High throughput microprinting process

1. A method of transferring selected microdevices to a receiver substrate, the method comprising:

providing one or more microdevices on a donor substrate, wherein a part of each micro device is coupled to a housing film through a release layer;

providing a holding layer coupled to the receiver substrate;

providing a display coupled to the donor substrate;

aligning the microdevices to the receiver substrate;

moving the microdevices or the receiver substrate to a predefined position;

turning on pixels in the display corresponding to a set of selected microdevices with predefined intensities to release the set of selected microdevices from the donor substrate;

holding the set of selected microdevices on the holding layer coupled to the receiver substrate; and

separating the receiver substrate and donor substrate while the set of selected microdevices stay on the receiver substrate.

2. The method of claim 1 , wherein the holding layer provides temporary bonding to poll the selected set of microdevices from the donor substrate after the release layer is weakened.

3. The method of claim 1 , wherein the holding layer is cured to provide permanent bonding after micro devices are placed on or inside the holding layer.

4. The method of claim 1 , further comprising:

providing a push force element to provide deeper penetration of the transferred set of selected microdevices into the holding layer.

5. The method of claim 1 , further comprising:

turning on a second set of pixels in the display corresponding to a second set of selected microdevices with predefined intensities to release the second set of selected microdevices from the donor substrate;

holding the second set of selected microdevices on the receiver substrate with the holding layer; and

separating the receiver substrate and housing film while the second set of selected microdevices stay on the receiver substrate.

6. The method of claim 1 , further comprising:

providing a global force to poll the microdevices towards the receiver substrate by weakening the release layer.

7. The method of claim 1 , wherein the global force comprises one of: an electromagnetic force or an electrostatic force.

8. The method of claim 1 , wherein the microdevices are charged or biased and a global electrode underneath the receiver substrate attracts the microdevices in case the electrostatic force is applied to the receiver substrate.

9. The method of claim 1 , wherein the step of turning on pixels in the display corresponding to a set of selected microdevices with predefined intensities further comprising curing a part of the holding layer associated with the set of selected microdevices.

10. The method of claim 1 , wherein the holding layer is a single or a patterned layer.

11. The method of claim 1 , wherein the display comprises an array of light emitting diodes or a light modulation device.

12. The method of claim 1 , wherein the display has a higher resolution than the microdevices on the donor substrate.

13. The method of claim 1 , further comprising:

providing a light guide or light confinement structure over the display to focus the light of each pixel directly to a surface of the housing film.

14. The method of claim 1 , wherein the housing film comprises a polymer.

15. The method of claim 1 , wherein providing a display coupled to the donor substrate comprising:

aligning the donor substrate to the display directly or through the light guide structure.

16. The method of claim 15 , wherein the display is bonded to the donor substrate after alignment.

17. The method of claim 1 , wherein the display has a pickup force that can pick up the donor substrate.

18. The method of claim 1 , wherein the donor substrate is placed in a template, wherein the template can hold one or more donor substrates during the transfer process.

19. The method of claim 15 , wherein the display is projected on the donor substrate to weaken the release layer for selected microdevices.

20. The method of claim 15 , wherein the display comprises an array of heating or mechanical actuators.

21. The method of claim 1 , wherein the housing film is partially supporting the selected microdevices on the receiver substrate.

22. The method of claim 1 , wherein the release layer includes a layer converting light to heat causing ablation and pushing the microdevices out of housing toward the receiver substrate.