IP Library › Granted Patent US 12,027,220
Granted Patent B2
US 12,027,220 · App. 17/536,639 · Granted Jul 2, 2024

One-time-programmable memory

Inventors: Yih Wang (Hsinchu, TW); Hiroki Noguchi (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
G11C17/12G11C11/4074G11C11/4085G11C11/4094G11C17/16H01L21/823425
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Quick Facts
Patent No.
US 12,027,220
App. No.
17/536,639
Granted
Jul 2, 2024
Kind
B2
Abstract

Various one-time-programmable (OTP) memory cells are disclosed. An OTP memory cell includes an additional dopant region that extends at least partially under the gate of a transistor, such as an anti-fuse transistor. The additional dopant region provides an additional current path for a read current. Alternatively, an OTP memory cell includes three transistors; an anti-fuse transistor and two select transistors. The two select transistors can be configured as a cascaded select transistor or as two separate select transistors.

Claims (49)

1. A one-time-programmable (OTP) memory cell, comprising:

an anti-fuse transistor;

a first select transistor operatively connected to the anti-fuse transistor;

a second select transistor operatively connected to the first select transistor, and

a bit line connected to a drain/source region of the second select transistor, wherein the bit line is configured to receive a negative bias voltage during a program operation.

2. The OTP memory cell of claim 1 , wherein the first select transistor and the second select transistor are operatively connected in parallel to a word line read signal line such that the first and the second select transistors form a cascaded select transistor.

3. The OTP memory cell of claim 2 , wherein the cascaded select transistor is connected in series with the anti-fuse transistor.

4. The OTP memory cell of claim 1 , wherein:

a first gate of the first select transistor is operatively connected to a first word line read signal line; and

a second gate of the second select transistor is operatively connected to a second word line read signal line.

5. The OTP memory cell of claim 4 , wherein the first word line read signal line is configured to receive a first bias voltage and the second word line read signal line is configured to receive a second bias voltage.

6. The OTP memory cell of claim 1 , wherein a drain/source region of the anti-fuse transistor is connected to a floating region.

7. A memory device, comprising:

a plurality of one-time-programmable (OTP) memory cells, each OTP memory cell comprising:

an anti-fuse transistor;

a first select transistor operatively connected to the anti-fuse transistor; and

a second select transistor operatively connected to the first select transistor, wherein:

a first word line read signal line is connected to a first gate of the first select transistor; and

a second word line read signal line is connected to a second gate of the second select transistor;

wherein:

the anti-fuse transistor comprises a third gate, a first dopant region that forms a first source/drain region, and a second dopant region that forms a second source/drain region, and

the memory device further comprises a first contact contacting the second dopant region the first contact configured to receive a bias voltage to activate an additional current path.

8. The memory device of claim 7 , wherein the second word line read signal line is connected to the first word line read signal line such that the first and the second select transistors form a cascaded select transistor.

9. The memory device of claim 7 , wherein the first word line read signal line is configured to receive a first bias voltage and the second word line read signal line is configured to receive a second bias voltage.

10. The memory device of claim 7 , wherein

the memory device further comprises:

a third dopant region extending from the first dopant region to under a portion of the third gate; and

a second contact contacting the first dopant region, the second contact configured to receive a bias voltage to activate an additional current path.

11. The memory device of claim 10 , further comprising a conductive element connecting the first contact to a second contact.

12. An electronic device, comprising:

a processing device;

a memory array operatively connected to the processing device, the memory array comprising:

a one-time-programmable (OTP) memory cell, comprising:

an anti-fuse transistor;

a first select transistor operatively connected in series to the anti-fuse transistor;

a second select transistor operatively connected to the first select transistor;

a first word line read signal line connected to a first gate of the first select transistor; and

a second word line read signal line connected to a second gate of the second select transistor and to the first word line read signal line such that the first and the second select transistors form a cascaded select transistor.

13. The electronic device of claim 12 , wherein:

the anti-fuse transistor comprises the first gate, a first dopant region that forms a first source/drain region, and a second dopant region that forms a second source/drain region;

the first select transistor comprises the second gate, the second dopant region that forms a third source/drain region, and a third dopant region that forms a fourth source/drain region; and

the OTP memory cell further comprises a fourth dopant region that connects to the first dopant region and extends partially under the first gate of the anti-fuse transistor, the additional fourth dopant region creating an additional current path for a read current.

14. The electronic device of claim 13 , wherein the OTP memory cell further comprises a halo region formed between the first dopant region and the fourth dopant region and adjacent the first dopant region.

15. The electronic device of claim 13 , wherein the OTP memory cell further comprises a halo region formed between the second dopant region and the third dopant region and adjacent the second dopant region.

16. The electronic device of claim 13 , wherein the first dopant region, the second dopant region, the third dopant region, and the fourth dopant region are formed with a dopant or dopants having a first conductivity type.

17. The OTP memory cell of claim 1 , wherein the first word line read signal line is electrically connected to the second word line read signal line.

18. The OTP memory cell of claim 1 , wherein the anti-fuse transistor comprises a first dopant region that forms a first source/drain region, and a second dopant region that forms a second source/drain region, and a first contact contacting the second dopant region, the first contact configured to receive a bias voltage to activate an additional current path.

19. The memory device of claim 7 , wherein the second select transistor is connected to a bit line.

20. The memory device of claim 7 , wherein the second select transistor includes a first source/drain region connected to a bit line, and a second source/drain region connected to a first source/drain region of the first select transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2021
From: WANG, YIH; NOGUCHI, HIROKI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 058228/0208 →
Continuity (2)
Division 16803202 · Feb 27, 2020
Related Publication 20220084611A1 · Mar 17, 2022
Cited By (1)
US 12,518,841