IP Library › Granted Patent US 12,018,984
Granted Patent B2
US 12,018,984 · App. 17/776,032 · Granted Jun 25, 2024

On-chip temperature-insensitive read-out

Inventors: Fabio Pavanello (Lyons, FR); Dries Van Thourhout (Ghent, BE); Roeland Baets (Deinze, BE)
Assignees: UNIVERSITEIT GENT; IMEC VZW
G01J3/0294G01J3/12G01J3/28G01J2003/1213G01J2003/2879
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Quick Facts
Patent No.
US 12,018,984
App. No.
17/776,032
Granted
Jun 25, 2024
Kind
B2
Abstract

A temperature compensation method for wavelength monitoring using spectrometers on photonic integrated chips and a related temperature-compensated wavelength monitoring device include an optical filter of the chip filters a source signal to provide at least one spectral reference line to a first spectrometer to detect thermal wavelength drifts thereof. At least one spectral line to be monitored is received by the same or another spectrometer of the chip to detect wavelength shifts thereof. The detected thermal drift of the reference line is compared to calibrated thermal drifts for the reference line which is associated with a calibrated thermal drift for the spectral response curve of the spectrometer receiving the spectral line to be monitored. A thermal drift rate for the response curve of the optical filter differs from a thermal drift rate for the response curve of the first spectrometer at least by an amount.

Claims (38)

1. A photonic integrated chip for temperature-compensated wavelength monitoring of at least one spectral line in a predetermined range of operating temperatures of the photonic integrated chip, comprising:

an optical filter having a spectral response curve comprising at least one of a wavelength passband, for selecting at least one spectral reference line from a wavelength continuum in a source signal applicable to the filter, and

a first spectrometer having a spectral response curve comprising a plurality of wavelength channels, an input of the first spectrometer being connected to the optical filter to receive the at least one spectral reference line selected by the filter, the first spectrometer being configured for detecting wavelength drifts of each received spectral reference line in response to temperature variations of the photonic chip;

wherein the first spectrometer or a further spectrometer of the photonic chip is configured for receiving said at least one spectral line to be monitored and for detecting wavelength shifts thereof,

wherein the at least one wavelength passband of the optical filter is spectrally overlapping at least one wavelength channel of the plurality of wavelength channels of the first spectrometer for each temperature in said range of operating temperatures of the photonic integrated chip, and

wherein a thermal wavelength drift rate for the spectral response curve of the optical filter differs from a thermal wavelength drift rate for the spectral response curve of the first spectrometer at least by an amount such that, over the entire range of operating temperatures of the photonic integrated chip, an effective resolving power associated with the spectrometer receiving said at least one spectral line to be monitored is at least 50% of a nominal resolving power in respect of that same spectrometer.

2. The photonic integrated chip according to claim 1 , wherein the first and/or the further spectrometer is provided as one of the group consisting of arrayed waveguide grating, echelle grating, cascaded Mach-Zehnder interferometer, cascaded ring filter.

3. The photonic integrated chip according to claim 1 , wherein the optical filter comprises a high-finesse resonator.

4. The photonic integrated chip according to claim 3 , wherein the high-finesse resonator comprises a ring resonator.

5. The photonic integrated chip according to claim 1 , wherein the optical filter comprises at least one bandpass filter with a wavelength passband smaller than a free spectral range of the first spectrometer.

6. The photonic integrated chip according to claim 1 , wherein adjacent wavelength channels of at least the first spectrometer are partially overlapping in a spectral overlap region such that a spectral line comprised by the spectral overlap region is simultaneously detectable in at least two adjacent wavelength channels above a noise floor.

7. The photonic integrated chip according to claim 1 , wherein the optical filter and each spectrometer are formed in a silicon-on-insulator substrate or are formed in a substrate comprising a silicon nitride-based material or an indium phosphide-based material.

8. The photonic integrated chip according to claim 1 , wherein a photodetector is connected to an output of at least the first spectrometer.

9. The photonic integrated chip according to claim 1 , wherein the first spectrometer is configured for receiving the at least one spectral line to be monitored and the at least one spectral reference line at a same input via an optical combiner structure of the photonic integrated chip,

wherein the first spectrometer is configured for receiving the at least one spectral line to be monitored and the at least one spectral reference line at different inputs.

10. The photonic integrated chip according to claim 1 , wherein the further spectrometer is configured for receiving the at least one spectral line to be monitored at an input thereof.

11. A wavelength monitoring device comprising:

the photonic integrated chip according to claim 1 ,

at least one photodetector for detecting spectral response signals in each of a plurality of spectrometer output channels, and

a processing unit configured for:

receiving the detected spectral response signals from the photodetector as inputs,

determining a thermal wavelength drift of each spectral reference line relative to the spectral response curve of the first spectrometer based on the inputs,

determining, based on the inputs, a wavelength shift of each spectral line to be monitored relative to the spectral response curve of the spectrometer receiving the at least one spectral line to be monitored,

compensating the determined wavelength shift of each spectral line to be monitored by a corresponding temperature compensation value derived from the determined thermal wavelength drifts and calibration data;

wherein the calibration data associates a predetermined thermal wavelength drift of the at least one spectral reference line relative to the spectral response curve of the first spectrometer with a predetermined thermal wavelength drift for the spectral response curve of the first or the further spectrometer relative to a fixed calibration spectral line.

12. The wavelength monitoring device according to claim 11 , wherein the processing unit is further configured for accessing and retrieving the calibration data from a memory storing the calibration data.

13. The wavelength monitoring device according to claim 11 , further comprising a light source connected to the optical filter for providing the source signal applicable to the optical filter, the light source being capable of generating a wavelength continuum.

14. A temperature compensation method for wavelength monitoring using the photonic integrated chip of claim 1 , the method comprising:

applying a source signal comprising a wavelength continuum to the optical filter,

detecting spectrometer response signals in respect of each of a plurality of spectrometer output channels,

based on the plurality of detected spectrometer response signals, determining a thermal wavelength drift of each spectral reference line relative to the first spectrometer spectral response curve, and determining a wavelength shift of each spectral line to be monitored relative to the spectral response curve of the spectrometer receiving the at least one spectral line to be monitored,

comparing the determined thermal wavelength drift of the at least one spectral reference line with a plurality of predetermined thermal wavelength drifts of the at least one spectral reference line relative to the spectral response curve of the first spectrometer to obtain an associated predetermined thermal wavelength drift of the spectral response curve of the spectrometer receiving the at least one spectral line to be monitored relative to a fixed calibration line and independent of the optical filter, or evaluating a parametric model function for the determined thermal wavelength drift of the at least one spectral reference line as function argument to obtain an associated predetermined thermal wavelength drift of the spectral response curve of the spectrometer receiving the at least one spectral line to be monitored relative to a fixed calibration line and independent of the optical filter,

compensating the determined wavelength shift of each spectral line to be monitored by the obtained associated thermal wavelength drift of the spectral response curve of the spectrometer receiving the at least one spectral line to be monitored.

15. The method according to claim 14 , further comprising:

applying a fixed spectral calibration line to the input of the spectrometer configured for receiving the at least one spectral line to be monitored and,

based on the plurality of detected spectrometer response signals, determining a thermal wavelength drift of the spectral response curve of the spectrometer configured for receiving the at least one spectral line to be monitored relative to the fixed spectral calibration line,

recording, for each temperature in the predetermined range of operating temperatures of the photonic integrated chip, the determined thermal wavelength drift of each spectral reference line and, associated thereto, the determined thermal wavelength drift of the spectral response curve of the spectrometer configured for receiving the at least one spectral line to be monitored, the photonic integrated chip being held at a same temperature during recording.

16. A method according to any of the claim 14 , wherein obtaining the associated thermal wavelength drift of the spectrometer configured for receiving the at least one spectral line to be monitored takes into account wavelength dispersion over the plurality of wavelength channels and/or predetermined waveguide geometry statistics for a wafer comprising the photonic integrated chip.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2022
From: PAVANELLO, FABIO
To: IMEC VZW
Reel/Frame 059892/0576 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2022
From: VAN THOURHOUT, DRIES; BAETS, ROELAND
To: UNIVERSITEIT GENT; IMEC VZW
Reel/Frame 059893/0958 →
Priority Claims (1)
EP 19210072 · Nov 19, 2019 · regional
Continuity (1)
Related Publication 20220390280A1 · Dec 8, 2022