Method for fabricating mask, method for fabricating semiconductor device using the mask, and the semiconductor device fabricated using the mask
A semiconductor device is provided. The semiconductor device comprises a substrate including a first region, a second region, and a connecting region placed between the first region and the second region, a plurality of first multi-channel active patterns placed in the first region of the substrate, a plurality of second multi-channel active patterns placed in the second region of the substrate, a first connecting fin type pattern which is placed in the connecting region of the substrate and extends from the first region to the second region in a first direction, and a field insulating film which is placed on the substrate and covers an upper surface of the first connecting fin type pattern, wherein a width of the first connecting fin type pattern in a second direction decreases and then increases as it goes away from the first region, and the first direction is perpendicular to the second direction.
1. A semiconductor device comprising:
a substrate including a first region, a second region, and a connecting region placed between the first region and the second region;
a plurality of first multi-channel active patterns placed in the first region of the substrate;
a plurality of second multi-channel active patterns placed in the second region of the substrate;
a first connecting fin type pattern which is placed in the connecting region of the substrate and extends from the first region to the second region in a first direction; and
a field insulating film which is placed on the substrate and covers an upper surface of the first connecting fin type pattern,
wherein a width of the first connecting fin type pattern in a second direction decreases and then increases as it goes away from the first region, and
the first direction is perpendicular to the second direction.
2. The semiconductor device of claim 1 , wherein the first connecting fin type pattern includes a bridge portion, and a first branch portion and a second branch portion protruding from the bridge portion toward the first region, and
the first branch portion and the second branch portion are spaced apart from each other in the second direction.
3. The semiconductor device of claim 2 , wherein the first connecting fin type pattern includes a third branch portion and a fourth branch portion protruding from the bridge portion toward the second region, and
the third branch portion and the fourth branch portion are spaced apart from each other in the second direction.
4. The semiconductor device of claim 2 , wherein the bridge portion extends to the second region.
5. The semiconductor device of claim 1 , wherein the first connecting fin type pattern is directly connected to two of the first multi-channel active patterns and two of the second multi-channel active patterns.
6. The semiconductor device of claim 1 , wherein the first connecting fin type pattern is directly connected to one of the first multi-channel active patterns and two of the second multi-channel active patterns.
7. The semiconductor device of claim 1 , wherein the first connecting fin type pattern is directly connected to one of the first multi-channel active patterns and one of the second multi-channel active patterns.
8. The semiconductor device of claim 1 , further comprising:
a second connecting fin type pattern placed in the connecting region of the substrate,
wherein an upper surface of the second connecting fin type pattern has a half ring shape.
9. The semiconductor device of claim 1 , further comprising:
a second connecting fin type pattern which is placed in the connecting region of the substrate and extends from the first region to the second region,
wherein a width of the second connecting fin type pattern in the second direction is smaller than the width of the first connecting fin type pattern in the second direction.
10. The semiconductor device of claim 1 , wherein each of the first multi-channel active patterns and the second multi-channel active patterns is a fin type pattern.
11. The semiconductor device of claim 1 , wherein each of the first multi-channel active patterns and the second multi-channel active patterns includes a lower fin type pattern, and a sheet pattern on the lower fin type pattern.
12. A semiconductor device comprising:
a substrate including a first region, a second region, and a connecting region placed between the first region and the second region;
a plurality of first multi-channel active patterns placed in the first region of the substrate;
a plurality of second multi-channel active patterns placed in the second region of the substrate;
a first connecting fin type pattern which is placed in the connecting region of the substrate and extends from the first region to the second region in a first direction; and
a field insulating film which is placed on the substrate and covers an upper surface of the first connecting fin type pattern,
wherein the first connecting fin type pattern includes a bridge portion, and a first branch portion and a second branch portion protruding from the bridge portion toward the first region, and
the first branch portion and the second branch portion are spaced apart from each other in a second direction perpendicular to the first direction.
13. The semiconductor device of claim 12 , wherein the bridge portion extends to the second region, and
a width of the bridge portion in the second direction decreases and then increases, as it goes away from the first branch portion and the second branch portion.
14. The semiconductor device of claim 13 , wherein the bridge portion is directly connected to two or less of the second multi-channel active patterns.
15. The semiconductor device of claim 12 , wherein the first connecting fin type pattern includes a third branch portion and a fourth branch portion protruding from the bridge portion toward the second region, and
the third branch portion and the fourth branch portion are spaced apart from each other in the second direction.
16. The semiconductor device of claim 15 , wherein one or both of the third branch portion and the fourth branch portion are directly connected to the second multi-channel active patterns.
17. The semiconductor device of claim 12 , wherein one or both of the first branch portion and the second branch portion are directly connected to the first multi-channel active patterns.
18. A semiconductor device comprising:
a substrate including a first region, a second region, and a connecting region placed between the first region and the second region;
a plurality of first multi-channel active patterns placed in the first region of the substrate;
a plurality of second multi-channel active patterns placed in the second region of the substrate;
a first connecting fin type pattern which is placed in the connecting region of the substrate and extends from the first region to the second region in a first direction;
a second connecting fin type pattern which is placed in the connecting region of the substrate and has a half ring-shaped upper surface;
a third connecting fin type pattern which is placed between the first connecting fin type pattern and the second connecting fin type pattern, and extends in the first direction along a profile of an outer side wall of the first connecting fin type pattern;
a field insulating film which is placed on the substrate and covers an upper surface of the first connecting fin type pattern, an upper surface of the second connecting fin type pattern, and
an upper surface of the third connecting fin type pattern;
a first gate electrode which extends in a second direction perpendicular to the first direction, on the first multi-channel active patterns; and
a second gate electrode which extends in the second direction, on the second multi-channel active patterns,
wherein a width of the first connecting fin type pattern in the second direction decreases and then increases, as it goes away from the first region.
19. The semiconductor device of claim 18 , wherein the upper surface of the first connecting fin type pattern has a Y shape.
20. The semiconductor device of claim 18 , wherein the upper surface of the first connecting fin type pattern has an X shape.