Variable thickness extruded mobile device enclosure covers
Enclosure covers for mobile computing devices are often formed from planar sections of sheet metal that form opposing outer-most layers thereof. The enclosure covers generally enclose and protect internal components. Enclosure covers for mobile computing devices are typically made from planar extrusions of aluminum with subsequent computer numerical control (CNC) machining and other processing steps to achieve complex shapes. Machining can be particularly wasteful of material and numerous processing steps are time-consuming and costly. The presently disclosed variable thickness enclosure covers sourced from extruded sheets of variable thickness reduce or eliminate machining and other processing steps typically required to achieve a desired complex shape. This is accomplished by extruding a shape closer to the desired shape of the variable thickness enclosure cover than presently known.
1. A method of manufacturing a variable thickness enclosure cover for a computing device comprising:
extruding a panel having a fixed cross-sectional profile with a first increased thickness feature;
removing portions of the first increased thickness feature at each distal end of the first increased thickness feature to accommodate folding of a perimeter of the extruded panel;
stamping the extruded panel to fold upward at the perimeter of the extruded panel and define the variable thickness enclosure cover;
folding a portion of the perimeter of the stamped panel inward to create an antenna window in the perimeter of the extruded panel; and
filling the antenna window with a molded plastic antenna housing.
2. The method of claim 1 , wherein the fixed cross-sectional profile has a second increased thickness feature, further comprising:
removing portions of the second increased thickness feature at each distal end of the second increased thickness feature to further accommodate folding of the perimeter of the extruded panel.
3. The method of claim 1 , wherein the folded perimeter of the stamped panel is flush with each distal end of the first increased thickness feature absent the removed portions.
4. The method of claim 1 , wherein the folded perimeter of the stamped panel rests against the first increased thickness feature at each distal end of the first increased thickness feature where the portions of the first increased thickness feature are removed.
5. The method of claim 1 , wherein the extruded panel has a curved bottom surface opposite the first increased thickness feature.
6. The method of claim 1 , wherein the first increased thickness feature serves to reinforce the variable thickness enclosure cover for a hinged attachment in a bi-folding device.
7. The method of claim 1 , wherein the first increased thickness feature provides additional source material for the stamping operation.
8. The method of claim 1 , wherein the stamping operation includes:
drawing the extruded panel upward at the perimeter to a natural radius; and
forging the extruded panel to a small radius corner using a tool having an inner corner bead.
9. The method of claim 1 , wherein the stamping operation includes:
using a tool with a relief to permit material from the first increased thickness feature to flow into the relief when stamping a convex curved bottom surface opposite the first increased thickness feature.