Hybrid memory system with increased bandwidth
A hybrid memory system with improved bandwidth is disclosed. In one aspect, a memory system is provided that increases bandwidth relative to the JEDEC low-power double data rate version 5 (LPDDR5) standard. This improvement is made possible by increasing a data conductor count from sixteen to twenty-four. Optionally, the bandwidth may be further improved by increasing a clock frequency from a first value to a second value. This allows the hybrid memory system to provide improved bandwidth without the complications of merely doubling pin counts or doubling clock speed. Further, coding techniques tailored to the pin count and pin layout are provided.
1. An integrated circuit (IC) comprising:
a memory bus interface comprising thirty-two pins, wherein:
twenty-four pins correspond to data conductors;
four pins correspond to clock conductors; and
four pins correspond to read strobe clock (RDQS) conductors; and
routing and encoding logic associated with the memory bus interface and configured to route signals to pins within the memory bus interface; and
wherein the thirty-two pins comprise a first group and a second group, wherein the first group comprises:
a first six pins of the twenty-four pins corresponding to the data conductors;
a first two pins of the four pins corresponding to the clock conductors positioned adjacent to the first six pins;
a second two pins of the four pins corresponding to the RDQS conductors adjacent to the first two pins; and
a second six pins of the twenty-four pins corresponding to the data conductors adjacent to the second two pins.
2. The IC of claim 1 , wherein the IC comprises a memory device.
3. The IC of claim 2 , wherein the memory bus interface comprises an input-output (IO) block.
4. The IC of claim 1 , wherein the IC comprises a system on a chip (SoC).
5. The IC of claim 4 , wherein the memory bus interface comprises a physical layer (PHY).
6. The IC of claim 1 , wherein the IC comprises a host.
7. The IC of claim 1 , wherein the first two pins are configured to form a differential clock channel.
8. The IC of claim 1 , wherein the second two pins are configured to form a differential RDQS channel.
9. The IC of claim 1 , wherein the second group comprises:
a third six pins of the twenty-four pins corresponding to the data conductors;
a third two pins of the four pins corresponding to the clock conductors positioned adjacent to the third six pins;
a fourth two pins of the four pins corresponding to the RDQS conductors adjacent to the third two pins; and
a fourth six pins of the twenty-four pins corresponding to the data conductors adjacent to the fourth two pins.
10. The IC of claim 9 , wherein the third two pins are configured to form a differential clock channel.
11. The IC of claim 9 , wherein the fourth two pins are configured to form a differential RDQS channel.
12. The IC of claim 9 , further comprising a third group of additional pins between the first six pins of the twenty-four pins and the third six pins of the twenty-four pins.
13. The IC of claim 12 , wherein the third group of additional pins comprises:
a first command clock pair of pins;
a second command clock pair of pins;
a first set of four command and address pins;
a second set of four command and address pins;
a first chip select pin;
a second chip select pin; and
a reset pin.
14. The IC of claim 13 , wherein the reset pin is centrally located amongst all pins of the memory bus interface.
15. The IC of claim 14 , wherein the first command clock pair of pins is adjacent to the second six pins of the twenty-four pins.
16. The IC of claim 15 , wherein the second command clock pair of pins is adjacent to the third six pins of the twenty-four pins.
17. The IC of claim 15 , wherein the first set of four command and address pins is adjacent to the first command clock pair of pins.
18. The IC of claim 16 , wherein the second set of four command and address pins is adjacent to the second command clock pair of pins.
19. The IC of claim 1 , further comprising a clock source, wherein the clock source is configured to generate a clock signal having a maximum frequency of 4.8 gigahertz (GHz).
20. The IC of claim 1 , further comprising a clock source, wherein the clock source is configured to generate a clock signal having a maximum frequency of 6.4 gigahertz (GHz).
21. The IC of claim 1 , wherein the routing and encoding logic is configured to encode a byte onto two data conductors.
22. The IC of claim 1 , wherein the routing and encoding logic is configured to encode a byte onto three data conductors.
23. The IC of claim 1 , wherein the memory bus interface further comprises a command and address (CA) pin, a command clock pin, a chip select pin, and a reset pin.
24. The IC of claim 1 , integrated into a device selected from the group consisting of: a set top box; an entertainment unit; a navigation device; a communications device; a fixed location data unit; a mobile location data unit; a global positioning system (GPS) device; a mobile phone; a cellular phone; a smart phone; a session initiation protocol (SIP) phone; a tablet; a phablet; a server; a computer; a portable computer; a mobile computing device; a wearable computing device; a desktop computer; a personal digital assistant (PDA); a monitor; a computer monitor; a television; a tuner; a radio; a satellite radio; a music player; a digital music player; a portable music player; a digital video player; a video player; a digital video disc (DVD) player; a portable digital video player; an automobile; a vehicle component; avionics systems; a drone; and a multicopter.
25. The IC of claim 1 , wherein the routing and encoding logic is further configured to send a first error correcting code (ECC) parity bit through two of the four pins corresponding to an RDQS conductor and receive a second ECC parity bit through eight of the twenty-four pins corresponding to a data conductor.
26. The IC of claim 1 , wherein the routing and encoding logic is further configured to send a first error correcting code (ECC) parity bit through eight of the twenty-four pins corresponding to a data conductor and receive a second ECC parity bit through the eight of the twenty-four pins corresponding to the data conductor.
27. The IC of claim 1 , wherein the routing and encoding logic is further configured to send a first error correcting code (ECC) parity bit through one of the four pins corresponding to an RDQS conductor and receive a second ECC parity bit through one of the twenty-four pins corresponding to a data conductor.
28. The IC of claim 1 , wherein the routing and encoding logic is further configured to send a first error correcting code (ECC) parity bit through one of the twenty-four pins corresponding to a data conductor and receive a second ECC parity bit through the one of the twenty-four pins corresponding to the data conductor.
29. The IC of claim 1 , wherein the routing and encoding logic is configured to encode a byte onto four data conductors.
30. A computing device comprising:
a host comprising:
a physical layer (PHY) comprising thirty-two pins, wherein:
twenty-four pins correspond to data conductors;
four pins correspond to clock conductors; and
four pins correspond to read strobe clock (RDQS) conductors; and
routing and encoding logic associated with the PHY and configured to route signals to pins within a memory bus interface;
a memory bus comprising:
twenty-four data conductors;
two differential clock channels; and
two differential RDQS channels;
wherein the conductors comprise a first group and a second group, wherein the first group comprises:
a first six pins of the twenty-four pins corresponding to the data conductors;
a first two pins of the four pins corresponding to the clock conductors positioned adjacent to the first six pins;
a second two pins of the four pins corresponding to the RDQS conductors adjacent to the first two pins; and
a second six pins of the twenty-four pins corresponding to the data conductors adjacent to the second two pins; and
a memory module comprising:
an input-output (IO) block comprising the thirty-two pins corresponding to the conductors of the memory bus.
31. An integrated circuit (IC) comprising:
a memory bus interface comprising:
a plurality of data pins corresponding to data conductors; and
a plurality of clock pins corresponding to clock conductors; and
routing and encoding logic associated with the memory bus interface and configured to encode a byte onto a plurality of data conductors associated with the plurality of data pins, wherein the routing and encoding logic is configured to encode data mask inversion (DMI) information onto at least one data conductor of the plurality of data conductors.
32. The IC of claim 31 , wherein the routing and encoding logic is configured to encode the byte onto two data conductors of the plurality of data conductors.
33. The IC of claim 31 , wherein the routing and encoding logic is configured to encode the byte onto three data conductors of the plurality of data conductors.
34. The IC of claim 31 , wherein the routing and encoding logic is configured to encode the byte onto four data conductors of the plurality of data conductors.
35. An integrated circuit (IC) comprising:
a memory bus interface comprising:
a plurality of data pins corresponding to data conductors; and
a plurality of clock pins corresponding to clock conductors; and
routing and encoding logic associated with the memory bus interface and configured to encode a byte onto a plurality of data conductors associated with the plurality of data pins, wherein the routing and encoding logic is further configured to send a first error correcting code (ECC) parity bit through one data conductor of the plurality of data conductors and receive a second ECC parity bit.