Semiconductor device having a gate contact over an active region

1. A semiconductor device comprising:

an active region;

a gate extending in a first direction over the active region and having side portions and a middle portion between the side portions along the first direction, the side portions and the middle portion are ordered as side portion, middle portion, and side portion in the first direction, wherein the side portions and the middle portion are over the active region, the side portions and the middle portion each has a thickness extending from a first side surface of the gate to a second side surface opposite to the first side surface in a second direction, wherein the second direction is perpendicular to the first direction, and the thickness of the middle portion is wider than the thickness of the side portions in the second direction; and

a first gate contact over the middle portion.

2. The semiconductor device of claim 1 , wherein the middle portion is horizontally wider than the first gate contact.

3. The semiconductor device of claim 1 , further comprising:

source and drain contacts over the active region, wherein the source and drain contacts are laterally spaced from the side portions of the gate.

4. The semiconductor device of claim 1 , further comprising:

a source over the active region, the source having a top surface;

a drain over the active region, the drain having a top surface; and

the top surface of the source and the top surface of the drain are higher than a top surface of the active region.

5. The semiconductor device of claim 4 , further comprising:

spacer structures separating the gate from the source and the drain.

6. The semiconductor device of claim 1 , wherein a length of each of the side portions of the gate over the active region is at least one point seven (1.7) times a length of the middle portion.

7. The semiconductor device of claim 1 , wherein the middle portion is at least one point two (1.2) times horizontally wider than the first gate contact.

8. The semiconductor device of claim 7 , wherein the middle portion is at least one point three (1.3) times vertically longer than the first gate contact.

9. The semiconductor device of claim 1 , wherein the active region is arranged over a first insulator region and the first insulator region is over a substrate.

10. The semiconductor device of claim 1 , further comprising:

an isolation region adjacent to the active region, wherein the side portions of the gate extend over the isolation region.

11. The semiconductor device of claim 10 , further comprising:

a second gate contact over each of the side portions of the gate over the isolation region.

12. The semiconductor device of claim 1 , wherein end segments of the side portions of the gate are over the active region.

13. The semiconductor device of claim 1 , wherein the gate extends lengthwise in the first direction and the second direction is along a width of the gate.

14. A semiconductor device comprising:

an active region;

a gate having side portions and a middle portion, the middle portion is arranged between the side portions, wherein the side portions and the middle portion are over the active region, and the middle portion is horizontally wider than the side portions;

a first gate contact over the middle portion; and

source and drain contacts over the active region, wherein the source and drain contacts are diagonally spaced from the middle portion of the gate.

15. The semiconductor device of claim 14 , wherein the source and drain contacts are diagonally spaced from the first gate contact.

16. A semiconductor device comprising:

an active region;

a gate having a plurality of side portions and middle portions, wherein the side portions and the middle portions are over the active region, each of the middle portions is arranged between two of the side portions, and the middle portions are horizontally wider than the side portions; and

a gate contact over each of the middle portions, wherein each of the middle portions is at least one point two (1.2) times horizontally wider than the gate contact.

17. The semiconductor device of claim 16 , further comprising:

a source over the active region, the source having a top surface;

a drain over the active region, the drain having a top surface; and

the top surface of the source and the top surface of the drain are higher than a top surface of the active region.

18. A method of fabricating a semiconductor device comprising:

forming a gate over an active region, the gate extending in a first direction over the active region and having side portions and a middle portion between the side portions along the first direction, the side portions and the middle portion are ordered as side portion, middle portion, and side portion in the first direction, wherein the side portions and the middle portion are over the active region, the side portions and the middle portion each has a thickness extending from a first side surface of the gate to a second side surface opposite to the first side surface in a second direction, wherein the second direction is perpendicular to the first direction, and the thickness of the middle portion is horizontally wider than the thickness of the side portions in the second direction; and

forming a first gate contact over the middle portion.

19. The method of claim 18 , wherein forming the gate further comprises:

forming a layer of polysilicon over the active region;

patterning the polysilicon layer to form the side portions and the middle portion of the gate over the active region; and

forming spacer structures at the first and second side surfaces of the gate.

20. The method of claim 19 , further comprising:

forming an epitaxial source and an epitaxial drain over the active region, adjacent the spacer structures; and

forming source and drain contacts over the epitaxial source and the epitaxial drain, wherein the source and drain contacts are diagonally spaced from the middle portion of the gate.