Bonding systems, and methods of providing a reducing gas on a bonding system
A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.
1. A bonding system comprising:
a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate;
a bond head manifold carried by the bond head assembly, the bond head manifold for receiving a reducing gas from a reducing gas source, and for providing the reducing gas to a bonding area of the bonding system; and
a reducing gas conduit for carrying the reducing gas from the reducing gas source, where the reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area, the reducing gas conduit including a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area, the catalyst being included in a portion of the reducing gas conduit included in the bond head manifold.
2. The bonding system of claim 1 wherein the catalyst includes a noble metal.
3. The bonding system of claim 1 wherein the reducing gas conduit is configured to provide the reducing gas to the bond head assembly carrying the bonding tool.
4. The bonding system of claim 1 wherein the reducing gas conduit includes a heating element.
5. The bonding system of claim 1 wherein the excess reducing species include H+ ions.
6. The bonding system of claim 1 wherein the catalyst is provided in the reducing gas conduit in a mesh configuration.
7. The bonding system of claim 1 wherein the catalyst is provided in the reducing gas conduit in a perforated block configuration.
8. The bonding system of claim 1 wherein the catalyst is provided on an inner surface of the reducing gas conduit.
9. The bonding system of claim 1 wherein the reducing gas conduit is also configured to carry the reducing gas to a substrate oxide reduction chamber, the substrate oxide reduction chamber being configured to receive the substrate prior to bonding of the semiconductor element to the substrate.
10. A bonding system comprising:
a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate;
a bond head manifold carried by the bond head assembly, the bond head manifold for receiving a reducing gas from a reducing gas source, and for providing the reducing gas to a bonding area of the bonding system; and
a reducing gas conduit for carrying the reducing gas from the reducing gas source, where the reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area, the reducing gas conduit including a noble metal structure provided in at least one of (a) a mesh configuration within the reducing gas conduit, (b) a perforated block configuration within the reducing gas conduit, and (c) a configuration covering an inner surface of the reducing gas conduit, the noble metal structure being included in a portion of the reducing gas conduit included in the bond head manifold.
11. The bonding system of claim 10 wherein the noble metal structure is a catalyst for producing excess reducing species in the reducing gas.
12. The bonding system of claim 11 wherein the excess reducing species include H+ ions.
13. The bonding system of claim 10 wherein the reducing gas conduit is configured to provide the reducing gas to the bond head assembly carrying the bonding tool.
14. The bonding system of claim 10 wherein the reducing gas conduit includes a heating element.
15. The bonding system of claim 10 wherein the reducing gas conduit is also configured to carry the reducing gas to a substrate oxide reduction chamber, the substrate oxide reduction chamber being configured to receive the substrate prior to bonding of the semiconductor element to the substrate.
16. A bonding system comprising:
a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate;
a bond head manifold carried by the bond head assembly, the bond head manifold for receiving a reducing gas from a reducing gas source, and for providing the reducing gas to a bonding area of the bonding system; and
a reducing gas conduit for carrying the reducing gas from the reducing gas source, where the reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area, the reducing gas conduit including a catalyst provided in at least one of (a) a mesh configuration within the reducing gas conduit, (b) a perforated block configuration within the reducing gas conduit, and (c) a configuration covering an inner surface of the reducing gas conduit, the catalyst being included in a portion of the reducing gas conduit included in the bond head manifold.
17. The bonding system of claim 16 wherein the catalyst includes a noble metal.
18. The bonding system of claim 16 wherein the reducing gas conduit is configured to provide the reducing gas to the bond head assembly carrying the bonding tool.
19. The bonding system of claim 16 wherein the reducing gas conduit includes a heating element.
20. The bonding system of claim 16 wherein the catalyst is for producing excess reducing species in the reducing gas.
21. The bonding system of claim 20 wherein the excess reducing species include H+ ions.
22. The bonding system of claim 16 wherein the reducing gas conduit is also configured to carry the reducing gas to a substrate oxide reduction chamber, the substrate oxide reduction chamber being configured to receive the substrate prior to bonding of the semiconductor element to the substrate.