IP Library Granted Patent US 12,057,326
Granted Patent B2
US 12,057,326 · App. 17/389,883 · Granted Aug 6, 2024

Substrate processing apparatus and substrate processing method

Inventors: Shota Umezaki (Koshi, JP); Hiroaki Inadomi (Koshi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01L21/67034H01L21/67126H01L21/67383H01L21/67748H01L21/02101
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Quick Facts
Patent No.
US 12,057,326
App. No.
17/389,883
Granted
Aug 6, 2024
Kind
B2
Abstract

A substrate processing apparatus includes a transfer block in which a transfer device configured to transfer a substrate is placed, and a processing block provided adjacent to the transfer block. The processing block includes a liquid film forming unit configured to form a liquid film on a top surface of the substrate which is held horizontally, and a drying unit configured to replace the liquid film with a supercritical fluid to dry the substrate. The drying unit includes a pressure vessel having therein a drying chamber for the substrate, a cover body configured to close an opening of the drying chamber, and a supporting body configured to support the substrate horizontally in the drying chamber. The supporting body is fixed to the drying chamber. The transfer device advances into the drying chamber through the opening of the drying chamber while holding horizontally the substrate having the liquid film thereon.

Claims (48)

1. A substrate processing apparatus comprising a transfer block in which a transfer device configured to transfer a substrate is placed, and a processing block provided adjacent to the transfer block,

wherein the processing block comprises a liquid film forming unit comprising a vessel having therein a spin chuck configured to hold the substrate horizontally and a nozzle configured to discharge a liquid onto a top surface of the substrate to form a liquid film on the top surface of the substrate which is held horizontally, and a drying unit configured to replace the liquid film with a supercritical fluid to dry the substrate,

the drying unit comprises a pressure vessel having therein a drying chamber for the substrate, a cover body configured to close an opening of the drying chamber, and a supporting body configured to support the substrate horizontally in the drying chamber,

the supporting body is fixed to the drying chamber, and

the transfer device advances into the drying chamber through the opening of the drying chamber while holding horizontally the substrate having the liquid film formed thereon.

2. The substrate processing apparatus of claim 1 ,

wherein when viewed from a top, the liquid film forming unit and the drying unit belonging to a same processing block are in contact with a long side of the transfer block having a rectangular shape, and

the opening of the drying chamber is formed toward the transfer block.

3. The substrate processing apparatus of claim 2 ,

wherein multiple sets each including the liquid film forming unit and the drying unit are provided in the same processing block.

4. The substrate processing apparatus of claim 3 ,

wherein when viewed from the top, one set of the liquid film forming unit and the drying unit and another set of the liquid film forming unit and the drying unit are arranged axially symmetrically.

5. The substrate processing apparatus of claim 1 ,

wherein the processing block includes multiple processing blocks, and

the multiple processing blocks are stacked on top of each other in a vertical direction.

6. The substrate processing apparatus of claim 5 ,

wherein the transfer block includes multiple transfer blocks, and

the multiple transfer blocks are stacked on top of each other in the vertical direction.

7. The substrate processing apparatus of claim 1 ,

wherein the processing block includes multiple processing blocks, and

when viewed from a top, the multiple processing blocks are symmetrically arranged with the transfer block therebetween.

8. The substrate processing apparatus of claim 1 ,

wherein the processing block further comprises an inspection unit configured to inspect a coating state of the substrate by the liquid film, and

when viewed from a top, the liquid film forming unit, the inspection unit and the drying unit belonging to a same processing block are arranged at a long side of the transfer block having a rectangular shape in a row in sequence.

9. The substrate processing apparatus of claim 8 ,

wherein the processing block further comprises a cleaning unit configured to radiate an ultraviolet ray to the substrate, and

the cleaning unit and the inspection unit are stacked on top of each other in a vertical direction.

10. The substrate processing apparatus of claim 7 , further comprising:

a second processing block three sides of which are surrounded by the transfer block and two of the processing blocks arranged at opposite sides with the transfer block therebetween, when viewed from the top,

wherein the second processing block comprises an inspection unit configured to inspect a coating state of the substrate by the liquid film.

11. The substrate processing apparatus of claim 1 ,

wherein the processing block comprises an inspection unit configured to inspect a coating state of the substrate by the liquid film, and

the inspection unit and the drying unit are stacked on top of each other in a vertical direction.

12. The substrate processing apparatus of claim 1 , further comprising:

a delivery section in contact with a short side of the transfer block having a rectangular shape when viewed from a top, and configured to deliver the substrate to the transfer device,

wherein the processing block further comprises a supplying unit configured to supply a fluid into the drying unit, and the processing block is in contact with a long side of the transfer block and the delivery section, and

the supplying unit is in contact with the delivery section.

13. A substrate processing method using a substrate processing apparatus comprising a transfer block in which a transfer device configured to transfer a substrate is placed, and a processing block provided adjacent to the transfer block,

wherein the processing block comprises a liquid film forming unit comprising a vessel having therein a spin chuck configured to hold the substrate horizontally and a nozzle configured to discharge a liquid onto a top surface of the substrate to form a liquid film on the top surface of the substrate which is held horizontally, and a drying unit configured to replace the liquid film with a supercritical fluid to dry the substrate,

the drying unit comprises a pressure vessel having therein a drying chamber for the substrate, a cover body configured to close an opening of the drying chamber, and a supporting body configured to support the substrate horizontally in the drying chamber,

the supporting body is fixed to the drying chamber, and

wherein the substrate processing method comprises:

forming the liquid film on the top surface of the substrate, which is held horizontally, by the liquid film forming unit;

advancing the transfer device into the drying chamber through the opening of the drying chamber, while holding horizontally the substrate having the liquid film formed thereon by the transfer device;

receiving, in the drying chamber, the substrate from the transfer device and holding the received substrate horizontally by the supporting body;

retreating the transfer device to an outside of the drying chamber through the opening of the drying chamber;

closing the opening of the drying chamber by the cover body; and

replacing, in the drying chamber, the liquid film with the supercritical fluid to dry the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2021
From: UMEZAKI, SHOTA; INADOMI, HIROAKI
To: TOKYO ELECTRON LIMITED
Reel/Frame 057033/0797 →
Priority Claims (1)
JP 2020-135142 · Aug 7, 2020 · national
Continuity (1)
Related Publication 20220044945A1 · Feb 10, 2022