IP Library Granted Patent US 12,036,402
Granted Patent B2
US 12,036,402 · App. 17/407,350 · Granted Jul 16, 2024

Cochlear implants including electrode arrays and methods of making the same

Inventors: Paul Vincent Hoffman (Valencia, CA); Matthew Vadim Krywcun (Saugus, CA); Uli Gommel (Valencia, CA); James George Elcoate Smith (Santa Clarita, CA)
Assignee: Advanced Bionics AG
A61N1/0541A61N1/36038A61N1/3752
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Quick Facts
Patent No.
US 12,036,402
App. No.
17/407,350
Granted
Jul 16, 2024
Kind
B2
Abstract

A method of forming a cochlear implant electrode array includes positioning a contact array assembly, which includes at least one carrier and a plurality of contacts on the at least one carrier, in a mold, removing at least a portion of the at least one carrier from the mold without removing the plurality of contacts from the mold, and introducing resilient material into the mold after the at least a portion of the at least one carrier has been removed to form a flexible body.

Claims (36)

1. A method of forming a cochlear implant electrode array including a flexible body, a plurality of electrically conductive contacts on the flexible body and a plurality of lead wires respectively connected to the plurality of electrically conductive contacts, the method comprising the steps of:

forming a contact array assembly by

positioning the electrically conductive contacts and lead wires within a cavity of a fixture in such a manner that one end of each lead wire is connected to a respective electrically conductive contact and the remainder of each lead wire is located outside of the cavity of the fixture, and

forming a carrier that defines a portion of the flexible body by introducing resilient material into the cavity of the fixture while the remainder of each lead wire is located outside of the cavity of the fixture;

removing the contact array assembly from the cavity of the fixture;

positioning the contact array assembly in a curved mold with the remainders of the lead wires located outside of the carrier and free to move relative to the carrier; and

introducing resilient material into the curved mold to complete the flexible body.

2. A method as claimed in claim 1 , wherein

the step of positioning the electrically conductive contacts and lead wires within a cavity of a fixture comprises

positioning a plurality of workpieces in the cavity of the fixture with one end of each lead wire located within a respective workpiece, and

compressing each workpiece to form the electrically conductive contacts and connect one end of a respective lead wire thereto.

3. A method as claimed in claim 1 , wherein

the carrier defines a top surface; and

the step of positioning the contact array assembly in a curved mold comprises positioning the contact array assembly in a curved mold with the remainders of the lead wires located on the top surface of the carrier.

4. A method as claimed in claim 1 , further comprising the step of:

directing the remainder of each lead wire over a wire rest that is located adjacent to the cavity of the fixture.

5. A method as claimed in claim 1 , further comprising the step of:

positioning a tube on the contact array assembly prior to the step of introducing resilient material into the curved mold to complete the flexible body.

6. A method of forming a cochlear implant electrode array including a flexible body, a plurality of electrically conductive contacts on the flexible body and a plurality of lead wires respectively connected to the plurality of electrically conductive contacts, the method comprising the steps of:

forming a contact array assembly by

positioning the electrically conductive contacts within a cavity,

pulling one end of each lead wire out of a wire holder that is located adjacent to the cavity, while at least the portion of the remainder of each lead wire that is coextensive with the cavity remains within the wire holder and outside of the cavity,

connecting the one end of each lead wire to a respective contact, and

forming a carrier that defines a portion of the flexible body by introducing resilient material into the cavity while the remainder of each lead wire is located outside of the cavity;

positioning the contact array assembly in a curved mold with the remainders of the lead wires located outside of the carrier and free to move relative to the carrier; and

introducing resilient material into the curved mold to complete the flexible body.

7. A method as claimed in claim 6 , wherein

the step of positioning the electrically conductive contacts comprises positioning a plurality of workpieces in the cavity with one end of each lead wire located within a respective workpiece, and

the step of connecting the one end of each lead wire to a respective contact comprises compressing each workpiece to form the electrically conductive contacts and connect one end of a respective lead wire thereto.

8. A method as claimed in claim 6 , wherein

the carrier defines a top surface; and

the step of positioning the contact array assembly in a curved mold comprises positioning the contact array assembly in a curved mold with the remainders of the lead wires located on the top surface of the carrier.

9. A method as claimed in claim 6 , further comprising the step of:

directing the remainder of each lead wire over a wire rest that is located adjacent to the cavity.

10. A method as claimed in claim 6 , further comprising the step of:

positioning a tube on the contact array assembly prior to the step of introducing resilient material into the curved mold to complete the flexible body.

Continuity (3)
Continuation 16463957
Provisional Application 62428668 · Dec 1, 2016
Related Publication 20210379365A1 · Dec 9, 2021
Cited By (1)
US 12,420,096