

the sensor detects the wafer plural times while moving the wafer by the hand.

8. The transport system according to claim 1 , further comprising an aligner sensor, wherein

the aligner sensor detects a rotation phase of the wafer, and

the rotation phase is adjusted after the wafer is delivered to the aligner apparatus when it is determined that a notch in the wafer does not face a predetermined direction.

9. The transport system according to claim 1 , wherein

the sensor includes a light emitting unit and a light receiving unit, based on whether or not the light receiving unit receives an inspection light projected by the light emitting unit, detects whether or not the wafer exists between the light emitting unit and the light receiving unit, and

the determination unit obtains positions of the hand plural times when the sensor detects the edge of the wafer, and determines the positional deviation of the wafer based on the positions of the hand.

10. A method of transporting a wafer comprising:

supporting the wafer with a robot having a hand and transporting the wafer by the robot to an aligner apparatus;

detecting, by a sensor, a position of the wafer before the robot delivers the wafer to the aligner apparatus while supporting the wafer by the hand; and

determining a positional deviation of the wafer based on a detection value of the sensor, wherein

determining the positional deviation comprises determining whether or not the positional deviation of the wafer is an allowable value or lower based on the detection value of the sensor,

in response to determining that the positional deviation of the wafer is the allowable value or lower, a target position of the wafer on the aligner apparatus corrected, and transfer of the wafer by the robot to the aligner apparatus is continued; and

in response to determining that the positional deviation exceeds that allowable value, a holding position of the wafer by the hand is corrected.

11. A determination method which determines a positional deviation of a wafer during a transfer of the wafer comprising:

supporting the wafer using a hand of a robot which supports the wafer and transports the wafer to an aligner apparatus comprising a sensor,

detecting a position of the wafer by using the sensor while supporting the wafer by the hand as the robot delivers the wafer to the aligner apparatus, and

determining whether a positional deviation of the wafer is an allowable value or lower based on a detection value of the sensor, wherein

in response to determining that the positional deviation is the allowable value or lower, a target position of the wafer on the aligner apparatus is corrected; and

in response to determining that the positional deviation exceeds the allowable value, a holding position of the wafer by the hand is corrected.

12. The determination method according to claim 11 , wherein:

the hand picks up the wafer housed in a housing, and transports the wafer to the aligner apparatus;

the sensor is a light detecting sensor comprising:

a light emitting unit irradiates an inspection light; and

a light receiving unit which receives a light which is the inspection light reflected by the wafer or a light which is the inspection light partly blocked by the wafer and outputs a value corresponding to the light quantity;

the sensor detects the wafer when the aligner apparatus performs alignment of the wafer; and

the sensor detects the wafer plural times while moving the wafer by the hand.

13. A transport system for transporting a wafer comprising:

a robot having a hand which supports the wafer and transports the wafer to an aligner apparatus;

a sensor which detects a position of the wafer before the robot delivers the wafer to the aligner apparatus while supporting the wafer by the hand; and

a determination unit which determines a positional deviation of the wafer based on a detection value of the sensor, wherein

the determination unit which determines whether or not the positional deviation of the wafer is an allowable value or lower based on the detection value of the sensor,

in response to the determination unit determining that the positional deviation of the wafer is the allowable value or lower, a target position of the wafer on the aligner apparatus is corrected, and the robot continues to transfer the wafer to the aligner apparatus, and

in response to the determination unit determining that the positional deviation exceeds the allowable value, a holding position of the wafer by the hand is corrected.

14. The transport system according to claim 13 , wherein

the target position of the wafer is corrected by moving the target position in a direction opposite to and by a same amount of the positional deviation.

15. The transport system according to claim 13 , wherein

the holding position of the wafer is corrected by removing the wafer from the hand and correcting the holding position with the wafer removed from the hand.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2021
From: TAN, HARUHIKO; BHARWANI, AVISH ASHOK; JEYAPALAN, SIMON
To: KAWASAKI JUKOGYO KABUSHIKI KAISHA; KAWASAKI ROBOTICS (USA), INC.
Reel/Frame 057099/0856 →
Continuity (1)
Related Publication 20220399218A1 · Dec 15, 2022
Cited By (1)
US 12,347,714