Inductive sensor having one or more modular circuit boards
An inductive sensor includes a first circuit board having a sensor element configurable in a plurality of different coil configurations. The sensor element includes a transmit coil and a plurality of receive coils. The first circuit board includes interconnect points positioned at a same location on the first circuit board for each of the plurality of different coil configurations. The inductive sensor includes a second circuit board spaced apart from the first circuit board along the axial direction. The second circuit board includes processing circuitry associated with the sensor element and configurable in a plurality of different configurations. The second circuit board includes interconnect points positioned at a same location on the second circuit board for each of the configurations of the processing circuitry. Furthermore, each interconnect point on the second circuit board is aligned with a corresponding interconnect point on the first circuit board along circumferential and radial directions.
1. An inductive sensor defining an axial direction, a circumferential direction, and a radial direction, the inductive sensor comprising:
a first circuit board comprising:
a sensor element having a first coil configuration, the sensor element comprising a transmit coil and a plurality of receive coils, the transmit coil configured to induce an electrical current in the plurality of receive coils via a target; and
a plurality of interconnect points positioned on the first circuit board for the first coil configuration; and
a second circuit board spaced apart from the first circuit board along the axial direction, the second circuit board comprising:
processing circuitry associated with the sensor element, the processing circuitry having a first configuration; and
a plurality of interconnect points positioned on the second circuit board for the first configuration of the processing circuitry, each of the plurality of interconnect points on the second circuit board aligned with a corresponding interconnect point of the plurality of interconnect points on the first circuit board along the circumferential direction and the radial direction;
a housing defining a cavity in which the first circuit board and the second circuit board are disposed,
an interconnect assembly disposed within the cavity of the housing such that the interconnect assembly is positioned between the first circuit board and the second circuit board along the axial direction, the interconnect assembly comprising a plurality of conductive pins, each of the plurality of conductive pins coupled between a corresponding interconnect point on the first circuit board and a corresponding interconnect point on the second circuit board, wherein the interconnect assembly further comprises a spacer defining a plurality of apertures, each of the plurality of apertures aligned with a corresponding interconnect point of the interconnect points on the first circuit board and the second circuit along the radial direction and the circumferential direction, each of the plurality of apertures configured to accommodate a corresponding conductive pin of the plurality of conductive pins such that the corresponding conductive pin extends therethrough, the spacer further comprises:
a first post extending in a first direction along the axial direction, the first post extending through an aperture defined by the first circuit board; and
a second post extending in a second direction along the axial direction, the second post extending through an aperture defined by the second circuit board.
2. The inductive sensor of claim 1 , wherein the plurality of interconnect points of the first circuit board and the second circuit board comprise:
a first group of interconnect points positioned at a first location;
a second group of interconnect points positioned at a second location that is spaced apart from the first location along the circumferential direction by about 90 degrees;
a third group of interconnect points positioned at a third location that is spaced apart from the first location along the circumferential direction by about 180 degrees; and
a fourth group of interconnect points positioned at a fourth location that is spaced apart from the first location along the circumferential direction by about 270 degrees.
3. The inductive sensor of claim 2 , wherein at least one of the first group of interconnect points, the second group of interconnect points, the third group of interconnect points, and the fourth group of interconnect points include four interconnect points arranged in a diamond configuration.
4. The inductive sensor of claim 1 , wherein:
a first end of each of the plurality of conductive pins is connected to the corresponding interconnect point on the first circuit board; and
a second end of each of the plurality of conductive pins is connected to the corresponding interconnect point on the second circuit board.
5. The inductive sensor of claim 1 , wherein the plurality of apertures defined by the spacer comprise:
a first group of apertures positioned at a first location;
a second group of apertures positioned at a second location that is spaced apart from the first location along the circumferential direction by about 90 degrees;
a third group of apertures positioned at a third location that is spaced apart from the first location along the circumferential direction by about 180 degrees; and
a fourth group of apertures positioned at a fourth location that is spaced apart from the first location along the circumferential direction by about 270 degrees.
6. The inductive sensor of claim 1 , wherein the processing circuitry comprises at least one of a motion sensor and a temperature sensor.
7. The inductive sensor of claim 1 , wherein the processing circuitry comprises one or more processors configured to process an output signal obtained from one or more of the plurality of receive coils.