Laminate, film forming method, and film forming apparatus
A laminate including: a crystal substrate; and a semiconductor film provided on a main surface of the crystal substrate, the semiconductor film being mainly made of an oxide semiconductor containing a dopant and having a corundum structure, where the oxide semiconductor has a silicon concentration of 5.0×10 20 cm −3 or less, and the semiconductor film has a resistivity of 150 mΩ·cm or less. This provides a laminate including a semiconductor having low resistance and a corundum structure suitable for use in semiconductor devices.
1. A film forming method comprising the steps of:
forming a mixture gas containing at least an atomized metal oxide precursor, a carrier gas, and a dopant;
conveying the mixture gas to a film-forming unit via a conveyor; and
forming a semiconductor film on a substrate by subjecting the mixture gas to a thermal reaction in the film-forming unit,
wherein:
at least a surface in the conveyor that comes into contact with the mixture gas is a non-silicone resin, and
the non-silicone resin contains any one or more of polyethylene, polypropylene, vinyl chloride, polystyrene, polyvinyl acetate, urethane resin, acrylonitrile-butadiene-styrene resin, acrylic resin, polyamide, polyimide, polyamide imide, nylon, acetal resin, polycarbonate, polyphenylene ether, polyester, polyethylene terephthalate, polybutylene terephthalate, polyolefin, polyphenylene sulfide, polysulfone, polyether sulfone, polyarylate, and polyether ether ketone.
2. A film forming apparatus comprising:
an atomizer configured to atomize a raw-material solution and generate a mist;
a carrier-gas supplier configured to supply a carrier gas to convey the mist;
a film-forming unit configured to form a film on a substrate by subjecting the mist to a thermal reaction; and
a conveyor that connects the atomizer to the film-forming unit, and through which the mist is conveyed by the carrier gas,
wherein:
the conveyor is a non-silicone resin at least on a surface that comes into contact with the mist, and
the non-silicone resin contains any one or more of polyethylene, polypropylene, vinyl chloride, polystyrene, polyvinyl acetate, urethane resin, acrylonitrile-butadiene-styrene resin, acrylic resin, polyamide, polyimide, polyamide imide, nylon, acetal resin, polycarbonate, polyphenylene ether, polyester, polyethylene terephthalate, polybutylene terephthalate, polyolefin, polyphenylene sulfide, polysulfone, polyether sulfone, polyarylate, and polyether ether ketone.