Seamlessly integrated microcontroller chip
Techniques in electronic systems, such as in systems comprising a CPU die and one or more external mixed-mode (analog) chips, may provide improvements advantages in one or more of system design, performance, cost, efficiency and programmability. In one embodiment, the CPU die comprises at least one microcontroller CPU and circuitry enabling the at least one CPU to have a full and transparent connectivity to an analog chip as if they are designed as a single chip microcontroller, while the interface design between the two is extremely efficient and with limited in number of wires, yet may provide improved performance without impact to functionality or the software model.
1. A system, comprising:
a first die with a central processing unit (CPU) and a first bridge;
die-to-die interconnects electrically coupled to the first bridge; and
the system is configured to accommodate different configurations, wherein a given instance of the system comprises one of the different configurations, and the different configurations comprise:
a first configuration with a second die with a second bridge, wherein the second die comprises a second CPU and the second bridge is electrically coupled to the die-to-die interconnects, and wherein the CPU and the second CPU are configured to jointly arbitrate shared communication by the first die and the second die via the die-to-die interconnects or shared use of a resource in the system by the first die and the second die; and
a second configuration with a third die with a third bridge and a fourth die with a fourth bridge; wherein the third bridge and the fourth bridge are electrically coupled to the die-to-die interconnects, and wherein the CPU is configured to arbitrate shared communication by the first die, the third die and the fourth die via the die-to-die interconnects or shared use of the resource in the system by the first die, the third die and the fourth die; and
wherein, at runtime of the system, the system is configured to define a width of the die-to-die interconnects in a selected one of the different configurations.
2. The system of claim 1 , wherein the die-to-die interconnects comprise additional signal lines for electrical coupling to the third die or the fourth die, which are not used when the die-to-die interconnects are electrically coupled to the second die.
3. The system of claim 1 , wherein, when the system comprises the second die, at a given time all signal lines in the die-to-die interconnects are allocated to the CPU or the second CPU.
4. The system of claim 1 , wherein, when the system comprises the second die, at a given time a subset of signal lines in the die-to-die interconnects are allocated to the CPU and a second subset of the signal lines in the die-to-die interconnects are allocated to the second CPU.
5. The system of claim 1 , wherein, when the system comprises the second die, at a given time the system is configured to dynamically allocate signals lines in the die-to-die interconnects to the CPU, the second CPU, or both.
6. The system of claim 5 , wherein the dynamic allocation is based at least in part on a predefined performance constraint associated with a service or a function associated with the die, the second die, the third die or the fourth die.
7. The system of claim 6 , wherein the predefined performance constraint comprises an upper bound on a latency.
8. The system of claim 6 , wherein the dynamic allocation is based at least in part on a type of the service or a type of the function.
9. A system, comprising:
a first die with a central processing unit (CPU) and a first bridge;
die-to-die interconnects electrically coupled to the first bridge; and
the system is configured to accommodate different configurations, wherein a given instance of the system comprises one of the different configurations, and the different configurations comprise:
a first configuration with a second die with a second bridge, wherein the second die has a second CPU unrelated to the first bridge and the second bridge, wherein the second bridge is electrically coupled to the die-to-die interconnects, and wherein the CPU is configured to arbitrate shared communication by the first die and the second die via the die-to-die interconnects or shared use of a resource in the system by the first die and the second die; and
a second configuration with a third die with a third bridge and a fourth die with a fourth bridge; wherein the third bridge and the fourth bridge are electrically coupled to the die-to-die interconnects, and wherein the CPU is configured to arbitrate shared communication by the first die, the third die and the fourth die via the die-to-die interconnects or shared use of the resource in the system by the first die, the third die and the fourth die; and
wherein, at runtime of the system, the system is configured to define a width of the die-to-die interconnects in a selected one of the different configurations.
10. The system of claim 9 , wherein the die-to-die interconnects comprise additional signal lines for electrical coupling to the third die or the fourth die, which are not used when the die-to-die interconnects are electrically coupled to the second die.
11. The system of claim 9 , wherein, when the system comprises the second die, at a given time all signal lines in the die-to-die interconnects are allocated to the CPU.
12. The system of claim 9 , wherein, when the system comprises the second die, at a given time a subset of signal lines in the die-to-die interconnects are allocated to the CPU.
13. The system of claim 1 , wherein, when the system comprises the second die, at a given time the system is configured to dynamically allocate signals lines in the die-to-die interconnects to the CPU.
14. A system, comprising:
a first die with a central processing unit (CPU), a second CPU and a first bridge;
die-to-die interconnects electrically coupled to the first bridge; and
the system is configured to accommodate different configurations, wherein a given instance of the system comprises one of the different configurations, and the different configurations comprise:
a first configuration with a second die with a second bridge, wherein the second die has a third CPU unrelated to the first bridge and the second bridge, wherein the second bridge is electrically coupled to the die-to-die interconnects, and wherein the CPU and the second CPU are configured to arbitrate shared communication by the first die and the second die via the die-to-die interconnects or shared use of a resource in the system by the first die and the second die; and
a second configuration with a third die with a third bridge and a fourth die with a fourth bridge; wherein the third bridge and the fourth bridge are electrically coupled to the die-to-die interconnects, and wherein the CPU and the second CPU are configured to arbitrate shared communication by the first die, the third die and the fourth die via the die-to-die interconnects or shared use of the resource in the system by the first die, the third die and the fourth die; and
wherein, at runtime of the system, the system is configured to define a width of the die-to-die interconnects in a selected one of the different configurations.
15. The system of claim 14 , wherein the die-to-die interconnects comprise additional signal lines for electrical coupling to the third die or the fourth die, which are not used when the die-to-die interconnects are electrically coupled to the second die.
16. The system of claim 14 , wherein, when the system comprises the second die, at a given time all signal lines in the die-to-die interconnects are allocated to the CPU or the second CPU.
17. The system of claim 14 , wherein, when the system comprises the second die, at a given time a subset of signal lines in the die-to-die interconnects are allocated to the CPU and a second subset of the signal lines in the die-to-die interconnects are allocated to the second CPU.
18. The system of claim 14 , wherein, when the system comprises the second die, at a given time the system is configured to dynamically allocate signals lines in the die-to-die interconnects to: the CPU, the second CPU, or both.
19. The system of claim 18 , wherein the dynamic allocation is based at least in part on a predefined performance constraint associated with a service or a function associated with the die, the second die, the third die or the fourth die.
20. The system of claim 18 , wherein the dynamic allocation is based at least in part on a type of the service or a type of the function.