IP Library Granted Patent US 12,027,787
Granted Patent B2
US 12,027,787 · App. 17/366,619 · Granted Jul 2, 2024

Antenna module, communication device in which antenna module is installed, and method of manufacturing antenna module

Inventor: Naoki Gouchi (Kyoto, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01Q9/0407H01Q1/243H01Q1/38H01Q1/48H01Q5/378H01Q9/0414H01Q21/065H01Q21/08
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Quick Facts
Patent No.
US 12,027,787
App. No.
17/366,619
Granted
Jul 2, 2024
Kind
B2
Abstract

An antenna module is to be installed in a communication device. The antenna module includes a dielectric substrate that has a multilayer structure, a ground electrode that is disposed in the dielectric substrate, and a first radiating element that has a flat plate shape. The first radiating element has a first surface (a smooth surface) and a second surface (a rough surface) that has a higher degree of surface roughness than that of the smooth surface. The smooth surface of the first radiating element faces the ground electrode.

Claims (37)

1. An antenna module comprising:

a dielectric substrate;

a ground electrode in the dielectric substrate;

a first radiating element that has a flat plate shape; and

a second radiating element that faces the first radiating element,

wherein the first radiating element has a first surface and a second surface that has a higher degree of a surface roughness than a surface roughness of the first surface,

wherein the first surface of the first radiating element faces the ground electrode,

wherein the second radiating element is in a layer between the first radiating element and the ground electrode,

wherein the second radiating element has a third surface and a fourth surface that has a higher degree of a surface roughness than a surface roughness of the third surface, and

wherein the fourth surface of the second radiating element faces the ground electrode.

2. The antenna module according to claim 1 , wherein the first radiating element is a driven element, and the second radiating element is a parasitic element.

3. The antenna module according to claim 2 , further comprising a power supply circuit that transmits a radio frequency signal to the driven element.

4. The antenna module according to claim 1 , wherein the first radiating element is a parasitic element, and the second radiating element is a driven element.

5. The antenna module according to claim 1 , wherein the ground electrode has a fifth surface and a sixth surface that has a higher degree of a surface roughness than a surface roughness of the fifth surface, and

wherein the sixth surface of the ground electrode faces the first radiating element.

6. The antenna module according to claim 1 , wherein the antenna module comprises radiating elements that include the first radiating element,

wherein the radiating elements face each other, and

wherein the radiating elements are in the dielectric substrate.

7. The antenna module according to claim 1 , wherein the antenna module comprises radiating elements that include the first radiating element,

wherein the radiating elements face each other, and

wherein at least one of the radiating elements is in a housing of a communication device.

8. The antenna module according to claim 1 , further comprising:

a third radiating element;

another dielectric substrate comprising the third radiating element; and

a connection substrate that connects the dielectric substrate to the other dielectric substrate,

wherein the connection substrate includes:

a flat first portion,

a bent portion that is bent from the flat first portion, and

a flat second portion that extends from the bent portion, and

wherein the dielectric substrate is in the flat first portion, and the other dielectric substrate is in the flat second portion.

9. A communication device comprising the antenna module according to claim 1 .

10. A method of manufacturing an antenna module that includes a first layer that contains a first radiating element, a second layer, and a third layer that contains a ground electrode and a second radiating element, each of the first radiating element, the ground electrode, and the second radiating element having a smooth surface and a rough surface, respectively, the smooth surface of the first radiating element having a lower degree of a surface roughness than a surface roughness of the rough surface of the first radiating element, the smooth surface of the ground electrode having a lower degree of a surface roughness than a surface roughness of the rough surface of the ground electrode, and the smooth surface of the second radiating element having a lower degree of a surface roughness than a surface roughness of the rough surface of the second radiating element, the method comprising:

a step of joining the rough surface of the first radiating element to a first dielectric layer to form the first layer;

a step of providing a second dielectric layer to form the second layer;

a step of joining the rough surface of the ground electrode to a first side of a third dielectric layer and joining the rough surface of the second radiating element to a second side of the third dielectric layer to form the third layer, wherein the first and second sides of the third dielectric layer face opposite respective directions;

a step of stacking the second layer on the second side of the third dielectric layer; and

a step of stacking the first layer on the second layer such that the smooth surface of the first radiating element and the smooth surface of the ground electrode face in a same direction, and the smooth surface of the first radiating element faces the ground electrode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2021
From: GOUCHI, NAOKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 056746/0598 →
Priority Claims (1)
JP 2019-006182 · Jan 17, 2019 · national
Continuity (2)
Continuation PCTJP2019051185 · Dec 26, 2019
Related Publication 20210336342A1 · Oct 28, 2021
Cited By (2)
US 12,212,056 US 12,700,680