Actively cooled foreline trap to reduce throttle valve drift
Exemplary semiconductor processing systems include a processing chamber defining a processing region. The semiconductor processing systems may include a foreline coupled with the processing chamber. The foreline may define a fluid conduit. The semiconductor processing systems may include a foreline trap coupled with a distal end of the foreline. The semiconductor processing systems may include a removable insert provided within an interior of the foreline trap. The semiconductor processing systems may include a throttle valve coupled with the foreline trap downstream of the removable insert.
1. A semiconductor processing system, comprising:
a processing chamber defining a processing region;
a foreline coupled with the processing chamber, the foreline defining a fluid conduit;
a foreline trap having an inlet coupled with a distal end of the foreline;
a removable insert provided within an interior of the foreline trap, the removable insert comprising a solid base, wherein a distal end of the solid base is removably coupled with a flange, the flange comprising a protrusion;
a cooling fluid source;
a cooling block removably coupled with the protrusion of the flange;
a fluid line coupling the cooling fluid source with the cooling block, wherein the cooling fluid source is configured to circulate a cooling fluid to the cooling block via the fluid line, and wherein physical contact between the cooling block and the protrusion of the flange creates a heat transfer path that reduces a temperature of the removable insert when the cooling fluid is circulated to the cooling block; and
a throttle valve coupled with an outlet of the foreline trap downstream of the removable insert.
2. The semiconductor processing system of claim 1 , wherein:
the removable insert is characterized by one or more sidewalls that define an open interior; and
at least one sidewall of the one or more sidewalls defines a plurality of apertures extending through a thickness of the at least one sidewall.
3. The semiconductor processing system of claim 2 , wherein:
each of the plurality of apertures has a diameter of between about 3 mm and 25 mm.
4. The semiconductor processing system of claim 2 , wherein:
each of the plurality of apertures has a circular shape.
5. The semiconductor processing system of claim 2 wherein:
each of the plurality of apertures has a same diameter.
6. The semiconductor processing system of claim 2 , wherein:
the solid base of the removable insert is coupled with the one or more sidewalls.
7. The semiconductor processing system of claim 2 , wherein:
each of the one or more sidewalls has a thickness of less than or about 0.5 inches.
8. The semiconductor processing system of claim 1 , further comprising:
an additional foreline coupled with the processing chamber, wherein:
the foreline trap comprises:
a first inlet fluidly coupled with the foreline;
a second inlet fluidly coupled with the additional foreline; and
an outlet fluidly coupled with the throttle valve; and
the removable insert is disposed downstream of the first inlet and the second inlet and upstream of the outlet.
9. The semiconductor processing system of claim 1 , further comprising:
a collar that removably couples the removable insert with the foreline trap.
10. The semiconductor processing system of claim 1 , wherein the cooling block forms a heat transfer path between the removable insert and the fluid line.