Systems and methods for immersion-cooled datacenters

1. A thermal management system comprising:

a server computer;

a working fluid in both a liquid phase and a vapor phase; and

a shell defining an immersion chamber, wherein the shell contacts the server computer along a bottom side and lateral walls of the chamber, and the immersion chamber has an opening on a top side such that at least a portion of the liquid phase of the working fluid overflows from the immersion chamber when filled above the lateral walls of the chamber and the vapor phase of the working fluid rises through the opening in the top side;

a collection tank including one or more condensers and a liquid collection area, and wherein the immersion chamber is located above the liquid collection area inside of the collection tank; and

wherein a portion of the server computer defines at least a portion of the immersion chamber.

2. The thermal management system of claim 1 , wherein the server computer includes a substrate, and the shell is connected to the substrate.

3. The thermal management system of claim 2 , wherein the top side is parallel to the substrate.

4. The thermal management system of claim 1 , wherein the server computer includes a heat-generating component, and the opening of the top side of the immersion chamber is vertically above the heat-generating component.

5. The thermal management system of claim 1 , further comprising a working fluid positioned in the immersion chamber and filling the immersion chamber to the opening.

6. The thermal management system of claim 1 , wherein the server computer includes a first heat-generating component and a second heat-generating component, and the first heat-generating component is in the immersion chamber and the second heat-generating component is outside of the immersion chamber.

7. The thermal management system of claim 1 , wherein the server computer includes a heat-generating component and at least a portion of the shell is complementarily shaped to a topography of the heat-generating component.

8. The thermal management system of claim 1 , wherein the shell has at least one fluid direction feature on an outer surface thereof to direct fluid as it overflows from the immersion chamber.

9. An immersion cooling system comprising:

a collection tank with a collection area;

a substrate having at least one heat-generating electronic component thereon, the substrate and heat-generating component positioned in the collection tank and above the collection area;

a shell defining an immersion chamber, wherein the shell contacts the server computer along a bottom side and lateral walls of the chamber, and the immersion chamber has an opening on a top side such that fluid overflows from the immersion chamber when filled above the lateral walls of the chamber, and

wherein a portion of the server computer defines at least a portion of the immersion chamber.

10. The immersion cooling system of claim 9 , further comprising a condenser positioned in the collection tank below the opening of the immersion chamber.

11. The immersion cooling system of claim 9 , further comprising a condenser positioned in a bottom half of the collection tank.

12. The immersion cooling system of claim 9 , further comprising a manifold configured to receive liquid working fluid from the collection area and direct the liquid working fluid to the immersion chamber.

13. The immersion cooling system of claim 12 , wherein the shell is configured to connect to the manifold to receive the liquid working fluid.

14. The immersion cooling system of claim 12 , wherein the manifold is configured to direct the liquid working fluid into the opening of the immersion chamber.

15. The immersion cooling system of claim 9 , further comprising a non-condensable gas vent in the collection tank.

16. The immersion cooling system of claim 9 , wherein a headspace above the heat-generating component is less than a width of the collection tank.

17. A method of thermal management comprising:

introducing a first amount of liquid working fluid to a liquid immersion bath in contact with a heat-generating component of the server computer of claim 1 ;

boiling at least a vaporized portion of the liquid working fluid with the heat-generating component; and

removing a second amount of liquid working fluid less than the first amount.

18. The method of claim 17 , wherein at least part of the second amount leaks out between a shell and a substrate.

19. The method of claim 17 , wherein at least part of the second amount overflows from a top side of a shell.

20. The method of claim 17 , further comprising condensing the vaporized portion with a condenser below the liquid immersion bath.