Electrostatic chuck and processing apparatus
An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a bonding part, a gas inlet path, a counterbore part, and a ceramic porous part. The bonding part is located between the ceramic dielectric substrate and the base plate. The gas inlet path extends through the ceramic dielectric substrate, the base plate, and the bonding part. The gas inlet path includes a first hole part, a second hole part, and a third hole part. The first hole part is positioned at the ceramic dielectric substrate. The second hole part is positioned at the base plate. The third hole part is positioned at the bonding part. The counterbore part is located in at least one of the first hole part or the second hole part. The ceramic porous part is located in the counterbore part. The ceramic porous part includes an exposed surface exposed in the third hole part.
1. An electrostatic chuck, comprising:
a ceramic dielectric substrate including
a first major surface on which an object of clamping is placed, and
a second major surface at a side opposite to the first major surface;
a base plate supporting the ceramic dielectric substrate, the base plate including
an upper surface at the ceramic dielectric substrate side, and
a lower surface at a side opposite to the upper surface;
a bonding part located between the ceramic dielectric substrate and the base plate;
a gas inlet path extending through the ceramic dielectric substrate, the base plate, and the bonding part, the gas inlet path including
a first hole part positioned at the ceramic dielectric substrate,
a second hole part positioned at the base plate, and a third hole part positioned at the bonding part;
a counterbore part located in at least one of the first hole part or the second hole part; and
a ceramic porous part located in the counterbore part,
the ceramic porous part including an exposed surface exposed in the third hole part,
a first direction being a direction from the base plate toward the ceramic dielectric substrate,
a second direction being a direction substantially orthogonal to the first direction,
the ceramic porous part including
a porous portion that is gas-permeable, and
a dense portion that is denser than the porous portion,
the dense portion covering an outer circumference of the porous portion,
at least a part of the dense portion including a first protruding part protruding toward the third hole part along the first direction from the exposed surface.
2. The chuck according to claim 1 , wherein
a length from the exposed surface along the first direction of the first protruding part is substantially equal to a length along the first direction of the bonding part.
3. The chuck according to claim 1 , wherein
the counterbore part is located in the first hole part.
4. The chuck according to claim 3 , wherein
the first hole part includes:
a first part open at the first major surface side;
a second part open at the second major surface side, and
a middle part located between the first part and the second part,
the counterbore part is located in the second part,
a length of the middle part along the second direction is greater than a length of the first part along the second direction,
the ceramic porous part includes a surface at a side opposite to the exposed surface, and
the surface is exposed in the middle part.
5. The chuck according to claim 4 , wherein
the dense portion further includes a second protruding part protruding toward the first part along the first direction from the surface.
6. An electrostatic chuck, comprising:
a ceramic dielectric substrate including
a first major surface on which an object of clamping is placed, and
a second major surface at a side opposite to the first major surface;
a base plate supporting the ceramic dielectric substrate, the base plate including
an upper surface at the ceramic dielectric substrate side, and
a lower surface at a side opposite to the upper surface;
a bonding part located between the ceramic dielectric substrate and the base plate;
a gas inlet path extending through the ceramic dielectric substrate, the base plate, and the bonding part, the gas inlet path including
a first hole part positioned at the ceramic dielectric substrate,
a second hole part positioned at the base plate, and
a third hole part positioned at the bonding part;
a counterbore part located in the second hole part; and
a ceramic porous part located in the counterbore part,
the ceramic porous part including an exposed surface exposed in the third hole part,
a first direction being a direction from the base plate toward the ceramic dielectric substrate,
a second direction being a direction substantially orthogonal to the first direction,
the ceramic porous part including
a porous portion that is gas-permeable, and
a dense portion that is denser than the porous portion,
the dense portion covering an outer circumference of the porous portion,
at least a part of the dense portion including a first protruding part protruding toward the third hole part along the first direction from the exposed surface,
the first hole part including a plurality of pores.
7. A processing apparatus, comprising:
the chuck according to claim 1 ; and
a supply part configured to supply a gas to the gas inlet path of the chuck.