IP Library › Granted Patent US 12,063,843
Granted Patent B2
US 12,063,843 · App. 17/797,561 · Granted Aug 13, 2024

Heat dissipation film, display module, and electronic device

Inventor: Peng Yang (Beijing, CN)
Assignees: Chengdu BOE Optoelctronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.
H10K59/8794H05K7/20963
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Quick Facts
Patent No.
US 12,063,843
App. No.
17/797,561
Granted
Aug 13, 2024
Kind
B2
Abstract

Provided is a heat dissipation film, including: an elastic cushion layer, provided with a first fingerprint through-hole; a heat dissipation layer, disposed on a first side surface of the elastic cushion layer, wherein the heat dissipation layer is provided with a second fingerprint through-hole, an orthographic projection of the first fingerprint through-hole on the first side surface being within an orthographic projection of the second fingerprint through-hole on the first side surface; and an isolation layer, disposed on the first side surface of the elastic cushion layer, wherein the isolation layer is provided with a third fingerprint through-hole, the orthographic projection of the first fingerprint through-hole on the first side surface being at least overlapped with an orthographic projection of the third fingerprint through-hole on the first side surface, and a surface, distal from the first side surface, of the isolation layer is non-adhesive.

Claims (42)

1. A heat dissipation film, comprising:

an elastic cushion layer, provided with a first fingerprint through-hole;

a heat dissipation layer, disposed on a first side surface of the elastic cushion layer, wherein the heat dissipation layer is provided with a second fingerprint through-hole, an orthographic projection of the first fingerprint through-hole on the first side surface being within an orthographic projection of the second fingerprint through-hole on the first side surface; and

an isolation layer, disposed on the first side surface of the elastic cushion layer, wherein the isolation layer is provided with a third fingerprint through-hole, the orthographic projection of the first fingerprint through-hole on the first side surface being at least overlapped with an orthographic projection of the third fingerprint through-hole on the first side surface, and a surface, distal from the first side surface, of the isolation layer is non-adhesive.

2. The heat dissipation film according to claim 1 , wherein the isolation layer comprises:

a first adhesive layer, disposed on the first side surface of the elastic cushion layer; and

an insulation layer, disposed on a surface, distal from the first side surface, of the first adhesive layer.

3. The heat dissipation layer according to claim 2 , wherein the isolation layer further comprises:

a first protection film, disposed on a surface, distal form the first side surface, of the insulation layer.

4. The heat dissipation film according to claim 2 , wherein the insulation layer is a thermoplastic polyester layer or a polyimide layer.

5. The heat dissipation film according to claim 1 , wherein the orthographic projection of the first fingerprint through-hole on the first side surface is coincident with the orthographic projection of the third fingerprint through-hole on the first side surface.

6. The heat dissipation film according to claim 5 , wherein the isolation layer is disposed in the second fingerprint through-hole.

7. The heat dissipation film according to claim 6 , wherein a first gap is defined between an edge of the isolation layer and an inner side wall of the second fingerprint through-hole.

8. The heat dissipation film according to claim 7 , wherein a width of the first gap ranges from 0.2 mm to 0.3 mm.

9. The heat dissipation film according to claim 1 , wherein the elastic cushion layer is provided with two first fingerprint through-holes;

the isolation layer is provided with two third fingerprint through-holes in one-to-one correspondence to the two first fingerprint through-holes; and

the heat dissipation layer is provided with one second fingerprint through-hole;

wherein the orthographic projections of the two first fingerprint through-holes on the first side surface are both within the orthographic projection of the second fingerprint through-hole on the first side surface.

10. The heat dissipation film according to claim 1 , wherein in a direction perpendicular to the first side surface, a thickness of the isolation layer is less than a depth of the second fingerprint through-hole.

11. The heat dissipation film according to claim 1 , wherein a thickness of the isolation layer ranges from 0.01 mm to 0.02 mm.

12. A display module, comprising: a display panel and a heat dissipation film that are successively stacked, wherein the heat dissipation film comprises:

an elastic cushion layer, provided with a first fingerprint through-hole;

a heat dissipation layer, disposed on a first side surface of the elastic cushion layer, wherein the heat dissipation layer is provided with a second fingerprint through-hole, wherein an orthographic projection of the first fingerprint through-hole on the first side surface is within an orthographic projection of the second fingerprint through-hole on the first side surface; and

an isolation layer, disposed on the first side surface of the elastic cushion layer, wherein the isolation layer is provided with a third fingerprint through-hole, wherein the orthographic projection of the first fingerprint through-hole on the first side surface is at least overlapped with an orthographic projection of the third fingerprint through-hole on the first side surface, and a surface, distal from the first side surface, of the isolation layer is non-adhesive.

13. The display module according to claim 12 , further comprising: a second adhesive layer disposed between the display panel and the heat dissipation film, wherein the second adhesive layer is provided with a fourth fingerprint through-hole communicated with the first fingerprint through-hole;

wherein an orthographic projection of the fourth fingerprint through-hole on the first side surface is coincident with the orthographic projection of the first fingerprint through-hole on the first side surface.

14. The display module according to claim 12 , further comprising:

a second protection film, disposed on a surface, distal from the first side surface, of the heat dissipation layer, wherein the second protection film is provided with a fifth fingerprint through-hole communicated with the second fingerprint through-hole; and

an offset filling layer, disposed in both the second fingerprint through-hole and the fifth fingerprint through-hole.

15. The display module according to claim 12 , wherein the isolation layer comprises:

a first adhesive layer, disposed on the first side surface of the elastic cushion layer; and

an insulation layer, disposed on a surface, distal from the first side surface, of the first adhesive layer.

16. The display module according to claim 15 , wherein the isolation layer further comprises:

a first protection film, disposed on a surface, distal form the first side surface, of the insulation layer.

17. The display module according to claim 15 , wherein the insulation layer is a thermoplastic polyester layer or a polyimide layer.

18. The display module according to claim 12 , wherein the orthographic projection of the first fingerprint through-hole on the first side surface is coincident with the orthographic projection of the third fingerprint through-hole on the first side surface.

19. The display module according to claim 18 , wherein the isolation layer is disposed in the second fingerprint through-hole.

20. An electronic device, comprising: a display module and a fingerprint module disposed in a second fingerprint through-hole;

wherein the display module comprises: a display panel and a heat dissipation film that are successively stacked, wherein the heat dissipation film comprises:

an elastic cushion layer, provided with a first fingerprint through-hole;

a heat dissipation layer, disposed on a first side surface of the elastic cushion layer, wherein the heat dissipation layer is provided with the second fingerprint through-hole, wherein an orthographic projection of the first fingerprint through-hole on the first side surface is within an orthographic projection of the second fingerprint through-hole on the first side surface; and

an isolation layer, disposed on the first side surface of the elastic cushion layer, wherein the isolation layer is provided with a third fingerprint through-hole, wherein the orthographic projection of the first fingerprint through-hole on the first side surface is at least overlapped with an orthographic projection of the third fingerprint through-hole on the first side surface, and a surface, distal from the first side surface, of the isolation layer is non-adhesive.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2022
From: YANG, PENG
To: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 060721/0017 →
Priority Claims (1)
CN 202022694741.8 · Nov 19, 2020 · national
Continuity (1)
Related Publication 20230354683A1 · Nov 2, 2023