Method for manufacturing conductive paste and method for manufacturing multilayer ceramic electronic component
A method for manufacturing a conductive paste includes preparing a first solution including a metal particle and a first solvent, preparing a second solvent, preparing a surfactant including a core particle and an organic material disposed on a surface of the core particle, and mixing the first solution, the second solvent, and the surfactant to form a mixed solution.
1. A method for manufacturing a conductive paste, comprising:
preparing a first solution including a metal particle and a first solvent;
preparing a second solvent;
preparing a surfactant including a core particle and an organic material bonded to a surface of the core particle; and
mixing the first solution, the second solvent, and the surfactant to form a mixed solution,
wherein one solvent among the first solvent and the second solvent is a hydrophobic solvent, and the other solvent is a hydrophilic solvent.
2. The method of claim 1 , further comprising:
emulsifying the mixed solution by sonication.
3. The method of claim 1 , wherein the first solvent is the hydrophobic solvent, and the second solvent is the hydrophilic solvent.
4. The method of claim 1 , wherein a ratio of a volume of the first solution to a volume of the second solvent is 1 or less.
5. The method of claim 1 , wherein the core particle includes at least one of a ceramic particle, a polymer particle, a semiconductor particle, and a metal particle.
6. The method of claim 5 , wherein the ceramic particle of the surfactant includes barium titanate (BaTiO 3 ).
7. The method of claim 5 , wherein the metal particle of the surfactant includes at least one of gold (Au), silver (Ag), and platinum (Pt).
8. The method of claim 1 , wherein the organic material includes at least one of a hydrophilic organic material, a hydrophobic organic material, and an amphiphilic organic material.
9. The method of claim 1 , wherein an average diameter of the core particle is 5 to 100 nm.
10. The method of claim 1 , wherein the hydrophilic solvent is water.
11. The method of claim 1 , wherein the conductive paste is in an oil in water emulsion state.
12. A method for manufacturing a multilayer ceramic electronic component, comprising:
preparing a ceramic green sheet;
performing the method of claim 1 to manufacture the conductive paste;
applying the conductive paste on the ceramic green sheet;
forming a ceramic laminate by stacking the ceramic green sheet to which the conductive paste is applied; and
sintering the ceramic laminate.
13. The method of claim 12 , wherein the first solvent is the hydrophobic solvent, and the second solvent is the hydrophilic solvent.
14. The method of claim 12 , wherein the conductive paste is in an oil in water emulsion state.
15. The method of claim 12 , wherein the core particle includes at least one of a ceramic particle, a polymer particle, a semiconductor particle, and a metal particle.
16. The method of claim 15 , wherein the ceramic particle of the surfactant includes barium titanate (BaTiO 3 ).
17. The method of claim 15 , wherein the metal particle of the surfactant includes at least one of gold (Au), silver (Ag), and platinum (Pt).
18. The method of claim 12 , wherein the organic material includes at least one of a hydrophilic organic material, a hydrophobic organic material, and an amphiphilic organic material.
19. A method for manufacturing a conductive paste, comprising:
preparing a first solution including a metal particle and a first solvent;
preparing a second solvent;
preparing a surfactant including a core particle and an organic material bonded to a surface of the core particle; and
mixing the first solution, the second solvent, and the surfactant to form a mixed solution; and
emulsifying the mixed solution by sonication.
20. The method of claim 19 , wherein the first solvent is the hydrophobic solvent, and the second solvent is the hydrophilic solvent.
21. The method of claim 19 , wherein a ratio of a volume of the first solution to a volume of the second solvent is 1 or less.
22. The method of claim 19 , wherein the core particle includes at least one of a ceramic particle, a polymer particle, a semiconductor particle, and a metal particle.
23. The method of claim 19 , wherein the organic material includes at least one of a hydrophilic organic material, a hydrophobic organic material, and an amphiphilic organic material.
24. The method of claim 22 , wherein the ceramic particle of the surfactant includes barium titanate (BaTiO 3 ).
25. The method of claim 22 , wherein the metal particle of the surfactant includes at least one of gold (Au), silver (Ag), and platinum (Pt).
26. The method of claim 25 , wherein an average diameter of the core particle is 5 to 100 nm.
27. A method for manufacturing a conductive paste, comprising:
preparing a first solution including a metal particle and a first solvent;
preparing a second solvent;
preparing a surfactant including a core particle and an organic material bonded to a surface of the core particle; and
mixing the first solution, the second solvent, and the surfactant to form a mixed solution,
wherein the first solvent is the hydrophobic solvent, and the second solvent is the hydrophilic solvent,
wherein a ratio of a volume of the first solution to a volume of the second solvent is 1 or less, and
wherein the core particle includes at least one of gold (Au), silver (Ag), and platinum (Pt).
28. The method of claim 27 , wherein the organic material includes at least one of a hydrophilic organic material, a hydrophobic organic material, and an amphiphilic organic material.