Catalyzed metal foil and uses thereof to produce electrical circuits
Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.
1. A method of forming an electrical circuit using a metal foil having a surface bearing a catalyst material, the method comprising:
applying a layer of an organic material to the catalyst material,
and subsequently applying the surface of the metal foil bearing the catalyst material to a surface of a substrate, wherein the surface of the metal foil is roughened by etching;
laminating the metal foil to the substrate;
etching the metal foil, thereby exposing the catalyst material; and
electroless metal plating a first conductor to the exposed catalyst material;
wherein the metal foil is removable; and
wherein the organic material is a copolymer comprising an alkaline-reactive polymer and an alkaline-non-reactive polymer, and at least one of (i) the copolymer has a functional group with a lone pair electron, (ii) the functional group comprises one of nitrogen or sulfur, (iii) the alkaline-reactive polymer comprises at least one of a polyimide, an amide, an ester, or a thioester, or (iv) the ratio of the alkaline-reactive polymer to the alkaline-non-reactive polymer is between 5%:95% and 95%:5% by molecular weight, respectively.
2. The method of claim 1 , wherein the catalyst material is reduced to a catalyst either before the step of applying the surface of the metal foil to the surface of the substrate or after the step of etching the metal foil.
3. The method of claim 1 , further comprising at least one of the steps of:
(i) applying a plating resist in a negative circuit pattern onto the exposed catalyst material before the step of electroless metal plating and removing the plating resist after the step of electroless metal plating;
(ii) before the step of electroless metal plating applying an etching resist in a positive circuit pattern onto the exposed catalyst material, etching catalyst material not covered by the etching resist, and removing the etching resist;
(iii) applying a plating resist over the first conductor in a negative circuit pattern, electrolytically depositing a second conductor to exposed portions of the first conductor, removing the plating resist, and removing portions of the first conductor not covered by the second conductor;
(iv) applying a permanent plating resist in a negative circuit pattern onto the exposed catalyst material, before the step of electroless metal plating.
4. The method of claim 1 , further comprising the following steps, after the step of electroless plating:
electrolytically depositing a second conductor to the first conductor;
applying an etching resist over the second conductor in a positive circuit pattern;
etching the first and second conductor not covered by the etching resist; and
removing the etching resist.
5. The method of claim 1 , wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof.
6. The method of claim 1 , further comprising one of the steps of (i) applying an adhesive layer between the surface of the metal foil bearing the catalyst material and the surface of the substrate or (ii) applying a polymer layer over a surface of the catalyst material and binding the polymer layer with the substrate via a bonding sheet.
7. The method of claim 1 , further comprising the step of applying a layer of a pre-ceramic polymer, a ceramic, a composite of metal oxides, a polymer, an oxidized metal particle, a nitride, or a boride over a surface of the catalyst material.
8. The method of claim 6 , further comprising the step of applying a metal oxide layer over a surface of the catalyst material before the step of applying the polymer layer.
9. The method of claim 1 , wherein the organic material is selected to (i) protect the catalyst material layer from diffusion of the catalyst material, (ii) improve bonding strength of the catalyst material to a substrate, or (iii) absorb mechanical stress between the catalyst layer and a substrate due to temperature change.
10. A method of forming an electrical circuit using a metal foil having a surface bearing a catalyst material, the method comprising:
depositing a coating layer to the surface of the metal foil bearing the catalyst material, wherein the coating layer comprises an organic material the organic material is a copolymer comprising an alkaline-reactive polymer and an alkaline-non-reactive polymer;
the surface of the metal foil is roughened;
applying the surface of the metal foil bearing the catalyst material and the coating layer to a surface of a substrate;
laminating the metal foil to the substrate;
etching the metal foil, thereby exposing the catalyst material; and
electroless metal plating a first conductor to the exposed catalyst material; wherein the metal foil is removable, and at least one of (i) the surface of the metal foil is roughened by etching, (ii) the copolymer has a functional group with a lone pair electron, (iii) the functional group comprises one of nitrogen or sulfur, (iv) the alkaline-reactive polymer comprises at least one of a polyimide, an amide, an ester, or a thioester, or (vi) the ratio of the alkaline-reactive polymer to the alkaline-non-reactive polymer is between 5%:95% and 95%:5% by molecular weight, respectively.
11. The method of claim 10 , wherein the catalyst material is reduced to a catalyst either before the step of applying the surface of the metal foil to the surface of the substrate or after the step of etching the metal foil.
12. The method of claim 10 , wherein at least one of (i) the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof, (ii) the coating layer comprises a polymer, (iii) the coating layer is no more than 500 μm thick, or (iv) the coating layer comprises a pre-ceramic polymer, a ceramic or a composite of metal oxide, polymer, oxidized metal particle, nitride, or boride.
13. The method of claim 10 , further comprising at least one of the steps of (i) applying an adhesive layer between the surface of the metal foil bearing the catalyst material to the surface of the substrate, or (ii) coating the coating layer with a polymer layer.
14. The method of claim 10 , wherein the step of laminating the metal foil to the substrate comprises laminating the coating layer to a bonding sheet.