Electronic device and method of manufacturing the same
An electronic device according to an embodiment of the inventive concept includes a display panel in which a first display area and a second display area having a higher transmittance than the first display area are defined, an electronic module disposed below the second display area of the display panel, a circuit board which is connected to the display panel and on which the electronic module is mounted, and an intermediate layer disposed between the electronic module and the display panel, and the electronic module and the circuit board do not overlap each other when viewed in a plane, so that the electronic device may be made thinner, and performance of the electronic module included in the electronic device may be improved.
1. An electronic device comprising:
a display panel including a first display area and a second display area having a higher transmittance than the first display area;
a cover layer disposed on a lower portion of the display panel;
an electronic module disposed below the cover layer and second display area of the display panel;
a circuit board connected to the display panel and on which the electronic module is mounted; and
an intermediate layer disposed between the electronic module and the display panel,
wherein a cover opening overlapping the electronic module is included in the cover layer and the intermediate layer is disposed in at least a center region of the cover opening,
wherein the electronic module and the circuit board do not overlap each other when viewed in a plane.
2. The electronic device of claim 1 , wherein the electronic module is electrically connected to the circuit board.
3. The electronic device of claim 2 , further comprising:
a connector disposed on the circuit board; and
a module circuit board configured to connect the connector and the electronic module.
4. The electronic device of claim 3 , wherein the intermediate layer is an adhesive layer that attaches the electronic module to the display panel,
wherein the intermediate layer includes an optically clear resin (OCR) or an optically clear adhesive (OCA).
5. The electronic device of claim 1 , further comprising:
a filler layer in contact with at least a portion among a side surface of the intermediate layer and a side surface of the electronic module.
6. The electronic device of claim 1 , wherein the intermediate layer comprises:
a metal.
7. The electronic device of claim 1 , wherein the intermediate layer comprises:
an anisotropic conductive film (ACF) including conductive particles.
8. The electronic device of claim 1 , wherein a board opening is included in the circuit board, and the electronic module is disposed in the board opening.
9. The electronic device of claim 1 , wherein the electronic module is in contact with a bottom surface of the intermediate layer, and the intermediate layer is in contact with a bottom surface of the display panel.
10. The electronic device of claim 1 , wherein the display panel comprises:
a plurality of pixels arranged in the first display area and the second display area,
wherein the plurality of pixels comprise:
a plurality of first pixels arranged in the first display area; and
a plurality of second pixels arranged in the second display area,
wherein the number of the plurality of first pixels arranged per unit surface area is larger than the number of the plurality of second pixels arranged per the unit surface area.
11. The electronic device of claim 1 , wherein the display panel comprises:
a first non-bendable portion in which the first display area and the second display area are included, a bendable portion that extends from the first non-bendable portion and is bent to have a predetermined curvature, and a second non-bendable portion extending from the bendable portion and facing the first non-bendable portion,
wherein the circuit board is connected to the second non-bendable portion.
12. An electronic device comprising:
a display panel having a first display area and a second display area having a higher transmittance than the first display area;
an electronic module disposed below the second display area of the display panel;
a circuit board connected to the display panel and electrically connected to the electronic module; and
an intermediate layer disposed between the electronic module and the display panel,
wherein a board opening is included in the circuit board, and the electronic module is disposed in the board opening, and
the intermediate layer comes in contact with a bottom surface of the display panel,
wherein the intermediate layer comprises an anisotropic conductive film (ACF) including conductive particles or a metal.
13. The electronic device of claim 12 , further comprising:
a cover layer which is disposed on a lower portion of the display panel and in which a cover opening is included,
wherein the electronic module is disposed to overlap the cover opening.