Wafer edge ring lifting solution
Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.
1. A process kit for processing a substrate, the process kit comprising:
a support ring comprising an upper surface having a radially inner edge disposed at a first height and a radially outward edge disposed at a second height less than the first height, the radially inner edge having a greater thickness than the radially outward edge;
an edge ring disposed directly on the radially outward edge of the support ring, an inner surface of the edge ring interfaced with the radially inner edge of the support ring;
a cover ring disposed radially outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring; and
one or more push pins disposed radially inward of an inner diameter of the cover ring, the one or more push pins being operable to elevate the edge ring, wherein movement in a radial direction of the support ring is constrained by the one or more push pins.
2. The process kit of claim 1 , wherein the cover ring is fabricated from quartz.
3. The process kit of claim 1 , further comprising:
an actuating mechanism including the one or more push pins configured to actuate the edge ring such that a distance between a bottom surface of the edge ring and the radially outward edge of the support ring is varied.
4. The process kit of claim 1 , wherein the one or more push pins are fabricated from quartz.
5. The process kit of claim 1 , further comprising:
an annular sleeve disposed radially outward of the support ring and below the edge ring.
6. The process kit of claim 5 , wherein a gap is formed between the support ring and the annular sleeve.
7. An apparatus for processing a substrate, the apparatus comprising:
an electrostatic chuck having a first portion and a second portion, the first portion configured to support the substrate;
a process kit configured to interface with the second portion of the electrostatic chuck, the process kit comprising:
a support ring comprising an upper surface having a radially inner edge disposed at a first height and a radially outward edge disposed at a second height less than the first height, the radially inner edge having a greater thickness than the radially outward edge;
an edge ring disposed directly on the support ring, an inner surface of the edge ring interfaced with the radially inner edge of the support ring;
a cover ring disposed radially outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring; and
one or more push pins disposed radially inward of an inner diameter of the cover ring, the one or more push pins being operable to elevate the edge ring, wherein movement in a radial direction of the support ring is constrained by the one or more push pins.
8. The apparatus of claim 7 , further comprising:
an annular sleeve disposed below the edge ring and circumscribing at least the support ring, wherein a gap is formed between the support ring and the annular sleeve.
9. The apparatus of claim 7 , wherein the one or more push pins are interfaced with a bottom surface of the edge ring, the one or more push pins configured to actuate the edge ring such that a distance between the bottom surface of the edge ring and the radially outward edge of the support ring is varied.
10. The apparatus of claim 7 , wherein a bottom surface of the edge ring is disposed above a bottom surface of both the radially inner edge and the radially outward edge of the support ring when the edge ring is in a lowermost position.