Wiring substrate
A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad, and a solder resist layer formed on the insulating layer such that the solder resist layer has an opening entirely exposing an upper surface and a side surface of the conductor pad. The conductor layer is formed such that the conductor pad has a pad body extending along a surface of the insulating layer, and a protective layer covering an upper surface and a side surface of the pad body and including material different from material of the pad body, and the pad body of the conductor pad has a notch part formed at a peripheral edge portion of the pad body such that the notch part separates a lower surface of the pad body and the surface of the insulating layer and is filled with the protective layer.
1. A wiring substrate, comprising:
an insulating layer;
a conductor layer formed on the insulating layer and including a conductor pad; and
a solder resist layer formed on the insulating layer such that the solder resist layer has an opening entirely exposing an upper surface and a side surface of the conductor pad of the conductor layer,
wherein the conductor layer is formed such that the conductor pad has a pad body extending along a surface of the insulating layer, and a protective layer covering an upper surface and a side surface of the pad body and comprising a material different from a material of the pad body, and the pad body of the conductor pad has a notch part formed at a peripheral edge portion of the pad body such that the notch part separates a lower surface of the pad body and the surface of the insulating layer and is filled with the protective layer.
2. The wiring substrate according to claim 1 , wherein the protective layer has a portion in contact with the surface of the insulating layer and forming an outer peripheral edge of the conductor pad.
3. The wiring substrate according to claim 2 , wherein the protective layer has an expansion part at the notch part of the pad body such that the expansion part is expanding toward an outer side of the conductor pad.
4. The wiring substrate according to claim 1 , wherein the notch part of the pad body is formed such that a distance between the lower surface of the pad body and the surface of the insulating layer increases toward an outer periphery of the conductor pad.
5. The wiring substrate according to claim 1 , wherein the conductor pad of the conductor layer is formed such that the notch part of the pad body is formed within a region of ⅓ or less of a thickness of the pad body from the surface of the insulating layer.
6. The wiring substrate according to claim 1 , wherein the wiring substrate has a component mounting surface configured to mount a component, and the conductor layer is formed on an opposite side with respect to the component mounting surface.
7. The wiring substrate according to claim 1 , wherein the conductor layer is formed such that the conductor pad has a rectangular planar shape.
8. The wiring substrate according to claim 1 , wherein the conductor pad of the conductor layer is formed such that the pad body includes copper and that the protective layer includes nickel.
9. The wiring substrate according to claim 8 , wherein the protective layer includes a nickel layer, a palladium layer, and a gold layer.
10. The wiring substrate according to claim 2 , wherein the notch part of the pad body is formed such that a distance between the lower surface of the pad body and the surface of the insulating layer increases toward an outer periphery of the conductor pad.
11. The wiring substrate according to claim 2 , wherein the conductor pad of the conductor layer is formed such that the notch part of the pad body is formed within a region of ⅓ or less of a thickness of the pad body from the surface of the insulating layer.
12. The wiring substrate according to claim 2 , wherein the wiring substrate has a component mounting surface configured to mount a component, and the conductor layer is formed on an opposite side with respect to the component mounting surface.
13. The wiring substrate according to claim 2 , wherein the conductor pad of the conductor layer is formed such that the pad body includes copper and that the protective layer includes nickel.
14. The wiring substrate according to claim 13 , wherein the protective layer includes a nickel layer, a palladium layer, and a gold layer.
15. The wiring substrate according to claim 3 , wherein the notch part of the pad body is formed such that a distance between the lower surface of the pad body and the surface of the insulating layer increases toward an outer periphery of the conductor pad.
16. The wiring substrate according to claim 3 , wherein the conductor pad of the conductor layer is formed such that the notch part of the pad body is formed within a region of ⅓ or less of a thickness of the pad body from the surface of the insulating layer.
17. The wiring substrate according to claim 3 , wherein the wiring substrate has a component mounting surface configured to mount a component, and the conductor layer is formed on an opposite side with respect to the component mounting surface.
18. The wiring substrate according to claim 3 , wherein the conductor pad of the conductor layer is formed such that the pad body includes copper and that the protective layer includes nickel.
19. The wiring substrate according to claim 18 , wherein the protective layer includes a nickel layer, a palladium layer, and a gold layer.
20. The wiring substrate according to claim 4 , wherein the conductor pad of the conductor layer is formed such that the notch part of the pad body is formed within a region of ⅓ or less of a thickness of the pad body from the surface of the insulating layer.