Airgap structures in auto-doped region under one or more transistors
The present disclosure relates to semiconductor structures and, more particularly, to airgap structures in a doped region under one or more transistors and methods of manufacture. The structure includes: a semiconductor material comprising a doped region; one or more sealed airgap structures breaking up the doped region of the semiconductor material; and a field effect transistor over the one or more sealed airgap structures and the semiconductor material.
1. A structure comprising:
a semiconductor material comprising a doped region;
one or more sealed airgap structures breaking up the doped region of the semiconductor material;
a second semiconductor material over the doped region of the semiconductor material and over the one or more sealed airgap structures;
shallow trench isolation regions in the second semiconductor material and above the one or more sealed airgap structures; and
a field effect transistor over the one or more sealed airgap structures and the second semiconductor material,
wherein the one or more sealed airgap structures are sealed with another semiconductor material, the second semiconductor material is above the other semiconductor material, and a first n-well is below the doped region of the semiconductor material in an underlying semiconductor substrate and below the one or more sealed airgap structures.
2. The structure of claim 1 , wherein the doped region comprises an n-type dopant and the shallow trench isolation regions are entirely in the second semiconductor material and entirely above the one or more sealed airgap structures.
3. The structure of claim 1 , wherein the one or more sealed airgap structures comprise discontinuous sealed airgap structures under the field effect transistor.
4. The structure of claim 1 , wherein the one or more sealed airgap structures comprise a single continuous sealed airgap structure under the field effect transistor.
5. The structure of claim 1 , wherein the one or more sealed airgap structures eliminate the doped region under the field effect transistor.
6. The structure of claim 1 , further comprising an amorphous semiconductor material vertically between the field effect transistor and the one or more sealed airgap structures, the one or more sealed airgap structures being plural sealed airgap structures and the amorphous semiconductor extending between the plural sealed airgap structures and contacting to another semiconductor material that seals the plural sealed airgap structures.
7. The structure of claim 6 , wherein the amorphous semiconductor material is below the shallow trench isolation regions formed in the second semiconductor material and the second semiconductor material comprises source and drain regions of the field effect transistor.
8. The structure of claim 1 , further comprising a second n-well in the second semiconductor material above the one or more sealed airgap structures.
9. The structure of claim 1 , wherein the one or more sealed airgap structures are below passive devices.
10. The structure of claim 1 , wherein the one or more sealed airgap structures are below a high performance bipolar junction transistor and a second n-well in the second semiconductor substrate is above the one or more sealed airgap structures.
11. The structure of claim 1 , further comprising a high breakdown bipolar junction transistor wherein the n-well below the doped region of the semiconductor material is remote from the one or more sealed airgap structures, and the high breakdown bipolar junction transistor being on a side of the one or more sealed airgap structures.
12. A structure comprising:
a bipolar junction transistor comprising at least a sub-collector within an underlying substrate, the sub-collector comprising an n-well within the underlying substrate;
a semiconductor material over the sub-collector comprising a doped region, the doped region being above the sub-collector;
an active device over the semiconductor material; and
at least one airgap structure below the active device and within the doped region of the semiconductor material, the at least one airgap structure being remote from the sub-collector.
13. The structure of claim 12 , further comprising polysilicon material vertically between the at least one airgap structure and the active device, the polysilicon material also extends between plural of the at least one sealed airgap structure and contacts to a semiconductor material that seals the plural sealed airgap structures.
14. The structure of claim 13 , wherein the polysilicon material is below shallow trench isolation regions formed in a semiconductor layer comprising source and drain regions of the active device, the semiconductor layer is above the doped region and entirely above the at least one sealed airgap structure and the shallow trench isolation regions are entirely in the semiconductor layer.
15. The structure of claim 12 , wherein the at least one airgap structure comprises discontinuous sealed airgap structures under the active device and a bottom of the doped region directly contacts a top surface of the sub-collector.
16. The structure of claim 12 , wherein the at least one airgap structure comprises a single continuous sealed airgap structure under the active device.
17. The structure of claim 12 , wherein the at least one airgap structure is below passive devices.
18. The structure of claim 12 , wherein the at least one airgap structure is below a high performance bipolar junction transistor and the semiconductor material having the doped region comprises a same dopant type as the sub-collector and further comprising a second n-well in second semiconductor above the at least one airgap structure.
19. The structure of claim 12 , wherein the active device comprises a RF switching device and the bipolar junction transistor comprises a high breakdown bipolar junction transistor with the sub-collector and the doped region comprising a same dopant type.
20. A method comprising:
forming a semiconductor material comprising a doped region;
forming one or more sealed airgap structures breaking up the doped region of the semiconductor material;
forming a second semiconductor material over the doped region of the semiconductor material and over the one or more sealed airgap structures;
forming shallow trench isolation regions in the second semiconductor material and above the one or more sealed airgap structures; and
forming a field effect transistor over the one or more sealed airgap structures and the semiconductor material,
wherein the one or more sealed airgap structures are sealed with another semiconductor material, the second semiconductor material is above the other semiconductor material, and a first n-well is formed below the doped region of the semiconductor material in an underlying semiconductor substrate and below the one or more sealed airgap structures.