IP Library › Granted Patent US 12,031,779
Granted Patent B2
US 12,031,779 · App. 18/216,808 · Granted Jul 9, 2024

Cooling module with leak detector and related systems

Inventors: Mike Holden (Calgary, CA); Seyed Kamaleddin Mostafavi Yazdi (Calgary, CA); Randy Kubik (Calgary, CA)
Assignee: CoolIT Systems, Inc.
F28F27/00G01M3/16H05K7/20254H05K7/20272H05K7/20509F28F2265/16
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Quick Facts
Patent No.
US 12,031,779
App. No.
18/216,808
Granted
Jul 9, 2024
Kind
B2
Abstract

In some respects, concepts disclosed herein generally concern systems, methods and components to detect a presence of a liquid externally of a desired primary flow path through a segment of a fluid circuit, e.g., throughout a cooling loop. Some disclosed concepts pertain to systems, methods, and components to direct seepage or leakage of a liquid coolant toward a lead-detection sensor. As but one example, some disclosed liquid-cooled heat exchangers incorporate a leak-detection sensor, which, in turn, can couple with a computing environment that monitors for detected leaks, and, responsive to an indication of a detected leak, invokes a task to control or to mitigate the detected leak.

Claims (5)

1. A liquid-cooled heat exchanger configured to cool a heat-dissipation component by transferring heat dissipated by the heat-dissipation component to a liquid coolant in the heat exchanger, the heat exchanger comprising:

a heat sink having a first major surface defining a region configured to be placed into thermal contact with a corresponding surface of a heat-dissipation component, wherein such thermal contact conductively transfers heat from the heat-dissipation component to the heat sink, wherein the heat sink has a second major surface positioned opposite the first major surface;

a housing assembly coupled with the heat sink, defining an internal passageway configured to direct a flow of liquid coolant over the second major surface of the heat sink, wherein such flow of liquid coolant convectively transfers heat from the heat sink to the liquid coolant;

a peripheral channel extending at least partially around the region of the first major surface configured to be placed into thermal contact with the heat-dissipation component; and

a liquid-detection sensor positioned in the peripheral channel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2023
From: HOLDEN, MIKE; MOSTAFAVI YAZDI, SEYED KAMALEDDIN; KUBIK, RANDY
To: COOLIT SYSTEMS, INC.
Reel/Frame 064128/0006 →
Continuity (4)
Continuation 17952101 · Sep 23, 2022
Continuation 16851021 · Apr 16, 2020
Provisional Application 62838457 · Apr 25, 2019
Related Publication 20230341198A1 · Oct 26, 2023