IP Library Granted Patent US 12,015,037
Granted Patent B2
US 12,015,037 · App. 17/044,994 · Granted Jun 18, 2024

Imaging device and method of manufacturing imaging device

Inventor: Yusuke Moriya (Kumamoto, JP)
Assignee: Sony Semiconductor Solutions Corporation
H01L27/14605G02B5/208H01L27/14621H01L27/14627H01L27/14685
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Quick Facts
Patent No.
US 12,015,037
App. No.
17/044,994
Granted
Jun 18, 2024
Kind
B2
Abstract

To prevent the occurrence of a defect in an infrared-light attenuation filter and prevent a reduction in image quality. An imaging device includes a photoelectric converter, an on-chip lens, a color filter, the infrared-light attenuation filter, and a protective film. The photoelectric converter performs photoelectric conversion depending on incident light. The on-chip lens collects the incident light into the photoelectric converter. Infrared light and visible light of a specified wavelength from among the collected incident light are transmitted through the color filter. The infrared-light attenuation filter attenuates the infrared light from among the collected incident light, and visible light from among the collected incident light is transmitted through the infrared-light attenuation filter. The protective film is arranged adjacent to the infrared-light attenuation filter and protects the infrared-light attenuation filter.

Claims (40)

1. An imaging device, comprising:

a photoelectric converter that performs photoelectric conversion depending on incident light;

an on-chip lens that collects the incident light into the photoelectric converter;

a color filter through which infrared light and visible light of a specified wavelength from among the collected incident light are transmitted;

an infrared-light attenuation filter that attenuates the infrared light from among the collected incident light and through which visible light from among the collected incident light is transmitted; and

a protective film that is arranged adjacent to the infrared-light attenuation filter and protects the infrared-light attenuation filter,

wherein the protective film is arranged adjacent to the color filter,

wherein the infrared-light attenuation filter attenuates the infrared light transmitted through the color filter, and

wherein the protective film has substantially a same refractive index as the color filter.

2. The imaging device according to claim 1 , wherein

the protective film protects the infrared-light attenuation filter when the color filter is formed.

3. The imaging device according to claim 1 , further comprising:

a pixel that includes the photoelectric converter, the on-chip lens, the color filter, the infrared-light attenuation filter, and the protective film; and

an infrared-light pixel that includes an infrared-light transmission filter through which the infrared light from among the collected incident light is transmitted, the photoelectric converter, and the on-chip lens, wherein

the protective film is further arranged on a face of the infrared-light attenuation filter that is adjacent to the infrared-light pixel.

4. The imaging device according to claim 1 , wherein

the protective film is made of an organic material.

5. The imaging device according to claim 1 , wherein

the protective film is made of an inorganic material.

6. The imaging device according to claim 1 , wherein

the protective film is formed by stacking an organic material and an inorganic material.

7. A method of manufacturing an imaging device, the method comprising:

forming a photoelectric converter that performs photoelectric conversion depending on incident light;

forming an on-chip lens that collects the incident light into the photoelectric converter;

forming a color filter through which infrared light and visible light of a specified wavelength from among the collected incident light are transmitted;

forming an infrared-light attenuation filter that attenuates the infrared light from among the collected incident light and through which visible light from among the collected incident light is transmitted; and

forming a protective film that is arranged adjacent to the infrared-light attenuation filter and protects the infrared-light attenuation filter,

wherein the protective film is arranged adjacent to the color filter,

wherein the infrared-light attenuation filter attenuates the infrared light transmitted through the color filter, and

wherein the protective film has substantially a same refractive index as the color filter.

8. An imaging device, comprising:

a photoelectric converter that performs photoelectric conversion depending on incident light;

an on-chip lens that collects the incident light into the photoelectric converter;

a color filter through which infrared light and visible light of a specified wavelength from among the collected incident light are transmitted;

an infrared-light attenuation filter that attenuates the infrared light from among the collected incident light and through which visible light from among the collected incident light is transmitted; and

a protective film that is arranged adjacent to the infrared-light attenuation filter and protects the infrared-light attenuation filter, wherein the protective film is formed by stacking an organic material and an inorganic material.

9. The imaging device according to claim 8 , wherein

the protective film is arranged adjacent to the color filter, and the infrared-light attenuation filter attenuates the infrared light transmitted through the color filter.

10. The imaging device according to claim 8 , wherein

the protective film has substantially a same refractive index as the color filter.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2021
From: MORIYA, YUSUKE
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 054932/0024 →
Priority Claims (1)
JP 2018-076027 · Apr 11, 2018 · national
Continuity (1)
Related Publication 20210151484A1 · May 20, 2021