Semiconductor package including a molding layer

1. A semiconductor package, comprising:

a first semiconductor chip including a mount region and an overhang region;

a substrate disposed on a bottom surface at the mount region of the first semiconductor chip;

a passivation pattern disposed on a bottom surface of the substrate; and

a molding layer disposed on the substrate,

wherein the molding layer includes:

a first molding pattern disposed on a bottom surface at the overhang region of the first semiconductor chip and at least partially covering a sidewall of the substrate; and

a second molding pattern disposed directly on the first molding pattern and at least partially covering a sidewall of the first semiconductor chip, and

wherein the passivation pattern extends onto a bottom surface of the first molding pattern.

2. The semiconductor package of claim 1 , wherein a bottom surface of the first molding pattern is coplanar with a bottom surface of the substrate.

3. The semiconductor package of claim 1 , further comprising an under-fill layer disposed between the substrate and the first semiconductor chip,

wherein the under-fill layer is further disposed between the first molding pattern and the first semiconductor chip.

4. The semiconductor package of claim 1 , further comprising a plurality of upper semiconductor chips stacked on the first semiconductor chip,

wherein the first semiconductor chip includes a plurality of through vias defined therein, and

wherein bottom surfaces of the through vias are at a level substantially the same as a level of a bottom surface of the passivation pattern.

5. The semiconductor package of claim 1 , wherein

the first molding pattern includes a first dielectric polymer and a plurality of first fillers,

the second molding pattern includes a second dielectric polymer and a plurality of second fillers, and

diameters of each of the second fillers are less than diameters of each of the first fillers.

6. The semiconductor package of claim 1 , further comprising a second semiconductor chip disposed on a top surface of the substrate and located side by side with the first semiconductor chip,

wherein, the second semiconductor chip at least partially overlaps the substrate.

7. The semiconductor package of claim 6 , wherein

the first semiconductor chip includes a plurality of pads disposed on a bottom surface of the first semiconductor chip, and

the number of a plurality of chip pads of the second semiconductor chip is equal to or greater than twice the number of the pads of the first semiconductor chip.

8. The semiconductor package of claim 6 , further comprising:

a plurality of first bumps disposed between the substrate and the first semiconductor chip;

a plurality of second bumps disposed between the substrate and the second semiconductor chip; and

an under-fill layer disposed between the substrate and the second semiconductor chip,

wherein the under-fill layer extends onto the substrate and the bottom surface at the mount region of the first semiconductor chip, and at least partially covers the first bumps and the second bumps.

9. The semiconductor package of claim 1 , wherein the substrate includes a semiconductor die,

wherein a coefficient of thermal expansion of the first molding pattern is greater than a coefficient of thermal expansion of the semiconductor die.

10. A semiconductor package, comprising:

an interposer substrate;

a first semiconductor chip disposed on top of the interposer substrate;

a molding layer covering a sidewall of the interposer substrate;

a package substrate disposed on the bottom surface of the interposer substrate; and

a plurality of coupling solder elements disposed between the package substrate and the interposer substrate,

wherein, the first semiconductor chip includes an overhang region and a mount region,

wherein the molding layer is disposed on a bottom surface at the overhang region of the first semiconductor chip,

wherein a bottom surface of the molding layer is coplanar with a bottom surface of the interposer substrate,

wherein the interposer substrate includes a semiconductor die,

wherein a coefficient of thermal expansion of the package substrate is greater than a coefficient of thermal expansion of the semiconductor die, and

wherein a coefficient of thermal expansion of the molding layer is greater than the coefficient of thermal expansion of the semiconductor die.

11. The semiconductor package of claim 10 , further comprising an under-fill layer disposed between the interposer substrate and the first semiconductor chip,

wherein, an end of the under-fill layer is spaced apart from the interposer substrate.

12. The semiconductor package of claim 11 , further comprising:

an upper semiconductor chip disposed on the first semiconductor chip; and

a second semiconductor chip disposed on the interposer substrate and located at a side of the first semiconductor chip,

wherein the under-fill layer extends between the interposer substrate and the second semiconductor chip.

13. The semiconductor package of claim 10 , further comprising a lower under-fill layer disposed between the package substrate and the interposer substrate,

wherein a coefficient of thermal expansion of the lower under-fill layer is greater than the coefficient of thermal expansion of the semiconductor die.

14. A semiconductor package, comprising:

an interposer substrate;

a plurality of solder terminals disposed on a bottom surface of the interposer substrate;

a chip stack disposed on a top surface of the interposer substrate, the chip stack including a first lower semiconductor chip and a plurality of first upper semiconductor chips disposed on the first lower semiconductor chip;

a plurality of first bumps disposed between the interposer substrate and the first lower semiconductor chip; and

a molding layer disposed on the interposer substrate,

wherein the first lower semiconductor chip includes a plurality of through electrodes disposed therethrough,

wherein the interposer substrate includes a semiconductor die, a plurality of through vias, a plurality of wiring structures, and a plurality of interposer pads,

wherein, the first lower semiconductor chip includes:

a mount region disposed on the interposer substrate; and

an overhang region spaced apart from the interposer substrate,

wherein the molding layer includes:

a first molding pattern disposed on a bottom surface at the overhang region of the first lower semiconductor chip and covering a sidewall of the interposer substrate; and

a second molding pattern disposed on the first molding pattern and covering a sidewall of the first lower semiconductor chip and sidewalls of the first upper semiconductor chips, and

wherein a coefficient of thermal expansion of the first molding pattern is greater than a coefficient of thermal expansion of the semiconductor die.

15. The semiconductor package of claim 14 , further comprising:

a second semiconductor chip disposed on the top surface of the interposer substrate;

a plurality of second bumps disposed between the interposer substrate and the second semiconductor chip; and

an under-fill layer disposed between the interposer substrate and the first lower semiconductor chip and further disposed between the interposer substrate and the second semiconductor chip,

wherein the chip stack includes a first chip stack and a second chip stack that are spaced apart from each other,

wherein, the second semiconductor chip is disposed between the first chip stack and the second chip stack, and

wherein the under-fill layer extends between a top surface of the first molding pattern and the bottom surface at the overhang region of the first lower semiconductor chip.

16. The semiconductor package of claim 14 , further comprising:

a first passivation pattern covering the bottom surface of the interposer substrate and a bottom surface of the first molding pattern; and

a second passivation pattern disposed on a bottom surface of the first passivation pattern,

wherein the second passivation pattern includes a material different from a material of the first passivation pattern.

17. The semiconductor package of claim 14 , further comprising:

a package substrate disposed on the bottom surface of the interposer substrate;

a plurality of coupling solder elements disposed between the package substrate and the interposer substrate;

a lower under-fill layer disposed between the package substrate and the interposer substrate and covering sidewalls of the solder terminals; and

a stiffener disposed on an edge region of the package substrate and laterally spaced apart from the molding layer.

18. The semiconductor package of claim 14 , wherein a bottom surface of the first molding pattern is at a level substantially the same as a level of a bottom surface of the semiconductor die.