Surface cleaning with directed high pressure chemistry

1. A cleaning chamber comprising:

a substrate support comprising a substrate seating position; and

a plurality of fluid nozzles facing the substrate support, wherein each fluid nozzle of the plurality of fluid nozzles is aligned and is angled relative to the substrate seating position of the substrate support, each fluid nozzle delivering a fluid in a non-overlapping respective spray pattern characterized by a leading edge and a trailing edge, wherein each leading edge of each non-overlapping respective spray pattern contacts the substrate at an interior angle of greater than or about 90°.

2. The cleaning chamber of claim 1 , wherein each fluid nozzle is operable to deliver a fluid at greater than or about 500 psi.

3. The cleaning chamber of claim 1 , wherein the plurality of fluid nozzles is a first plurality of fluid nozzles, and wherein the cleaning chamber comprises a second plurality of fluid nozzles.

4. The cleaning chamber of claim 3 , wherein the first plurality of fluid nozzles is directed towards the substrate seating position in a first direction, and wherein the second plurality of fluid nozzles is directed towards the substrate seating position in a second direction opposite the first direction.

5. The cleaning chamber of claim 3 , wherein each fluid nozzle of the first plurality of fluid nozzles is separated from each adjacent fluid nozzle of the first plurality of fluid nozzles by a gap, and wherein each fluid nozzle of the second plurality of fluid nozzles is positioned in line with a gap between two fluid nozzles of the first plurality of fluid nozzles.

6. The cleaning chamber of claim 3 , wherein each fluid nozzle of the first plurality of fluid nozzles is disposed along a line in a first direction across the cleaning chamber, and wherein each fluid nozzle of the second plurality of fluid nozzles is disposed along a line in a second direction across the cleaning chamber normal to the first direction.

7. The cleaning chamber of claim 3 , further comprising:

a first cleaning fluid reservoir fluidly coupled with the first plurality of fluid nozzles within the cleaning chamber; and

a second cleaning fluid reservoir fluidly coupled with the second plurality of fluid nozzles within the cleaning chamber.

8. The cleaning chamber of claim 7 , wherein the first cleaning fluid reservoir comprises a first cleaning fluid, and wherein the second cleaning fluid reservoir comprises a second cleaning fluid different from the first cleaning fluid.

9. The cleaning chamber of claim 1 , wherein each fluid nozzle of the plurality of fluid nozzles defines a fluid port; and wherein each fluid port is characterized by a slit opening.

10. A method of substrate cleaning comprising:

positioning a substrate in a substrate cleaning chamber; and

spraying a cleaning fluid, according to a non-overlapping spray pattern, at the substrate from a plurality of fluid nozzles within the substrate cleaning chamber, wherein each fluid nozzle of the plurality of fluid nozzles is angled relative to the substrate such that a leading edge of the non-overlapping spray pattern contacts the substrate at an interior angle greater than or about 90°.

11. The method of substrate cleaning of claim 10 , further comprising:

rotating the substrate within the substrate cleaning chamber while spraying the cleaning fluid.

12. The method of substrate cleaning of claim 11 , wherein the cleaning fluid is sprayed at a fluid pressure of less than or about 250 psi.

13. The method of substrate cleaning of claim 11 , further comprising:

reversing a direction of rotation, and

continuing to spray the cleaning fluid at the substrate.

14. The method of substrate cleaning of claim 10 , wherein the cleaning fluid is sprayed at a fluid pressure of greater than or about 500 psi.

15. The method of substrate cleaning of claim 10 , wherein the cleaning fluid comprises deionized water, hydrofluoric acid, or ammonium hydroxide.

16. The method of substrate cleaning of claim 10 , wherein the cleaning fluid comprises a first cleaning fluid, the method further comprising:

halting spray of the first cleaning fluid; and

spraying a second cleaning fluid at the substrate.

17. The method of substrate cleaning of claim 16 , wherein the plurality of fluid nozzles is a first plurality of fluid nozzles, and wherein the second cleaning fluid is sprayed from a second plurality of fluid nozzles.

18. The method of substrate cleaning of claim 17 , wherein each fluid nozzle of the first plurality of fluid nozzles is disposed along a line in a first direction across the substrate cleaning chamber, and wherein each fluid nozzle of the second plurality of fluid nozzles is disposed along a line in a second direction across the substrate cleaning chamber normal to the first direction.

19. A cleaning chamber comprising:

a substrate support comprising a substrate seating position; and

a plurality of fluid nozzles facing the substrate support, wherein each fluid nozzle of the plurality of fluid nozzles is aligned and defines a fluid port characterized by a non-overlapping spray pattern having a leading edge and a trailing edge, and wherein each fluid nozzle of the plurality of fluid nozzles is angled relative to the substrate seating position of the substrate support so the leading edge of each non-overlapping spray pattern of the fluid port of each fluid nozzle of the plurality of fluid nozzles intersects the substrate at an interior angle of greater than or about 90°.

20. The cleaning chamber of claim 19 , wherein the substrate support comprises a rotatable drum, and wherein the plurality of fluid nozzles is coupled along a sidewall of the cleaning chamber outside of the rotatable drum, and wherein each fluid nozzle is operable to deliver a fluid at greater than or about 500 psi.