Antenna installation structure and electronic device
An antenna installation structure includes an antenna substrate, an insulation layer, and a bonding material. The antenna substrate includes a dielectric base including a first main surface and a second main surface, and an antenna conductor and a ground conductor which are on the first main surface and are separated from each other. The insulation layer is in contact with the first main surface of the antenna substrate. The bonding material is between the insulation layer and a radiation side wall of a housing and is in contact with the insulation layer and the radiation side wall. The porosity of the insulation layer is lower than the porosity of the bonding material.
1. An antenna, comprising:
an antenna substrate including a dielectric base including a first main surface and a second main surface, and an antenna conductor and a ground conductor on the first main surface and are separated from each other;
an insulation layer in contact with the first main surface of the antenna substrate; and
a bonding material between the insulation layer and another component and in contact with the insulation layer and the another component; wherein
a porosity of the insulation layer is lower than a porosity of the bonding material.
2. The antenna according to claim 1 , wherein a relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material.
3. The antenna according to claim 1 , wherein a region surrounded by a surface of the antenna conductor facing the ground conductor, a surface of the ground conductor facing the antenna conductor, and the first main surface is filled with the insulation layer.
4. The antenna according to claim 1 , wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the ground conductor.
5. The antenna according to claim 1 , wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the antenna conductor.
6. The antenna according to claim 1 , wherein the antenna substrate includes a bent portion between a portion to be bonded to the bonding material via the insulation layer and another portion.
7. The antenna according to claim 1 , wherein
a relative permittivity of the antenna substrate is lower than a relative permittivity of the insulation layer; and
the relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material.
8. An antenna installation structure, comprising:
an antenna including:
an antenna substrate including a dielectric base including a first main surface and a second main surface, and an antenna conductor and a ground conductor on the first main surface and separated from each other;
an insulation layer in contact with the first main surface of the antenna substrate; and
a bonding material between the insulation layer and another component and in contact with the insulation layer and the another component; wherein
a porosity of the insulation layer is lower than a porosity of the bonding material in an antenna; and
the antenna and the another component are connected to each other.
9. The antenna installation structure according to claim 8 , wherein a relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material.
10. The antenna installation structure according to claim 8 , wherein a region surrounded by a surface of the antenna conductor facing the ground conductor, a surface of the ground conductor facing the antenna conductor, and the first main surface is filled with the insulation layer.
11. The antenna installation structure according to claim 8 , wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the ground conductor.
12. The antenna installation structure according to claim 8 , wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the antenna conductor.
13. The antenna installation structure according to claim 8 , wherein the antenna substrate includes a bent portion between a portion to be bonded to the bonding material via the insulation layer and another portion.
14. The antenna installation structure according to claim 8 , wherein
a relative permittivity of the antenna substrate is lower than a relative permittivity of the insulation layer; and
the relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material.
15. An electronic device, comprising:
the antenna installation structure according to claim 8 , and
a circuit substrate to be connected to the antenna substrate; wherein
the another component is a housing that houses the antenna substrate and the circuit substrate.
16. The electronic device according to claim 15 , wherein a relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material.
17. The electronic device according to claim 15 , wherein a region surrounded by a surface of the antenna conductor facing the ground conductor, a surface of the ground conductor facing the antenna conductor, and the first main surface is filled with the insulation layer.
18. The electronic device according to claim 15 , wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the ground conductor.
19. The electronic device according to claim 15 , wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the antenna conductor.
20. The electronic device according to claim 15 , wherein the antenna substrate includes a bent portion between a portion to be bonded to the bonding material via the insulation layer and another portion.