Insole with embedded sensing system
View Patent ↗An insole with embedded sensing system includes a pressure sensing layer arranged on the insole, an infrared sensing layer arranged inside the insole, and a sensing module installed inside an arch pad integrated with the insole. The sensing module is electrically coupled with the pressure sensing layer and the infrared sensing layer for receiving and processing detected electronic signals.
1. An insole with embedded sensing system, comprising:
a pressure sensing layer, configured on a surface of said insole;
an Infrared sensing layer, configured within said insole; and
a sensing module, configured in an arch support integrated with said insole, coupled to said pressure sensing layer and said Infrared sensing layer to receive and process electrical signals sensed by said pressure sensing layer and said Infrared sensing layer.
2. The insole of claim 1 , further comprising a mutual embedded structure to engage with an inner bottom of a shoe covered with said insole.
3. The insole of claim 2 , wherein said mutual embedded structure includes a plurality of bosses extending from a bottom of said insole to embed with a corresponding concave hole at said inner bottom of said shoe.
4. The insole of claim 1 , wherein said pressure sensing layer comprises a plurality of capacitive pressure sensors or resistive pressure sensors.
5. The insole of claim 1 , wherein said pressure sensing layer is flexible.
6. The insole of claim 1 , wherein said pressure sensing layer includes a plurality of capacitive sensors with different density distribution, which are arranged on a forefoot area, a lateral arch area and a heel area in said insole.
7. The insole of claim 6 , wherein said pressure sensing layer is flexible.
8. The insole of claim 1 , wherein said Infrared sensing layer is flexible.
9. The insole of claim 1 , wherein said sensing module provides program or algorithm to control collection and storage of data.
10. The insole of claim 1 , further comprising an accelerometer, a gyroscope (G-sensor) or a Global Positioning System (GPS) sensor.
11. An insole with embedded sensing system, comprising:
a pressure sensing layer, configured on a surface of said insole;
an Infrared sensing layer, configured within said insole; and
a sensing module, configured in an arch support integrated with said insole, coupled to said pressure sensing layer and said Infrared sensing layer to receive and process electrical signals sensed by said pressure sensing layer and said Infrared sensing layer;
wherein said sensing module includes:
a processing unit to collect and analyze said electrical signals sensed by said pressure sensing layer and said Infrared sensing layer to convert said electrical signals to a corresponding foot pressure distribution and a blood circulation information;
a memory coupled to said processing unit to store said corresponding foot pressure distribution and said blood circulation information;
a wireless data transmission/receiving device coupled to said processing unit to transmit said corresponding foot pressure distribution and said blood circulation information to an external electrical device.
12. The insole of claim 11 , further comprising a mutual embedded structure to engage with an inner bottom of a shoe covered with said insole.
13. The insole of claim 12 , wherein said mutual embedded structure includes a plurality of bosses extending from a bottom of said insole to embed with a corresponding concave hole at said inner bottom of said shoe.
14. The insole of claim 11 , wherein said pressure sensing layer comprises a plurality of capacitive pressure sensors or resistive pressure sensors.
15. The insole of claim 11 , wherein said pressure sensing layer is flexible.
16. The insole of claim 11 , wherein said pressure sensing layer includes a plurality of capacitive sensors with different density distribution, which are arranged on a forefoot area, a lateral arch area and a heel area in said insole.
17. The insole of claim 11 , further comprising an accelerometer, a gyroscope (G-sensor) or a Global Positioning System (GPS) sensor.
18. The insole of claim 11 , wherein said Infrared sensing layer is flexible.
19. The insole of claim 11 , further comprising a power supply unit to provide power to said pressure sensing layer, said Infrared sensing layer, said processing unit, said memory and said wireless data transmission/receiving device.
20. The insole of claim 11 , wherein said wireless data transmission/receiving device is a Bluetooth chip or a WiFi (Wireless Fidelity) device.