IP Library Granted Patent US 12,076,747
Granted Patent B2
US 12,076,747 · App. 18/056,345 · Granted Sep 3, 2024

Methods and systems for filling cracks in environmental barrier coatings and thermal barrier coatings and components formed thereby

Inventors: Mehrad Mehr (Morris Plains, NJ); John Downs (Morris Plains, NJ); Bahram Jadidian (Morris Plains, NJ)
Assignee: HONEYWELL INTERNATIONAL INC.
B05D5/005B05C3/18B05D3/007B05D3/0254
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Quick Facts
Patent No.
US 12,076,747
App. No.
18/056,345
Granted
Sep 3, 2024
Kind
B2
Abstract

Methods and systems are provided for filling cracks in an environmental barrier coating and/or a thermal barrier coating (EBC/TBC). The method comprises locating a component within an enclosure of an apparatus, the component including a substrate having the EBC/TBC thereon, wherein the EBC/TBC includes cracks extending from an exterior surface of the EBC/TBC toward the substrate, reducing pressure within the enclosure to a first pressure that is less than atmospheric pressure, applying a filler slurry to the exterior surface to cover the cracks while the EBC/TBC is exposed to the first pressure, increasing the enclosure to a second pressure that is greater than the first pressure, wherein the second pressure is sufficient to cause the filler slurry on the EBC/TBC to infiltrate into and fill the cracks, and sintering the filler slurry sufficient to cure the filler slurry within the cracks.

Claims (30)

1. A method comprising:

locating a component within an enclosure of an apparatus, the component including a substrate and an environmental barrier coating and/or a thermal barrier coating (EBC/TBC) on the substrate, wherein the EBC/TBC includes mud cracks extending from an exterior surface of the EBC/TBC toward the substrate, wherein the mud cracks have a depth of between 50 micrometers and 3 millimeters and a width of between 50 micrometers and 3 millimeters;

reducing pressure within the enclosure to a first pressure that is less than atmospheric pressure;

applying a filler slurry to the exterior surface of the EBC/TBC such that the mud cracks are covered with the filler slurry while the component is within the enclosure and the EBC/TBC is exposed to the first pressure;

increasing pressure within the enclosure to a second pressure that is greater than the first pressure, wherein the second pressure is sufficient to cause the filler slurry on the EBC/TBC to infiltrate into and fill the mud cracks; and

sintering the filler slurry sufficient to cure the filler slurry within the mud cracks.

2. The method of claim 1 , further comprising:

producing the EBC/TBC on the substrate of the component from an EBC/TBC slurry; and

producing the filler slurry by diluting the EBC/TBC slurry with a dilutant.

3. The method of claim 2 , wherein the filler slurry is produced by diluting the EBC/TBC slurry with the dilutant sufficient to reduce a solid loading of the EBC/TBC slurry by between 1 to 5 wt. %.

4. The method of claim 1 , wherein applying the filler slurry to the exterior surface of the EBC/TBC includes immersing the EBC/TBC in a reservoir of the filler slurry while the EBC/TBC is exposed to the first pressure.

5. The method of claim 1 , wherein applying the filler slurry to the exterior surface of the EBC/TBC includes pouring the filler slurry onto the EBC/TBC while the EBC/TBC is exposed to the first pressure.

6. The method of claim 1 , wherein applying the filler slurry to the exterior surface of the EBC/TBC includes applying the first pressure at a first end of the enclosure and introducing the filler slurry at a second end of the enclosure such that the filler slurry flows over the exterior surface of the EBC/TBC in a direction from the second end of the enclosure toward the first end of the enclosure.

7. The method of claim 1 , wherein the first pressure is 1333 Pa or less.

8. The method of claim 1 , wherein the second pressure is atmospheric pressure.

9. The method of claim 1 , wherein the substrate comprises silicon nitride and the EBC/TBC comprises a rare earth disilicate.

10. The method of claim 1 , wherein the component is configured to be installed in a turbine engine.

11. A component formed by a method comprising:

locating the component within an enclosure of an apparatus, the component including a substrate and an environmental barrier coating and/or a thermal barrier coating (EBC/TBC) on the substrate, wherein the EBC/TBC includes mud cracks extending from an exterior surface of the EBC/TBC toward the substrate, wherein the mud cracks have a depth of between 50 micrometers and 3 millimeters and a width of between 50 micrometers and 3 millimeters;

reducing pressure within the enclosure to a first pressure that is less than atmospheric pressure;

applying a filler slurry to the exterior surface of the EBC/TBC such that the mud cracks are covered with the filler slurry while the component is within the enclosure and the EBC/TBC is exposed to the first pressure;

increasing pressure within the enclosure to a second pressure that is greater than the first pressure, wherein the second pressure is sufficient to cause the filler slurry on the EBC/TBC to infiltrate into and fill the mud cracks; and

sintering the filler slurry sufficient to cure the filler slurry within the mud cracks.

12. The component of claim 11 , wherein the method further comprises:

producing the EBC/TBC on the substrate of the component from an EBC/TBC slurry; and

producing the filler slurry by diluting the EBC/TBC slurry.

13. The component of claim 11 , wherein the substrate comprises silicon nitride and the EBC/TBC comprises a rare earth disilicate.

14. The component of claim 11 , wherein the component is configured to be installed in a turbine engine.

15. The component of claim 11 , wherein the component does not include any cavities remaining from the mud cracks that have a dimension greater than 10 μm.

16. The method of claim 1 , further comprising forming the EBC/TBC on the substrate of the component using a direct sintering process that produces a pattern of the mud cracks in the EBC/TBC.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2022
From: MEHR, MEHRAD; DOWNS, JOHN; JADIDIAN, BAHRAM
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 061809/0007 →
Continuity (1)
Related Publication 20240165661A1 · May 23, 2024