IP Library › Granted Patent US 12,081,115
Granted Patent B2
US 12,081,115 · App. 17/796,269 · Granted Sep 3, 2024

Semiconductor drive device, semiconductor device, and power conversion device

Inventors: Yohei Mitsui (Tokyo, JP); Yasutaka Imamura (Tokyo, JP); Junichi Nakashima (Tokyo, JP)
Assignee: MITSUBISHI ELECTRIC CORPORATION
H02M1/327G01K7/245H02H5/04H03K2017/0806
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Quick Facts
Patent No.
US 12,081,115
App. No.
17/796,269
Granted
Sep 3, 2024
Kind
B2
Abstract

A semiconductor drive device includes a drive circuit that drives a semiconductor switching element, a passive element connected to a gate of the semiconductor switching element to prevent a gate current of the semiconductor switching element, a switching element connected in series to the passive element, a control circuit that controls the switching element, and a temperature detection circuit that detects a temperature of the semiconductor switching element. The control circuit controls the switching element such that when the temperature detected by the temperature detection circuit is high, the gate current is prevented more than when the temperature is low.

Claims (78)

1. A semiconductor drive device comprising:

a drive circuit to drive a semiconductor switching element;

a passive element connected to a gate of the semiconductor switching element to prevent a gate current of the semiconductor switching element;

a switching element connected in series to the passive element;

a control circuit to control the switching element; and

a temperature detection circuit to detect a temperature of the semiconductor switching element,

wherein the control circuit controls the switching element such that when the temperature detected by the temperature detection circuit is high, the gate current is prevented more than when the temperature is low.

2. The semiconductor drive device according to claim 1 , wherein the passive element is a capacitor connected between the gate and a source of the semiconductor switching element,

the switching element is connected in series to the passive element between the gate and the source of the semiconductor switching element, and

the control circuit controls the switching element such that when the temperature detected by the temperature detection circuit is high, resistance of the switching element becomes lower than when the temperature is low.

3. The semiconductor drive device according to claim 1 , further comprising a gate resistor connected between the gate of the semiconductor switching element and the drive circuit,

the passive element is a resistance element,

a circuit including the resistance element and the switching element is connected in parallel to the gate resistor, and

the control circuit controls the switching element such that when the temperature detected by the temperature detection circuit is high, resistance of the switching element becomes higher than when the temperature is low.

4. The semiconductor drive device according to claim 1 , wherein the control circuit includes a signal amplifier circuit that amplifies an output of the temperature detection circuit.

5. The semiconductor drive device according to claim 4 , wherein the temperature detection circuit includes:

a thermistor;

a voltage dividing resistor connected in series to the thermistor; and

a voltage source that applies a constant voltage to a circuit including the thermistor and the voltage dividing resistor, and

the signal amplifier circuit includes:

a reference voltage source that outputs a reference voltage; and

a comparator that outputs a signal according to a comparison result between a voltage across the voltage dividing resistor and the reference voltage to a gate of the switching element.

6. The semiconductor drive device according to claim 4 , wherein the temperature detection circuit includes:

a thermistor;

a voltage dividing resistor connected in series to the thermistor; and

a voltage source that applies a constant voltage to a circuit including the thermistor and the voltage dividing resistor,

the signal amplifier circuit includes a differential amplifier circuit that outputs a signal corresponding to a voltage across the voltage dividing resistor to a gate of the switching element, and

the switching element is configured such that a resistance value changes according to magnitude of the signal from the differential amplifier circuit.

7. A power conversion device comprising:

a main conversion circuit including a semiconductor switching element and the semiconductor drive device according to claim 1 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

8. The semiconductor drive device according to claim 2 , wherein the control circuit includes a signal amplifier circuit that amplifies an output of the temperature detection circuit.

9. The semiconductor drive device according to claim 3 , wherein the control circuit includes a signal amplifier circuit that amplifies an output of the temperature detection circuit.

10. A power conversion device comprising:

a main conversion circuit including a semiconductor switching element and the semiconductor drive device according to claim 2 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

11. A power conversion device comprising:

a main conversion circuit including a semiconductor switching element and the semiconductor drive device according to claim 3 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

12. A power conversion device comprising:

a main conversion circuit including a semiconductor switching element and the semiconductor drive device according to claim 4 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

13. A power conversion device comprising:

a main conversion circuit including a semiconductor switching element and the semiconductor drive device according to claim 5 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

14. A power conversion device comprising:

a main conversion circuit including a semiconductor switching element and the semiconductor drive device according to claim 6 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

15. A power conversion device comprising:

a main conversion circuit including a semiconductor switching element and the semiconductor drive device according to claim 8 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

16. A power conversion device comprising:

a main conversion circuit including a semiconductor switching element and the semiconductor drive device according to claim 9 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

17. A semiconductor device comprising:

a plurality of semiconductor switching elements connected in parallel to each other;

a plurality of semiconductor drive devices provided corresponding to the plurality of semiconductor switching elements;

a drive circuit to drive the plurality of semiconductor switching elements,

each of the plurality of semiconductor drive devices including

a passive element connected to a gate of the corresponding semiconductor switching element to prevent a gate current of the corresponding semiconductor switching element,

a switching element connected in series to the passive element, and

a temperature detection circuit to detect a temperature of the corresponding semiconductor switching element; and

a control circuit to control the switching element in each of the plurality of semiconductor drive devices, wherein

the control circuit controls the switching element in each of the plurality of semiconductor drive devices such that when the temperature detected by the temperature detection circuit is high, the gate current is prevented more than when the temperature is low in each of the plurality of semiconductor drive devices.

18. A power conversion device comprising:

a main conversion circuit including the semiconductor device according to claim 17 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

19. A semiconductor device comprising:

a plurality of semiconductor switching elements connected in parallel to each other;

a plurality of temperature detection circuits provided corresponding to the plurality of semiconductor switching elements, each of the plurality of temperature detection circuits detecting a temperature of the corresponding semiconductor switching element;

a drive circuit to drive the plurality of semiconductor switching elements;

a passive element connected to a gate of each of the plurality of semiconductor switching elements to prevent a gate current of each of the plurality of semiconductor switching elements;

a switching element connected in series to the passive element; and

a control circuit to control the switching element,

wherein the control circuit controls the switching element in each of the plurality of semiconductor switching elements such that when a temperature detected by the corresponding temperature detection circuit is high, the gate current is prevented more than when the temperature is low.

20. A power conversion device comprising:

a main conversion circuit including the semiconductor device according to claim 19 ; and

a control device to generate a control signal controlling the main conversion circuit and output to the main conversion circuit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2022
From: MITSUI, YOHEI; IMAMURA, YASUTAKA; NAKASHIMA, JUNICHI
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 060668/0506 →
Continuity (1)
Related Publication 20230122671A1 · Apr 20, 2023
Cited By (1)
US 12,706,600