Integrated radiator having temperature gradient

1. An integrated radiator having a temperature gradient disposed between a high-temperature device and a low-temperature device, comprising:

a first heat dissipation unit and a second heat dissipation unit which are integrally fixed,

wherein the first heat dissipation unit is configured to maintain the high-temperature device within a first temperature range, the second heat dissipation unit is configured to maintain the low-temperature device within a second temperature range,

a thermal conductive path of the first heat dissipation unit is isolated from a thermal conductive path of the second heat dissipation unit, and

the first heat dissipation unit is physically connected to but thermally separated from the second heat dissipation unit;

wherein the second heat dissipation unit comprises a first heat dissipation plate, a side surface of the first heat dissipation plate facing away from the high-temperature device is kept in contact with the low-temperature device, and a side surface of the first heat dissipation plate facing towards the high-temperature device is provided with an auxiliary heat dissipation channel, and the auxiliary heat dissipation channel is thermally separated from the first heat dissipation unit.

2. The integrated radiator having the temperature gradient of claim 1 , wherein the first heat dissipation unit comprises a heat dissipation base and a second heat dissipation plate which are integrally connected, a side surface of the second heat dissipation plate facing away from the low-temperature device is kept in contact with the high-temperature device, and a temperature gradient of the first heat dissipation unit points to the second heat dissipation plate from the heat dissipation base.

3. The integrated radiator having the temperature gradient of claim 2 , wherein the second heat dissipation plate is kept separated from the second heat dissipation unit, and the heat dissipation base is disposed at a side of the second heat dissipation plate facing away from the second heat dissipation unit.

4. The integrated radiator having the temperature gradient of claim 2 , wherein an insulating air gap is provided between the second heat dissipation plate and the second heat dissipation unit.

5. The integrated radiator having the temperature gradient of claim 2 , wherein a connection portion is provided between the first heat dissipation unit and the second heat dissipation unit, and the connection portion is thermally separated from the f second heat dissipation plate through an insulating air gap.

6. The integrated radiator having the temperature gradient of claim 1 , wherein the auxiliary heat dissipation channel comprises a plurality of heat dissipation fins, the plurality of heat dissipation fins is disposed on the side surface of the first heat dissipation plate facing towards the high-temperature device, a heat dissipation flow channel is formed between adjacent ones of the plurality of heat dissipation fins, and a flow direction of cooling fluid in the heat dissipation flow channel is perpendicular to a temperature gradient of the first heat dissipation unit.

7. The integrated radiator having the temperature gradient of claim 6 , wherein a plurality of heat dissipation flow channels is parallel to each other, and one end of the auxiliary heat dissipation channel is provided with a heat dissipation fan.

8. The integrated radiator having the temperature gradient of claim 6 , wherein a height of each of the plurality of heat dissipation fins is positively correlated with heat value of the low-temperature device acted upon the plurality of heat dissipation fins.

9. The integrated radiator having the temperature gradient of claim 1 , wherein an insulating air gap is provided between the auxiliary heat dissipation channel and the first heat dissipation unit.

10. The integrated radiator having the temperature gradient of claim 5 , wherein one end of the connection portion is connected to a second heat dissipation unit, and another end of the connection portion is connected to the heat dissipation base.

11. The integrated radiator having the temperature gradient of claim 10 , wherein a multi-point connection is formed between the connection portion and the heat dissipation base, so as to compress action areas between the connection portion and the heat dissipation base.

12. The integrated radiator having the temperature gradient of claim 11 , wherein the connection portion comprises a plurality of elongated connecting strips.

13. The integrated radiator having the temperature gradient of claim 5 , wherein the connection portion is made of a thermal insulation material, and the thermal insulation material is thermal insulation plastic.

14. The integrated radiator having the temperature gradient of claim 2 , wherein the second heat dissipation plate is a metal sheet, and the metal sheet is a copper sheet or an aluminum sheet.

15. The integrated radiator having the temperature gradient of claim 6 , wherein the heat dissipation flow channel forms a flow channel structure surrounded on three sides and opened on one side.

16. The integrated radiator having the temperature gradient of claim 6 , wherein the heat dissipation flow channel has an inverted T-shaped structure, a bottom edge of the inverted T-shaped structure is kept connected to the first heat dissipation plate, and an extension direction of the bottom edge of the inverted T-shaped structure is consistent with a flow direction of the cooling fluid of the heat dissipation flow channel.

17. The integrated radiator having the temperature gradient of claim 6 , wherein along an extension direction of the heat dissipation flow channel, the heat dissipation flow channel presents an undulating shape and has different heat dissipation action areas at different action parts.

18. An integrated radiator having a temperature gradient disposed between a high-temperature device and a low-temperature device, comprising:

a first heat dissipation unit and a second heat dissipation unit which are integrally fixed, wherein the first heat dissipation unit is configured to maintain the high-temperature device within a first temperature range, the second heat dissipation unit is configured to maintain the low-temperature device within a second temperature range, a thermal conductive path of the first heat dissipation unit is isolated from a thermal conductive path of the second heat dissipation unit, and the first heat dissipation unit is physically connected to but thermally separated from the second heat dissipation unit;

wherein the first heat dissipation unit comprises a heat dissipation base and a heat dissipation plate which are integrally connected, a side surface of the heat dissipation plate facing away from the low-temperature device is kept in contact with the high-temperature device, and a temperature gradient of the first heat dissipation unit points to the heat dissipation plate from the heat dissipation base;

wherein a connection portion is provided between the first heat dissipation unit and the second heat dissipation unit, and the connection portion is thermally separated from the heat dissipation plate through an insulating air gap;

wherein one end of the connection portion is connected to the second heat dissipation unit, and another end of the connection portion is connected to the heat dissipation base.

19. The integrated radiator having the temperature gradient of claim 18 , wherein a multi-point connection is formed between the connection portion and the heat dissipation base, so as to compress action areas between the connection portion and the heat dissipation base.

20. The integrated radiator having the temperature gradient of claim 19 , wherein the connection portion comprises a plurality of elongated connecting strips.