Electro-migration reduction
The present disclosure provides a structure and a method to reduce electro-migration. An interconnect structure according to the present disclosure includes a conductive feature embedded in a dielectric layer, a capping barrier layer disposed over the conductive feature and the dielectric layer, and an adhesion layer sandwiched between the capping barrier layer and the dielectric layer. The adhesion layer includes a degree of crystallinity between about 40% and about 70%.
1. A method, comprising:
receiving a workpiece including:
a dielectric layer,
a conductive feature embedded in the dielectric layer, and
a barrier layer disposed along an interface between the dielectric layer and the conductive feature to space the conductive feature from the dielectric layer;
selectively depositing a conductive capping layer on top surfaces of the conductive feature and the barrier layer;
after the selectively depositing of the conductive capping layer, selectively forming a first adhesion layer over a top surface of the dielectric layer;
annealing the first adhesion layer to form a second adhesion layer; and
depositing a dielectric capping layer over the conductive capping layer and the second adhesion layer.
2. The method of claim 1 , wherein the selectively depositing a conductive capping layer comprises:
treating the workpiece with a nitrogen-containing plasma.
3. The method of claim 2 ,
wherein the nitrogen-containing plasma comprises ammonia or nitrogen,
wherein the treating comprises a process temperature between about 320° C. and about 500° C.
4. The method of claim 2 , wherein the treating causes the nitrogen- containing plasma to selectively react with hydroxyl groups on the top surface of the dielectric layer.
5. The method of claim 1 , wherein the first adhesion layer comprises a thickness between about 1.5 Å and about 10 Å.
6. The method of claim 1 , wherein the annealing comprises use of a rapid thermal anneal (RTA) process and an anneal temperature between about 800° C. and about 1000° C.
7. The method of claim 1 , wherein the first adhesion layer comprises silicon nitride, silicon oxide, silicon carbide, silicon, titanium oxide, chromium oxide, or aluminum oxide.
8. The method of claim 1 , wherein the second adhesion layer comprises beta silicon nitride, hexagonal silicon oxide, hexagonal silicide carbide, diamond cube silicon, tetragonal titanium oxide, hexagonal chromium oxide, or hexagonal aluminum oxide.
9. The method of claim 1 , wherein the dielectric capping layer comprises aluminum nitride.
10. The method of claim 1 , wherein the selectively depositing of the conductive capping layer comprises use of a metalorganic precursor.
11. A method, comprising:
receiving a workpiece including:
a dielectric layer,
a conductive feature embedded in the dielectric layer, and
a barrier layer disposed along an interface between the dielectric layer and the conductive feature to space the conductive feature from the dielectric layer;
selectively depositing a conductive capping layer on top surfaces of the conductive feature and the barrier layer;
after the selectively depositing of the conductive capping layer, depositing a first adhesion layer over the workpiece using atomic layer deposition (ALD);
annealing the first adhesion layer to form a second adhesion layer; and
depositing a dielectric capping layer over the conductive capping layer and the second adhesion layer.
12. The method of claim 11 , wherein the conductive feature comprises copper and manganese.
13. The method of claim 11 , wherein the barrier layer comprises titanium, titanium nitride, tantalum, tantalum nitride, molybdenum, ruthenium, nickel nitride, tungsten nitride, copper nitride, manganese nitride, or cobalt nitride.
14. The method of claim 11 , wherein the depositing of the dielectric capping layer comprises use of ALD or plasma-enhanced atomic layer deposition (PEALD).
15. The method of claim 11 , wherein the depositing of the dielectric capping layer comprises use of trimethyl aluminum (TMA) and ammonia (NH 3 ).
16. A contact feature, comprising:
a dielectric layer;
a conductive feature embedded in the dielectric layer;
a barrier layer disposed along an interface between the dielectric layer and the conductive feature,
a conductive barrier layer disposed on and in direct contact with top surfaces of the conductive feature and the barrier layer;
an adhesion layer disposed over the dielectric layer and the conductive barrier layer; and
a dielectric barrier layer over the adhesion layer,
wherein the dielectric barrier layer comprises aluminum nitride.
17. The contact feature of claim 16 , wherein the conductive feature comprises copper and manganese.
18. The contact feature of claim 16 , wherein a manganese concentration in a top portion of the conductive feature is greater than a manganese concentration in a bottom portion of the conductive feature.
19. The contact feature of claim 16 , wherein the adhesion layer comprises beta silicon nitride, hexagonal silicon oxide, hexagonal silicide carbide, diamond cube silicon, tetragonal titanium oxide, hexagonal chromium oxide, or hexagonal aluminum oxide.
20. The contact feature of claim 19 , wherein the adhesion layer comprises a degree of crystallinity between about 40% and about 70%.